JPS6389297A - Method of drilling printed circuit substrate and mold for drilling - Google Patents
Method of drilling printed circuit substrate and mold for drillingInfo
- Publication number
- JPS6389297A JPS6389297A JP23528886A JP23528886A JPS6389297A JP S6389297 A JPS6389297 A JP S6389297A JP 23528886 A JP23528886 A JP 23528886A JP 23528886 A JP23528886 A JP 23528886A JP S6389297 A JPS6389297 A JP S6389297A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- hole
- drilling
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005553 drilling Methods 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 title description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 241000219122 Cucurbita Species 0.000 description 1
- 235000009852 Cucurbita pepo Nutrition 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント回路基板、特に絶縁体からなる積層板
の表面に銅箔等のプリント層を形成したプリント回路基
板にチップ部品を立て置きで搭載するための透孔を穿設
する穿孔方法及びその穿孔方法に使用される穿孔用金型
に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is a printed circuit board, in particular, a printed circuit board in which a printed layer of copper foil or the like is formed on the surface of a laminate made of an insulator, in which chip components are placed upright. The present invention relates to a drilling method for drilling a through hole for mounting and a drilling mold used in the drilling method.
従来よりプリント回路基板にチップ部品を高密度マウン
トするため立て置きで使用することが行なわれており、
そのチップ部品をプリント回路基板に搭載するについて
の透孔は第６図乃至第９１４に示される如くなされてい
た。即ち、第６図は従来の穿孔方法の作業直前の状態を
示す要部断面図であり１図中１はプリント回路基板を示
している。このプリント回路基板１は絶縁体からなる積
層板２を有し、その積層板２の表面に銅箔等からなるプ
リント層３が貼装されたものとなっている。Traditionally, it has been used vertically to mount chip components on printed circuit boards at high density.
The through holes for mounting the chip components on the printed circuit board were made as shown in FIGS. 6 to 914. That is, FIG. 6 is a sectional view of the main part showing the state immediately before the conventional drilling method starts, and 1 in FIG. 1 indicates a printed circuit board. This printed circuit board 1 has a laminate 2 made of an insulator, and a printed layer 3 made of copper foil or the like is pasted on the surface of the laminate 2.
一方、図中４は打ち抜かれたスケルトンの落下用透孔５
を形成したグイであり、図中６はノックアウト７に保持
され、Ｅ下動自在とされたポンチであり、このポンチ６
の直径Ａは、後述するチップ部品をプリント回路基板ｌ
に立て置きＰＳＭ、する際に、そのチップ部品の脱落防
止やクラック防止等を考慮し、チップ部品を押えるのは
フレキシブルなプリント層３のみとし、積層板２部分は
チップ部品にタッチしないようにするため前記したグイ
４のスケルトンの落下用透孔５の直径Ｂよりも小さくし
、大きなりリアランスを形成するものとしている。On the other hand, 4 in the figure is a hole 5 for dropping the punched skeleton.
6 in the figure is a punch that is held by the knockout 7 and can freely move downward.
The diameter A of the printed circuit board l is the chip component described later.
When the PSM is placed vertically, in order to prevent the chip components from falling off and cracking, only the flexible printed layer 3 should hold down the chip components, and the laminate 2 portion should not touch the chip components. Therefore, it is made smaller than the diameter B of the through hole 5 for dropping the skeleton of the gooey 4 described above to form a large clearance.
又、第７図は作業中の状態を示す要部断面図であり、プ
リント回路基板１は積層板２側をグイ４の上面に、又、
プリント層３側をノックアウト７の下面で挟持固定され
、ポンチ６の下降によってスケルトン８を打ち抜いてプ
リント回路基板１に透孔９を穿設するものとなっている
。Moreover, FIG. 7 is a sectional view of the main part showing the state during work, and the printed circuit board 1 is placed with the laminate 2 side on the top surface of the gouer 4, and
The printed layer 3 side is clamped and fixed by the lower surface of the knockout 7, and the skeleton 8 is punched out by lowering the punch 6 to form a through hole 9 in the printed circuit board 1.
こうして透孔９が穿設された一対のプリント回路基板１
・１を、前記透孔９・９を連通させて合わせ、チップ部
品１０をこの透孔９・９内に挿通し、半田１１・１１・
・・によって固着し、チップ部品１０の立て置き搭載の
作業が終了するものとなっている。A pair of printed circuit boards 1 with through holes 9 formed in this way
・Align the through holes 9 and 9 to communicate with each other, insert the chip component 10 into the through holes 9, and solder 11.
. . , and the work of vertically mounting the chip component 10 is completed.
しかしながら、上記した従来のプリント回路基板の穿孔
方法によると、プリント回路基板１に穿設された透孔９
の開口寸法Ｃのパラ付きにより、その寸法Ｃが小さくな
ってしまうと積層板２の破断面によってチップ部品１０
の挿入ができなくなり、又、挿入することができてもチ
ップ部品１０にクラックによる不良等が発生し、検査や
管理に大きな支障をきたすことになってしまった。逆に
、その寸法Ｃが大きくなってしまうと挿入されたチップ
部品１０は半田１１−１１・・・にょって固着されるま
での間に脱落してしまうという問題点があった。However, according to the conventional printed circuit board drilling method described above, the through holes 9 drilled in the printed circuit board 1
If the opening dimension C becomes smaller due to the unevenness of the opening dimension C, the chip component 10 will be damaged by the fractured surface of the laminate 2.
The chip component 10 cannot be inserted, and even if the chip component 10 can be inserted, defects due to cracks occur in the chip component 10, which greatly hinders inspection and management. Conversely, if the dimension C becomes large, there is a problem that the inserted chip component 10 will fall off before it is fixed by the solder 11-11.
そこで、本発明は係る従来の技術の問題点に着目してな
されたもので、かかる問題点を解消して、プリント回路
基板に穿設される透孔の寸法バラ付きを吸収して、挿入
されるチップ部品が積層板部分にタッチする虞れをなく
してクラック発生等を防ぎ、又、半田付は性も向上させ
ることができることとしたプリント回路基板の穿孔方法
及び穿孔用金型を提供することを目的としている。Therefore, the present invention has been made by focusing on the problems of the related art, and solves the problems and absorbs the variation in the dimensions of the through holes drilled in the printed circuit board. To provide a method for perforating a printed circuit board and a mold for perforating the printed circuit board, which prevents the occurrence of cracks by eliminating the risk of chip parts touching the laminate part, and improves solderability. It is an object.
〔問題点を解決しようとするための手段〕この目的を達
成するために１本発明に係るプリント囲路基板の穿孔方
法は、積層板の表面に銅箔等からなるプリント層を形成
したプリント回路基板にチップ部品搭載用の透孔を穿設
する穿孔方法において、環状の刃部を設けたグイに前記
プリント回路基板の積層板側の目的筒所を合わせ、細径
３＃七台伽４ソ手箇打瓢カ１緘でプ１１ント陽乃び３３
層板を貫通する所定径の透孔を形成し、次いで更にポン
チを押し下げることによって、そのポンチの大径部で前
記刃部によって切り取られた積層板のスケルトンを落下
させ、前記透孔の開口縁にプリント層によるひれ部を形
成することを特徴とし、又、プリント回路基板の穿孔用
金型は、スケルトン落下用の透孔の開口縁に環状の刃部
を設けたグイと、そのグイと対応し、前記スケルトン落
下用の透孔よりも細径とした打ち抜き部を下端中央に設
けたポンチと、前記スケルトン落下用の透孔内にと下動
自在に備えられたプリント回路基板の支承用受はグイと
から成ることを特徴としている。[Means for solving the problem] In order to achieve this object, the method for perforating a printed circuit board according to the present invention is a printed circuit board in which a printed layer made of copper foil or the like is formed on the surface of a laminate board. In the drilling method of drilling a through hole for mounting a chip component on a board, align the target hole on the laminate side of the printed circuit board with a goo provided with an annular blade, and insert a small diameter 3#7 11 points with 1 hand gourd and 33
A through hole of a predetermined diameter is formed through the laminate, and then by further pushing down the punch, the skeleton of the laminate cut by the blade part is dropped by the large diameter part of the punch, and the opening edge of the through hole is The mold for drilling printed circuit boards has a goo with an annular blade on the opening edge of the through hole for dropping the skeleton, and the goo corresponds to the goo. a punch having a punched portion having a diameter smaller than the through hole for dropping the skeleton at the center of the lower end; and a support for supporting a printed circuit board provided in the through hole for dropping the skeleton so as to be movable downwardly. It is characterized by consisting of Gui and.
上記したような穿孔方法及び穿孔用金型を採用すること
によって、プリント回路基板に穿設される透孔の開口寸
法のバラ付きをプリント層によるフレキシブルなひれ部
で良好に吸収し、そのひれ部でチップ部品を保持するこ
とによって半田付は六回−スすでの聞 手、、プ鴛晶か
Ｔｌａ Ｗ ＋ス、−にルかくし、又、積層板をダイの
刃部によって大きく切り取ることによってチップ部品の
挿入に際してクラック発生等を未然に防ぐことができる
。更に、チ・ンプ部品をプリント回路基板の透孔へ挿入
した際にひれ部がそのチップ部品との接触によってたわ
み、半田付けがチップ部品の挿入方向まで伸びることと
なり、半田付は性も向上することになるのである。By adopting the above-described drilling method and drilling mold, variations in the opening dimensions of the through holes drilled in the printed circuit board can be well absorbed by the flexible fins of the printed layer, and the fins Soldering can be carried out by holding the chip parts in place for six times, and by cutting the laminate into large pieces with the blade of the die. It is possible to prevent cracks from occurring when inserting chip components. Furthermore, when a chip component is inserted into a through hole in a printed circuit board, the fins bend due to contact with the chip component, causing the solder to extend in the direction of insertion of the chip component, improving soldering properties. That's what happens.
次に、本発明の実施の一例を第１図乃至第５図を参照し
て詳細に説明する。Next, an example of the implementation of the present invention will be described in detail with reference to FIGS. 1 to 5.
第１図は本発明に係るプリント回路基板の穿孔作業を行
なう直前の要部断面図であり、図中１は従来例における
と同様の絶縁体からなる積層板２に銅箔等からなるプリ
ント層３を貼装したプリント回路基板である。FIG. 1 is a cross-sectional view of the main part of the printed circuit board according to the present invention just before the drilling operation is performed. This is a printed circuit board with 3 pasted on it.
又１図中２０はスケルトンの落下用透孔２１を設けたダ
イであり、このダイ２０の前記落下用透孔２１の開口縁
には環状をし、断面三角形状として、その高さはプリン
ト回路基板１の板厚よりも低いものとした刃部２２が一
体的に設けられている。又、前記したダイ２０のスケル
トンの落下用透孔２１内には円筒状をし、作業時にプリ
ント回路基板１を支承する受はダイ２３が上下動自在に
、かつ、密に嵌合されて備えられている。In addition, 20 in Figure 1 is a die provided with a through hole 21 for dropping the skeleton, and the opening edge of the through hole 21 for dropping the skeleton is annular and triangular in cross section, and its height is equal to that of the printed circuit. A blade portion 22 having a thickness lower than that of the substrate 1 is integrally provided. Further, in the through hole 21 for dropping the skeleton of the die 20, there is provided a cylindrical support for supporting the printed circuit board 1 during operation, in which the die 23 is vertically movable and tightly fitted. It is being
一方、図中２４はポンチであり、このポンチ２４は下端
中央に細径とし、ダイ２ｏのスケルトンの落下用透孔２
１と十分なりリアランスを得ることができる打ち抜き部
２５が一体的に形成されたものとなっており、このポン
チ２４はノックアウト２６の透孔２７内を自在に上下動
できるものとされているもので、そのポンチ２４の全体
の系はダイ２０の刃部２３の頂部間直径よりも小さく構
成されている。On the other hand, 24 in the figure is a punch, and this punch 24 has a small diameter at the center of the lower end, and has a through hole 2 for dropping the skeleton of the die 2o.
The punch 24 is integrally formed with a punched portion 25 that can provide a sufficient clearance of 1, and the punch 24 can freely move up and down within the through hole 27 of the knockout 26. , the entire system of the punch 24 is configured to be smaller than the diameter between the tops of the blade portion 23 of the die 20.
又、第７図は本発明の第一工程を示す要部断面図であり
、この第一工程にあっては、プリント回路基板ｌの積層
板２側をダイ２０及び受はダイ２３で、プリントＪｔ！
：３側をノックアウト２６の下面で挟持固定し、ポンチ
２４の打ち抜き部２５により、プリント層３及びａ層板
２を貫通し、後述するチップ部品１０よりも小径とした
所定径の透孔２８を穿設し、その際のスケルトン２９は
受はダイ２３の中心孔から落下させる。又、この時に、
積層板２には刃部２２が前記透孔２８と同心円のリング
状に食い込むハーフパンチが行なわれている。FIG. 7 is a cross-sectional view of a main part showing the first step of the present invention. In this first step, the laminate 2 side of the printed circuit board l is printed using a die 20 and a die 23 for the receiver. Jt!
:3 side is clamped and fixed by the lower surface of the knockout 26, and a through hole 28 having a predetermined diameter smaller than that of the chip component 10, which will be described later, is formed through the printed layer 3 and the A-layer board 2 using the punched part 25 of the punch 24. During drilling, the skeleton 29 is dropped from the center hole of the die 23. Also, at this time,
The laminated plate 2 is half punched so that the blade portion 22 bites into the through hole 28 in a concentric ring shape.
更に、第３図は続く第二工程を示す要部断面図であり、
前記した透孔２８が穿設された後、更にポンチ２４を押
し下げて、その本体の下端面部分でプリント回路基板１
の、前記ダイ２０の刃部２２でハーフパンチされていた
積層板２の部分を刃部２２によって完全に切り取らせ、
そのスケルトン３０を落下させる。その際に受はダイ２
３はダイ２０から下降して外れるものとなっている。こ
の積層板２の切り取りによって、透孔２８にはプリント
層３によるフレキシブルでチップ部品１０の外径よりも
小さな直径とされたひれ部３１が形成され、積層板２に
はチップ部品１０の外径よりも確実に大きな直径の孔部
３２が形成されるものこうして穿孔された一対のプリン
ト回路基板１・１はプリント層３・３側を表出して、前
記透孔２８・２８を連通させて合わされ、その透孔２８
拳２８間にチー、ブ部品ｌｏが挿通される。このチップ
部品１０の挿通に際してはひれ部３１のフレキシブル性
が利用され、そのひれ部３１によってチップ部品１０は
仮保持され、その状態で半田３３・３３・・・によって
固着されるものとなっている。この半田３３はチップ部
品ｌｏを仮保持しているひれ部３１がチー、プ部品１０
の挿通に伴なってたわむことにより、そのチップ部品１
０の挿通方向まで延びたものとなっている。Furthermore, FIG. 3 is a sectional view of the main part showing the subsequent second step,
After the above-mentioned through hole 28 is bored, the punch 24 is further pushed down and the lower end surface of the main body is used to punch the printed circuit board 1.
The part of the laminate 2 that was half punched by the blade part 22 of the die 20 is completely cut off by the blade part 22,
Drop the skeleton 30. At that time, Uke is die 2
3 descends from the die 20 and comes off. By cutting the laminated plate 2, a flexible fin 31 made of the printed layer 3 and having a smaller diameter than the outer diameter of the chip component 10 is formed in the through hole 28, and the outer diameter of the chip component 10 is formed in the laminated plate 2. The pair of printed circuit boards 1 and 1 that have been punched in this manner are brought together with the printed circuit boards 1 and 1 exposed with the printed layers 3 and 3 side exposed, and the through holes 28 and 28 communicated with each other. , its through hole 28
The Qi and B parts LO are inserted between the fists 28. When inserting this chip component 10, the flexibility of the fin portion 31 is utilized, and the chip component 10 is temporarily held by the fin portion 31, and in this state is fixed by solders 33, 33, etc. . This solder 33 is attached to the fin part 31 that temporarily holds the chip component lo, and the chip component 10.
As the chip component 1 bends as it is inserted,
0 in the insertion direction.
上述したように本発明によれば、チップ部品はプリント
回路基板のＭ）ｆｆ板とタッチすることは絶対になくな
り、そのためチップ部品にクラック等の水攻が発生する
ことがなく、又、ひれ部によってチップ部品を７レキシ
プルに仮保持することができるので、半田付は作業まで
の間にチップ部品の挿通方向にまで半田付は面が延びる
結果となり、半田例は性も向上するものとなっている。As described above, according to the present invention, the chip component never comes into contact with the M) ff board of the printed circuit board, so water damage such as cracks does not occur in the chip component, and the fin portion Since the chip component can be temporarily held in a 7-lexiple position, the soldering surface extends in the insertion direction of the chip component until the soldering process is completed, and the soldering properties are also improved. There is.
第１図は本発明の実施の一例を示すもので、穿孔作業の
直前の状態の要部断面図、第２図は同穿孔した第一工程
を示す要部断面図、第３図は同積層板を切り取った第二
工程を示す要部断面図、第４図は同完成したプリント回
路基板の要部断面図、第５図は同チップ部品を立て起き
搭載した状態の要部断面図、第６図は従来例を示すもの
で穿孔作業の直前の状態の要部断面図、第７図は同穿孔
作業状態の要部断面図、第８図は同完成したプリント回
路基板の要部断面図、第９図は同チップ部品を立て起き
搭載した状態の要部断面図である。
１・・・プリント回路基板 ２・・・積層板３・・・プ
リント層 １０・・・チップ部品２０・・・ダイ ２１
・・・落下用透孔 ２２・・・刃部２３・・・受はダイ
２４・・・ポンチ２５・・・打ち抜き部 ２６・・・
ノックアウト２８・・・ｍ′孔 ２９・３０・・・スケ
ルトン３１・・・ひれ部
第１図
第２図 第３図
第４図 第５図Fig. 1 shows an example of the implementation of the present invention, and Fig. 2 is a sectional view of the main part in a state immediately before drilling, Fig. 2 is a sectional view of the main part showing the first step of drilling, and Fig. 3 is a sectional view of the main part in the state immediately before drilling. Figure 4 is a cross-sectional view of the main parts of the completed printed circuit board, and Figure 5 is a cross-sectional view of the main parts with the chip components mounted upright. Fig. 6 shows a conventional example, and is a sectional view of the main part immediately before drilling, Fig. 7 is a sectional view of the main part in the state of drilling, and Fig. 8 is a sectional view of the main part of the completed printed circuit board. , FIG. 9 is a sectional view of the main part of the same chip component mounted in an upright position. 1... Printed circuit board 2... Laminate board 3... Printed layer 10... Chip component 20... Die 21
...Through hole for dropping 22...Blade part 23...Receiver is die 24...Punch 25...Punching part 26...
Knockout 28...M' hole 29, 30...Skeleton 31...Fin part Figure 1 Figure 2 Figure 3 Figure 4 Figure 5
Claims (3)
したプリント回路基板にチップ部品搭載用の透孔を穿設
する穿孔方法において、環状の刃部を設けたダイに前記
プリント回路基板の積層板側の目的筒所を合わせ、細径
とされたポンチの打ち抜き部でプリント層及び積層板を
貫通する所定径の透孔を形成し、次いで、更にポンチを
押し下げることによって、そのポンチの大径部で前記刃
部によって切り取られた積層板のスケルトンを落下させ
、前記透孔の開口縁にプリント層によるひれ部を形成す
ることを特徴とするプリント回路基板の穿孔方法。(1) In a drilling method in which a through hole for mounting a chip component is drilled in a printed circuit board on which a printed layer made of copper foil or the like is formed on the surface of a laminate, a die provided with an annular blade is attached to the printed circuit board. Align the target tube location on the laminate side of the punch, form a through hole with a predetermined diameter that penetrates the printed layer and the laminate with the punched part of the small-diameter punch, and then press the punch further down. A method for drilling a printed circuit board, comprising: dropping the skeleton of the laminate cut by the blade at the large diameter portion, and forming a fin portion of the printed layer at the opening edge of the through hole.
設けたダイと、そのダイに対応し、前記スケルトン落下
用の透孔よりも細径とした打ち抜き部を下端中央に設け
たポンチと、前記スケルトン落下用の透孔内に上下動自
在に備えられたプリント回路基板の支承用受けダイとか
ら成ることを特徴とするプリント回路基板の穿孔用金型
。(2) A die with an annular blade on the opening edge of the through-hole for dropping the skeleton, and a punched part corresponding to the die with a diameter smaller than that of the through-hole for dropping the skeleton at the center of the lower end. A mold for punching a printed circuit board, comprising a punch and a receiving die for supporting a printed circuit board, which is vertically movable in the through hole for dropping the skeleton.
とし、その高さはプリント回路基板の板厚寸法よりも低
く構成されていることを特徴とする特許請求の範囲第２
項に記載のプリント回路基板の穿孔用金型。(3) The annular blade provided on the die has a triangular cross section, and its height is configured to be lower than the board thickness of the printed circuit board.
A mold for punching printed circuit boards as described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23528886A JPS6389297A (en) | 1986-10-02 | 1986-10-02 | Method of drilling printed circuit substrate and mold for drilling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23528886A JPS6389297A (en) | 1986-10-02 | 1986-10-02 | Method of drilling printed circuit substrate and mold for drilling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6389297A true JPS6389297A (en) | 1988-04-20 |
Family
ID=16983889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23528886A Pending JPS6389297A (en) | 1986-10-02 | 1986-10-02 | Method of drilling printed circuit substrate and mold for drilling |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6389297A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004043478B4 (en) * | 2003-09-09 | 2007-11-22 | Mitsubishi Denki K.K. | shield |
-
1986
- 1986-10-02 JP JP23528886A patent/JPS6389297A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004043478B4 (en) * | 2003-09-09 | 2007-11-22 | Mitsubishi Denki K.K. | shield |
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