JPS6388809U - - Google Patents

Info

Publication number
JPS6388809U
JPS6388809U JP1986182595U JP18259586U JPS6388809U JP S6388809 U JPS6388809 U JP S6388809U JP 1986182595 U JP1986182595 U JP 1986182595U JP 18259586 U JP18259586 U JP 18259586U JP S6388809 U JPS6388809 U JP S6388809U
Authority
JP
Japan
Prior art keywords
led array
substrate
light emitting
flip
emitting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986182595U
Other languages
English (en)
Japanese (ja)
Other versions
JPH059698Y2 (US06168655-20010102-C00055.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986182595U priority Critical patent/JPH059698Y2/ja
Priority to US07/102,537 priority patent/US4827290A/en
Priority to DE19873739964 priority patent/DE3739964A1/de
Publication of JPS6388809U publication Critical patent/JPS6388809U/ja
Application granted granted Critical
Publication of JPH059698Y2 publication Critical patent/JPH059698Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Laser Beam Printer (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
JP1986182595U 1986-11-27 1986-11-27 Expired - Lifetime JPH059698Y2 (US06168655-20010102-C00055.png)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1986182595U JPH059698Y2 (US06168655-20010102-C00055.png) 1986-11-27 1986-11-27
US07/102,537 US4827290A (en) 1986-11-27 1987-09-29 LED array head using a fiber bundle
DE19873739964 DE3739964A1 (de) 1986-11-27 1987-11-25 Led-anordnungs-kopf

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986182595U JPH059698Y2 (US06168655-20010102-C00055.png) 1986-11-27 1986-11-27

Publications (2)

Publication Number Publication Date
JPS6388809U true JPS6388809U (US06168655-20010102-C00055.png) 1988-06-09
JPH059698Y2 JPH059698Y2 (US06168655-20010102-C00055.png) 1993-03-10

Family

ID=16121031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986182595U Expired - Lifetime JPH059698Y2 (US06168655-20010102-C00055.png) 1986-11-27 1986-11-27

Country Status (3)

Country Link
US (1) US4827290A (US06168655-20010102-C00055.png)
JP (1) JPH059698Y2 (US06168655-20010102-C00055.png)
DE (1) DE3739964A1 (US06168655-20010102-C00055.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006039046A (ja) * 2004-07-23 2006-02-09 Shinko Electric Ind Co Ltd 光導波路装着部材、基板、半導体装置、光導波路装着部材の製造方法、及び基板の製造方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929965A (en) * 1987-09-02 1990-05-29 Alps Electric Co. Optical writing head
US4928122A (en) * 1988-01-21 1990-05-22 Fuji Photo Film Co., Ltd. Exposure head
US4951064A (en) * 1989-05-15 1990-08-21 Westinghouse Electric Corp. Thin film electroluminescent edge emitter assembly and integral packaging
US4980701A (en) * 1989-07-03 1990-12-25 Eastman Kodak Company Non-impact printhead using a mask with a dye sensitive to and adjusted by light in a first spectrum to balance the transmission of light in a second spectrum emitted by an LED array
KR0137190B1 (ko) * 1992-12-03 1998-04-28 모리시타 요이찌 완전밀착형이미지센서 및 완전밀착형이미지센서유닛
US5561451A (en) * 1993-01-27 1996-10-01 Sony Corporation Sublimation type printer and photographic paper therefor
DE69421434T2 (de) * 1993-04-07 2000-06-08 Mitsui Chemicals, Inc. Leiterplatte für optische Elemente
US5882533A (en) * 1996-07-15 1999-03-16 Industrial Technology Research Institute Field emission based print head
US6784463B2 (en) * 1997-06-03 2004-08-31 Lumileds Lighting U.S., Llc III-Phospide and III-Arsenide flip chip light-emitting devices
BE1013248A3 (nl) * 2000-01-26 2001-11-06 Krypton Electronic Eng Nv Optisch apparaat.
JP3883770B2 (ja) * 2000-03-07 2007-02-21 パイオニア株式会社 発光素子の製造方法
US6486561B1 (en) * 2000-09-12 2002-11-26 Luminary Logic, Ltd. Semiconductor light emitting element formed on a clear or translucent substrate
US6547249B2 (en) 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
US20040206970A1 (en) * 2003-04-16 2004-10-21 Martin Paul S. Alternating current light emitting device
US7300182B2 (en) * 2003-05-05 2007-11-27 Lamina Lighting, Inc. LED light sources for image projection systems
JP6374739B2 (ja) * 2014-09-19 2018-08-15 株式会社沖データ 露光装置及び画像形成装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598074A (ja) * 1982-07-05 1984-01-17 Nippon Telegr & Teleph Corp <Ntt> 画像処理方式
JPS6162016A (ja) * 1984-09-03 1986-03-29 Nhk Spring Co Ltd Ｌｅｄプリンタヘツド

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968564A (en) * 1975-04-30 1976-07-13 Northern Electric Company Limited Alignment of optical fibers to light emitting diodes
JPS5946740A (ja) * 1982-09-09 1984-03-16 Ricoh Co Ltd 光書込デバイス
JPS5986395A (ja) * 1982-11-09 1984-05-18 Toshiba Corp 光制御装置
DE3438949C2 (de) * 1983-10-25 1994-03-10 Canon Kk Druckvorrichtung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598074A (ja) * 1982-07-05 1984-01-17 Nippon Telegr & Teleph Corp <Ntt> 画像処理方式
JPS6162016A (ja) * 1984-09-03 1986-03-29 Nhk Spring Co Ltd Ｌｅｄプリンタヘツド

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006039046A (ja) * 2004-07-23 2006-02-09 Shinko Electric Ind Co Ltd 光導波路装着部材、基板、半導体装置、光導波路装着部材の製造方法、及び基板の製造方法
JP4558400B2 (ja) * 2004-07-23 2010-10-06 新光電気工業株式会社 半導体装置

Also Published As

Publication number Publication date
US4827290A (en) 1989-05-02
DE3739964A1 (de) 1988-06-09
JPH059698Y2 (US06168655-20010102-C00055.png) 1993-03-10

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