JPS6390378A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPS6390378A JPS6390378A JP61234621A JP23462186A JPS6390378A JP S6390378 A JPS6390378 A JP S6390378A JP 61234621 A JP61234621 A JP 61234621A JP 23462186 A JP23462186 A JP 23462186A JP S6390378 A JPS6390378 A JP S6390378A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- processing
- workpiece
- laser beam
- machined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 47
- 230000003287 optical effect Effects 0.000 claims abstract description 28
- 238000001514 detection method Methods 0.000 claims abstract description 14
- 238000003754 machining Methods 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 229920003023 plastic Polymers 0.000 abstract description 4
- 239000004033 plastic Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 7
- 238000007639 printing Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- -1 aluminum Chemical class 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はレーザ加工装置に係り、特に配電盤、制御盤等
に使用される銘板の印字、切断加工に好適な材質検知部
及びＹ Ａ Ｇ 、 ＣＯｚレーザの光路切替選択可能
な加工光学装置を備えたレーザ加工装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a laser processing device, and in particular to a material detection unit and a YAG, The present invention relates to a laser processing device equipped with a processing optical device capable of selectively switching the optical path of a COz laser.
従来のレーザ加工装置は装置１台につき加工用レーザ発
振器１台が取付けられていた。レーザ発振器を２台有す
る装置として特開昭５８−１６７８５号。Conventional laser processing equipment has one processing laser oscillator attached to each equipment. JP-A-58-16785 is a device having two laser oscillators.
特開昭５９−４５０９１号が挙げられるがこれらは一方
のレーザ発振器を加工部位置確認用に使用しており加工
用レーザ発振器が一種に限定されている為。Japanese Patent Application Laid-Open No. 59-45091 is mentioned, but these use one laser oscillator for confirming the position of the processing part, and the number of laser oscillators for processing is limited to one type.
各種の加工材々質に対応することができなかった。It was not possible to handle various types of processed materials.
又、特開昭５９−１７８１９２号公報に記載のように被
加工材表面に所定の加工液を供給する装置を設け、加工
面に供給された加工液の８０％以上を蒸発させつつレー
ザ加工することにより、被加材々質に左右されずに加工
を可能にする方式がある。しかし本方式では加工液が加
工材を侵す可能性があり、常に加工液を必要とし加工性
面の配慮がされていなかった。Further, as described in Japanese Patent Application Laid-open No. 59-178192, a device is provided to supply a predetermined processing liquid to the surface of the workpiece, and laser processing is performed while evaporating 80% or more of the processing liquid supplied to the processing surface. There is a method that enables processing without being influenced by the quality of the workpiece material. However, with this method, there is a possibility that the machining fluid may attack the workpiece, and machining fluid is always required, and no consideration has been given to workability.
上記従来技術は加工材々質に適したレーザ光の選定をす
るといった配慮がされておらず、単にレーザの高温加工
面のみを重視し、レーザ光波長に起因する加工材のレー
ザ吸収特性面からの加工性評価がなされていない、従っ
て各種類の加工材を加工する場合、一部のレーザ光は加
工を行なう為の熱エネルギーに成るが大部分のレーザ光
は加工材面での反射、又は加工材を透過し加工に寄与し
ない為、エネルギーの浪費が多いという間頭があった。The above conventional technology does not consider selecting a laser beam suitable for the material being processed, and only focuses on the high-temperature processing surface of the laser. Therefore, when processing various types of workpieces, some laser light becomes thermal energy for processing, but most of the laser light is reflected from the workpiece surface or There was a concern that there was a lot of energy wasted because it penetrated the material to be processed and did not contribute to the processing.
本発明の目的はこれら問題に対し加工材々質に最適なレ
ーザ光を選択し少ないエネルギー人力により各種類の加
工材を効率良く加工することにある。The purpose of the present invention is to solve these problems by selecting the most suitable laser beam for each material to be processed, and to efficiently process various types of materials with less energy and human power.
上記目的は、考えられる加工材に対し吸収性の高いレー
ザ光を作り出すレーザ発振器を複数台、−台の加工装置
に組み込み材質検知部にて加工材の材質を検出し、それ
より各材質に対応した信号が出されその信号により加工
光学装置のレーザ光切変替ミラーの位置決めを行ない所
望のレーザ光が加工材に照射されることにより、達成さ
れる。The above purpose is to install multiple laser oscillators that produce highly absorbent laser beams for possible workpieces into two processing machines, detect the material of the workpiece with a material detection unit, and then respond to each material. This is accomplished by outputting a signal, which positions the laser beam switching mirror of the processing optical device, and irradiating the workpiece with the desired laser beam.
各発振器は加工材に対して吸収性が良いレーザ光を作り
出す種類のものであり１例えば銅、鉄。Each oscillator is of a type that produces laser light that is highly absorbent to the workpiece, such as copper or iron.
アルミニウムなどの金属に対してはＹＡＧレーザ、アク
リル、塩化ビニール、ポリエチレンなどの高分子材料、
セラミック、ガラス等に対してはＣＯｚレーザを用いる
。異種のレーザ光に対し共通の加工光学装置を有し、材
質検知部にて上記材質を検知しその信号を加工光学装置
に入力すると、レーザ光切替ミラーが動作し加工材々質
に適合したレーザ光を加工材へと導びく、これよよって
、加工効率の高いレーザ加工を行なうことができると共
に、−台の加工装置にて多種材質の加工材を加工するこ
とができる。又１作業者は加工材々質を意識する必要が
無く作業効率の向上も図ることができる。For metals such as aluminum, YAG laser, polymer materials such as acrylic, vinyl chloride, polyethylene, etc.
A COz laser is used for ceramics, glass, etc. It has a common processing optical device for different types of laser beams, and when the material detection unit detects the above-mentioned material and inputs the signal to the processing optical device, the laser beam switching mirror operates to select a laser suitable for the material to be processed. By guiding the light to the workpiece, it is possible to perform laser processing with high processing efficiency, and workpieces made of various materials can be processed with a single processing device. In addition, one worker does not have to be conscious of the quality of the materials to be processed, and work efficiency can be improved.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
実施例はステンレス、アクリルなどを用いた制御盤、配
電盤用の銘板を製作する装置であり、加工材の印字、切
断を行なう、装置はレーザ光を発射するＣ Ｏｚレーザ
発振器１、ＹＡＧレーザ発振器２、レーザ光を加工材に
導びくレーザ切替部７、レーザ光路切替部１ｏ、スキャ
ナー制御部１６などのミラー群、それら光学装置を制御
する加工光学装置制御部１５、及び加工材々質を検知し
加工光学装置制御部１５へ信号を送る加工材々質検知部
１４、加工材を所定の位置にセットする加工材搬送部１
８より構成される６次に本装置の動作を説明する。装置
外部より搬送されて来る加工材１７は先づ加工材々質検
知部１４にセットされる。この時加工材々質検知部１４
は、材質を検知し加工光学装置制御部１５へ信号を送り
次に制御部１５は加工材搬送部１８に加工材の搬送信号
を送り加工材は印字用集光レンズ１１の下にセットされ
る。The embodiment is a device for manufacturing nameplates for control panels and switchboards using stainless steel, acrylic, etc., and prints and cuts processed materials. , a group of mirrors including a laser switching unit 7 that guides the laser beam to the workpiece, a laser optical path switching unit 1o, a scanner control unit 16, a processing optical device control unit 15 that controls these optical devices, and a processing optical device control unit 15 that detects the properties of the workpiece. A workpiece material detection unit 14 that sends a signal to the processing optical device control unit 15, a workpiece transport unit 1 that sets the workpiece at a predetermined position.
The operation of this device will be explained below. The workpiece 17 conveyed from outside the apparatus is first set in the workpiece material detection section 14. At this time, the processing material quality detection unit 14
detects the material and sends a signal to the processing optical device control unit 15. Next, the control unit 15 sends a workpiece conveyance signal to the workpiece conveyance unit 18, and the workpiece is set under the printing condensing lens 11. .
加工材がアクリルなどのプラスチックの場合、加工光学
装置制御部１５はレーザ光切替部７をＣ，Ｏｚレーザ反
射位置にセット、レーザ光路切替部１０をレーザ光反射
射位置にセットしＣＯ２レ一ザ発振器１からレーザ光を
発射させる。レーザ光はＣＯｘレーザ用ビームユソメー
タ３．ＣＯ２レーザ用反射ミラー４、レーザ光切替部７
、Ｘ軸スキャナー８、Ｙ軸スキャナー９．レーザ光路切
替部１０、印字用集光レンズ１１を経由し、加工材１７
へ照射される。印字する為のレーザ光走査は、加工光学
装置制御部１５からの印字命令によりスキャナー制御部
１６がＸ＠スキャナー８、及びＹ軸スキャナー９を同時
に制御し反射ミラーを振らせることにより行なわれる。When the material to be processed is plastic such as acrylic, the processing optical device control unit 15 sets the laser beam switching unit 7 to the C, Oz laser reflection position, sets the laser beam path switching unit 10 to the laser beam reflection position, and then outputs the CO2 laser. A laser beam is emitted from an oscillator 1. The laser beam is supplied by a COx laser beam usometer 3. CO2 laser reflection mirror 4, laser beam switching unit 7
, X-axis scanner 8, Y-axis scanner 9. The processed material 17 passes through the laser optical path switching unit 10 and the printing condensing lens 11.
is irradiated to. Laser beam scanning for printing is performed by the scanner control section 16 simultaneously controlling the X@scanner 8 and the Y-axis scanner 9 and causing the reflection mirror to swing in response to a printing command from the processing optical device control section 15.
加工材を切断する場合は、印字動作と同様に加工材々質
の信号を加工材々質検知部１４より加工光学装置制御部
１５へ送り。When cutting a workpiece, a signal indicating the quality of the workpiece is sent from the workpiece material detection unit 14 to the processing optical device control unit 15 in the same way as in the printing operation.
次に制御部１５は加工材搬送部１８に加工材の搬送信号
を送り加工材を切断用集光レンズ１３の下のＸ−Ｙテー
ブル１９にセットする加工光学装置制御部１５はレーザ
光路切替部１０の反射ミラーを上方向に移動させレーザ
光を反射させないようにすると共にＸ軸スキャナー８．
Ｙ軸スキャナー９を固定位置にセットしＣＯｘ レーザ
発振器１よリレーザ光を発射させる。レーザ光は各反射
ミラーを経由し切断用集光レンズ１３にて集束はされ加
工材１７に照射される。レーザ光の照射位置は、固定で
あり、Ｘ−Ｙテーブル１９が加工光学装置制御部１５位
置決め信号により移動しかつアシストガスをアラストガ
スノズル２０より吹き付は加工材を所望の形状に切断す
る。加工材がステンレス、鉄、銅、アルミニウムなどの
金属の場合は、加工材々質検知部１４からの信号により
加工光学装置制御部１５がレーザ光切替部７を９０°回
転させＹＡＧレーザ反射位置にセットしＹＡＧレーザ発
振器２よりレーザ光を発射させる。レーザはＹＡＧレー
ザ用ビームユリメータ５、ＹＡＧレーザ用反射ミラー６
、レーザ光切替部７を経由しＣＣ）ｚ、’ＹＡＧレーザ
共通の加工光学系へと照射される。以下ＣＯｚレーザを
用いた時と同様な手順によって加工材への印字、切断が
行なわれる。Next, the control unit 15 sends a workpiece transport signal to the workpiece transport unit 18 and sets the workpiece on the X-Y table 19 under the cutting condensing lens 13.The processing optical device control unit 15 is a laser beam path switching unit. 10 is moved upward so as not to reflect the laser beam, and the X-axis scanner 8.
The Y-axis scanner 9 is set at a fixed position, and the COx laser oscillator 1 emits a relay laser beam. The laser beam passes through each reflecting mirror, is focused by a cutting condensing lens 13, and is irradiated onto a workpiece 17. The laser beam irradiation position is fixed, and the X-Y table 19 moves according to a positioning signal from the processing optical device control section 15, and assist gas is sprayed from the last gas nozzle 20 to cut the workpiece into a desired shape. When the workpiece is a metal such as stainless steel, iron, copper, or aluminum, the processing optical device control section 15 rotates the laser beam switching section 7 by 90 degrees based on a signal from the workpiece material detection section 14 to bring it to the YAG laser reflection position. Set the YAG laser oscillator 2 to emit laser light. The laser is a YAG laser beam urimeter 5, a YAG laser reflection mirror 6
, CC)z, 'YAG lasers are irradiated via the laser beam switching unit 7 to a processing optical system common to YAG lasers. Thereafter, printing and cutting on the workpiece are performed by the same procedure as when using a COz laser.
本装置での加工材の搬送は真空チャック式のヘッドを持
つ加工材搬送装置１８で行ない加工光学装置制御部１５
からの信号により加工材の吸着、ヘッドの移動、加工材
の離脱を行なうものである。In this apparatus, the workpiece is transported by a workpiece transport device 18 having a vacuum chuck type head, and the processing optical device control unit 15
Based on the signals from the machine, the workpiece is attracted, the head is moved, and the workpiece is removed.
加工材々質検知部１４の構成としては、加工材の導体抵
抗を測定するセンサ一部と、それより出力される電流信
号から加工材が絶縁物であるプラスチック材か導電物で
ある金属材かを判定する電気ｔＪ路からなるにの電気回
路は加工材がプラスチックの場合にはリレー接点をＯＦ
Ｆ、金属の場合はＯＮとし加工光学装置制御部１５へ信
号を送る。The workpiece material detection unit 14 includes a sensor part that measures the conductor resistance of the workpiece, and a current signal output from the sensor that determines whether the workpiece is an insulating plastic material or a conductive metal material. The electric circuit consisting of the electric tJ path that determines the
F: In the case of metal, turn ON and send a signal to the processing optical device control section 15.
加工光学装置制御部１５は加工材々貿検知部１４の電気
回路リレー接点のＯＮ、ＯＦＦによって加工材々質を認
識する。尚、センサ一部として加工材の磁化特性を測定
する磁気センサーなどの利用も可能である。The processing optical device control section 15 recognizes the material to be processed by turning ON and OFF the electrical circuit relay contacts of the processing material trade detection section 14 . Note that it is also possible to use a magnetic sensor that measures the magnetization characteristics of the processed material as a part of the sensor.
本実施例によれば、Ｃｏｔレーザでは加工しにくいステ
ンレス、銅、アルミニウムなどの金属加工材や、ＹＡＧ
レーザでは加工しにくいアクリルなどのプラスチック加
工材を一台の加工装置によって印字、切断することがで
き設備台数の削減。According to this embodiment, metal processing materials such as stainless steel, copper, and aluminum, which are difficult to process with a Cot laser, and YAG
Plastic processing materials such as acrylic, which are difficult to process with lasers, can be printed and cut with a single processing device, reducing the number of equipment needed.
光学系をＣｏｔレーザ、ＹＡＧレーザ共通にすることに
よる装置製作費の削減、加工性向上によるラツニングコ
ストの節減が可能になる。又、作業者の操作、例えば加
工材によるレーザ光の接択、装置の保守点検を簡便にす
ることができ、特にレーザ光の誤選択による加工不良の
発生を未然に防止することができる。By using the same optical system for Cot laser and YAG laser, it is possible to reduce device manufacturing costs and to reduce rattening costs by improving processability. In addition, operator operations, such as selection of the laser beam depending on the workpiece and maintenance and inspection of the device, can be simplified, and in particular, processing defects due to incorrect selection of the laser beam can be prevented.
本発明によれば、種々の加工材々質に対し、吸収性の良
いレーザ光を選択し加工できるので加工速度、仕上り精
度の向上及び加工費がかからないなどの効果がある。又
、各種レーザ発振器に対し共通の加工光学装置、例えば
オプティカルスキャナー、反射ミラー、集光レンズ等な
どを使用する為装置の価格が安価となる上に各部品、装
置の保守点検が容易になリランニングコストがかからな
いなどの効果がある。According to the present invention, it is possible to select and process a laser beam with good absorption properties for various materials to be processed, so that there are effects such as improvement in processing speed and finishing accuracy, and reduction in processing costs. In addition, since common processing optical equipment such as optical scanners, reflective mirrors, condensing lenses, etc. are used for various laser oscillators, the cost of the equipment is low, and maintenance and inspection of each component and equipment are easy. This has benefits such as low running costs.
図は本発明の一実施例のレーザ加工装置構成図である。 The figure is a configuration diagram of a laser processing apparatus according to an embodiment of the present invention.
Claims (1)
において、加工材の材質を検知する材質検知部とそれよ
り得られた情報を基に加工材に適したレーザを選択する
ことができる加工光学装置を設けたことを特徴とするレ
ーザ加工装置。1. In a processing device consisting of a plurality of laser oscillators with different wavelengths, a material detection unit detects the material of the workpiece and a processing optical device that can select a laser suitable for the workpiece based on the information obtained from the material detection unit. A laser processing device characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61234621A JPS6390378A (en) | 1986-10-03 | 1986-10-03 | Laser beam machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61234621A JPS6390378A (en) | 1986-10-03 | 1986-10-03 | Laser beam machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6390378A true JPS6390378A (en) | 1988-04-21 |
Family
ID=16973910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61234621A Pending JPS6390378A (en) | 1986-10-03 | 1986-10-03 | Laser beam machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6390378A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1318176C (en) * | 2002-10-15 | 2007-05-30 | 竹内株式会社 | Laser processing method |
-
1986
- 1986-10-03 JP JP61234621A patent/JPS6390378A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1318176C (en) * | 2002-10-15 | 2007-05-30 | 竹内株式会社 | Laser processing method |
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