JPS6389584A - 異方導電性接着膜 - Google Patents
異方導電性接着膜Info
- Publication number
- JPS6389584A JPS6389584A JP61235258A JP23525886A JPS6389584A JP S6389584 A JPS6389584 A JP S6389584A JP 61235258 A JP61235258 A JP 61235258A JP 23525886 A JP23525886 A JP 23525886A JP S6389584 A JPS6389584 A JP S6389584A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- layer
- film
- adhesive film
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 42
- 230000001070 adhesive effect Effects 0.000 claims abstract description 41
- 239000002245 particle Substances 0.000 claims abstract description 30
- 239000007787 solid Substances 0.000 claims abstract description 7
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 6
- 239000003822 epoxy resin Substances 0.000 claims abstract description 3
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 abstract description 40
- 239000003795 chemical substances by application Substances 0.000 abstract description 35
- 239000012790 adhesive layer Substances 0.000 abstract description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 6
- 239000003054 catalyst Substances 0.000 abstract description 5
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 238000003860 storage Methods 0.000 abstract description 3
- 229920006254 polymer film Polymers 0.000 abstract 1
- 238000002955 isolation Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920006284 nylon film Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000002639 bone cement Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000005018 casein Substances 0.000 description 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 1
- 235000021240 caseins Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229940056692 resinol Drugs 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Adhesive Tapes (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61235258A JPS6389584A (ja) | 1986-10-02 | 1986-10-02 | 異方導電性接着膜 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61235258A JPS6389584A (ja) | 1986-10-02 | 1986-10-02 | 異方導電性接着膜 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6389584A true JPS6389584A (ja) | 1988-04-20 |
| JPH0146549B2 JPH0146549B2 (enrdf_load_stackoverflow) | 1989-10-09 |
Family
ID=16983417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61235258A Granted JPS6389584A (ja) | 1986-10-02 | 1986-10-02 | 異方導電性接着膜 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6389584A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2248450A (en) * | 1990-10-05 | 1992-04-08 | Shinetsu Polymer Co | Anisotropically electroconductive adhesive |
| JPH05182515A (ja) * | 1991-12-26 | 1993-07-23 | Ougi Kagaku Kogyo Kk | 回路接続用異方性導電接着剤 |
| JPH06165538A (ja) * | 1992-08-26 | 1994-06-10 | Licentia Patent Verwalt Gmbh | 金属性振動体をステータとして有する超音波モータ |
| JPH08111124A (ja) * | 1994-10-11 | 1996-04-30 | Sony Chem Corp | 異方導電性接着剤フィルム |
| JPH08148211A (ja) * | 1994-11-25 | 1996-06-07 | Hitachi Chem Co Ltd | 接続部材及び該接続部材を用いた電極の接続構造・接続方法 |
| JP2006312743A (ja) * | 2006-05-22 | 2006-11-16 | Sony Chemical & Information Device Corp | 異方導電性接着剤フィルム |
| JP2009111070A (ja) * | 2007-10-29 | 2009-05-21 | Sumitomo Electric Ind Ltd | 配線板の接続方法 |
| JP2018071692A (ja) * | 2016-10-31 | 2018-05-10 | 日鉄住金パイプライン＆エンジニアリング株式会社 | 導線付きパイプラインおよび導線付きパイプラインの製造方法 |
-
1986
- 1986-10-02 JP JP61235258A patent/JPS6389584A/ja active Granted
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2248450A (en) * | 1990-10-05 | 1992-04-08 | Shinetsu Polymer Co | Anisotropically electroconductive adhesive |
| GB2248450B (en) * | 1990-10-05 | 1994-03-09 | Shinetsu Polymer Co | Anisotropically electroconductive adhesive and structure adhesively bonded therewith |
| JPH05182515A (ja) * | 1991-12-26 | 1993-07-23 | Ougi Kagaku Kogyo Kk | 回路接続用異方性導電接着剤 |
| JPH06165538A (ja) * | 1992-08-26 | 1994-06-10 | Licentia Patent Verwalt Gmbh | 金属性振動体をステータとして有する超音波モータ |
| JPH08111124A (ja) * | 1994-10-11 | 1996-04-30 | Sony Chem Corp | 異方導電性接着剤フィルム |
| JPH08148211A (ja) * | 1994-11-25 | 1996-06-07 | Hitachi Chem Co Ltd | 接続部材及び該接続部材を用いた電極の接続構造・接続方法 |
| JP2006312743A (ja) * | 2006-05-22 | 2006-11-16 | Sony Chemical & Information Device Corp | 異方導電性接着剤フィルム |
| JP2009111070A (ja) * | 2007-10-29 | 2009-05-21 | Sumitomo Electric Ind Ltd | 配線板の接続方法 |
| JP2018071692A (ja) * | 2016-10-31 | 2018-05-10 | 日鉄住金パイプライン＆エンジニアリング株式会社 | 導線付きパイプラインおよび導線付きパイプラインの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0146549B2 (enrdf_load_stackoverflow) | 1989-10-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |