JPS639013B2 - - Google Patents

Info

Publication number
JPS639013B2
JPS639013B2 JP55071416A JP7141680A JPS639013B2 JP S639013 B2 JPS639013 B2 JP S639013B2 JP 55071416 A JP55071416 A JP 55071416A JP 7141680 A JP7141680 A JP 7141680A JP S639013 B2 JPS639013 B2 JP S639013B2
Authority
JP
Japan
Prior art keywords
substrate holder
evaporation source
substrate
vapor deposition
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55071416A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56169770A (en
Inventor
Toyomitsu Takatsuka
Koichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP7141680A priority Critical patent/JPS56169770A/ja
Publication of JPS56169770A publication Critical patent/JPS56169770A/ja
Publication of JPS639013B2 publication Critical patent/JPS639013B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP7141680A 1980-05-30 1980-05-30 Ionic plating device Granted JPS56169770A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7141680A JPS56169770A (en) 1980-05-30 1980-05-30 Ionic plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7141680A JPS56169770A (en) 1980-05-30 1980-05-30 Ionic plating device

Publications (2)

Publication Number Publication Date
JPS56169770A JPS56169770A (en) 1981-12-26
JPS639013B2 true JPS639013B2 (forum.php) 1988-02-25

Family

ID=13459884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7141680A Granted JPS56169770A (en) 1980-05-30 1980-05-30 Ionic plating device

Country Status (1)

Country Link
JP (1) JPS56169770A (forum.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879741A (en) * 1993-03-24 1999-03-09 Semiconductor Energy Laboratory Co., Ltd. Apparatus and method for forming film

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167766A (ja) * 1984-09-11 1986-04-07 Canon Inc イオンプレ−テイング装置
KR100449570B1 (ko) * 2001-12-28 2004-09-22 (주)인텍 진공도금장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5229991B2 (forum.php) * 1973-03-20 1977-08-05
JPS5278776A (en) * 1975-12-26 1977-07-02 Youichi Murayama Apparatus for high frequency ionic plating
JPS5619172Y2 (forum.php) * 1976-09-21 1981-05-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879741A (en) * 1993-03-24 1999-03-09 Semiconductor Energy Laboratory Co., Ltd. Apparatus and method for forming film

Also Published As

Publication number Publication date
JPS56169770A (en) 1981-12-26

Similar Documents

Publication Publication Date Title
US4547279A (en) Sputtering apparatus
US4342631A (en) Gasless ion plating process and apparatus
US4511593A (en) Vapor deposition apparatus and method
JP3737363B2 (ja) 不均一性補償を伴う表面の物理的気相処理
US6290826B1 (en) Composite sputtering cathode assembly and sputtering apparatus with such composite sputtering cathode assembly
WO2002064850A2 (en) Focused magnetron sputtering system
KR20010020525A (ko) 스퍼터 코팅 시스템 및 기판 전극을 사용하는 방법
US6001432A (en) Apparatus for forming films on a substrate
US3900585A (en) Method for control of ionization electrostatic plating
JPS639013B2 (forum.php)
US4803094A (en) Metallized coating
KR20010012858A (ko) 기판상에 유전체막을 스퍼터 증착하기 위한 장치 및 방법
US4279216A (en) Cathode shielded coating apparatus
KR980011764A (ko) 전면 고밀도 플라즈마 증착 제공 방법 및 그 장치
CN102899632B (zh) 镀膜方法及其镀膜装置
JPS59124038A (ja) 磁気記録媒体の製造方法
JP2023525638A (ja) 基板処理装置
RU2065890C1 (ru) Устройство для получения защитно-декоративных покрытий в вакууме ионно-плазменным напылением
JPH01116068A (ja) バイアススパッタ装置
US3630871A (en) Cathodic sputtering method
KR100267886B1 (ko) 쉴드의코팅막형성방법및쉴드를이용한스퍼터링장치와이장치를이용한박막형성방법
KR930001231B1 (ko) 다중극 자장억류 원리를 이용한 대용량 이온플레이팅 방법 및 그장치
JPH04268073A (ja) 圧力勾配型プラズマガンによるプラズマ発生装置
JPH06158311A (ja) スパッタリング装置
JPH10330935A (ja) スパッタ装置