JPS6387725A - ステ−ジ移動機構 - Google Patents

ステ−ジ移動機構

Info

Publication number
JPS6387725A
JPS6387725A JP61231087A JP23108786A JPS6387725A JP S6387725 A JPS6387725 A JP S6387725A JP 61231087 A JP61231087 A JP 61231087A JP 23108786 A JP23108786 A JP 23108786A JP S6387725 A JPS6387725 A JP S6387725A
Authority
JP
Japan
Prior art keywords
stage
wafer
alignment
frame
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61231087A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0224012B2 (OSRAM
Inventor
Shiro Hamada
史郎 浜田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP61231087A priority Critical patent/JPS6387725A/ja
Publication of JPS6387725A publication Critical patent/JPS6387725A/ja
Publication of JPH0224012B2 publication Critical patent/JPH0224012B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP61231087A 1986-10-01 1986-10-01 ステ−ジ移動機構 Granted JPS6387725A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61231087A JPS6387725A (ja) 1986-10-01 1986-10-01 ステ−ジ移動機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61231087A JPS6387725A (ja) 1986-10-01 1986-10-01 ステ−ジ移動機構

Publications (2)

Publication Number Publication Date
JPS6387725A true JPS6387725A (ja) 1988-04-19
JPH0224012B2 JPH0224012B2 (OSRAM) 1990-05-28

Family

ID=16918081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61231087A Granted JPS6387725A (ja) 1986-10-01 1986-10-01 ステ−ジ移動機構

Country Status (1)

Country Link
JP (1) JPS6387725A (OSRAM)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5374147A (en) * 1982-07-29 1994-12-20 Tokyo Electron Limited Transfer device for transferring a substrate
JPH10163100A (ja) * 1996-11-28 1998-06-19 Nikon Corp 投影露光装置及び投影露光方法並びに走査露光方法
US6327022B1 (en) 1997-01-27 2001-12-04 Nikon Corporation Projection exposure method and apparatus
US6341007B1 (en) 1996-11-28 2002-01-22 Nikon Corporation Exposure apparatus and method
US6819425B2 (en) 2000-08-24 2004-11-16 Asml Netherland B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7289212B2 (en) 2000-08-24 2007-10-30 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufacturing thereby
JP2007324348A (ja) * 2006-05-31 2007-12-13 Nsk Ltd 露光装置
US7561270B2 (en) 2000-08-24 2009-07-14 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
JP2009223447A (ja) * 2008-03-14 2009-10-01 Hitachi Via Mechanics Ltd 加工装置
JP2012223805A (ja) * 2011-04-21 2012-11-15 Seishin Shoji Kk レーザー加工装置、レーザー加工方法及びレーザー加工物
WO2017204101A1 (ja) * 2016-05-26 2017-11-30 株式会社サーマプレシジョン 投影露光装置及びその投影露光方法

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5374147A (en) * 1982-07-29 1994-12-20 Tokyo Electron Limited Transfer device for transferring a substrate
US7177008B2 (en) 1996-11-28 2007-02-13 Nikon Corporation Exposure apparatus and method
JPH10163100A (ja) * 1996-11-28 1998-06-19 Nikon Corp 投影露光装置及び投影露光方法並びに走査露光方法
US6341007B1 (en) 1996-11-28 2002-01-22 Nikon Corporation Exposure apparatus and method
US6400441B1 (en) 1996-11-28 2002-06-04 Nikon Corporation Projection exposure apparatus and method
US6549269B1 (en) 1996-11-28 2003-04-15 Nikon Corporation Exposure apparatus and an exposure method
US6590634B1 (en) 1996-11-28 2003-07-08 Nikon Corporation Exposure apparatus and method
US7256869B2 (en) 1996-11-28 2007-08-14 Nikon Corporation Exposure apparatus and an exposure method
US6798491B2 (en) 1996-11-28 2004-09-28 Nikon Corporation Exposure apparatus and an exposure method
US6327022B1 (en) 1997-01-27 2001-12-04 Nikon Corporation Projection exposure method and apparatus
US6590636B2 (en) 1997-01-27 2003-07-08 Nikon Corporation Projection exposure method and apparatus
US6819425B2 (en) 2000-08-24 2004-11-16 Asml Netherland B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7289212B2 (en) 2000-08-24 2007-10-30 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufacturing thereby
US7561270B2 (en) 2000-08-24 2009-07-14 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7633619B2 (en) 2000-08-24 2009-12-15 Asml Netherlands B.V. Calibrating a lithographic apparatus
US7940392B2 (en) 2000-08-24 2011-05-10 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
JP2007324348A (ja) * 2006-05-31 2007-12-13 Nsk Ltd 露光装置
JP2009223447A (ja) * 2008-03-14 2009-10-01 Hitachi Via Mechanics Ltd 加工装置
JP2012223805A (ja) * 2011-04-21 2012-11-15 Seishin Shoji Kk レーザー加工装置、レーザー加工方法及びレーザー加工物
WO2017204101A1 (ja) * 2016-05-26 2017-11-30 株式会社サーマプレシジョン 投影露光装置及びその投影露光方法
JP2017211534A (ja) * 2016-05-26 2017-11-30 株式会社サーマプレシジョン 投影露光装置及びその投影露光方法

Also Published As

Publication number Publication date
JPH0224012B2 (OSRAM) 1990-05-28

Similar Documents

Publication Publication Date Title
EP0906590B1 (en) Lithographic projection apparatus with off-axis alignment unit
EP0956518B1 (en) Interferometer system and lithographic apparatus comprising such a system
US7119886B2 (en) Lithographic apparatus, device manufacturing method, and angular encoder
US10378933B2 (en) Encoder head designs
JPS6387725A (ja) ステ−ジ移動機構
GB2131167A (en) Alignment of mask and semiconductor wafer in exposure apparatus
US4620785A (en) Sheet-like member having alignment marks and an alignment apparatus for the same
EP0706093B1 (en) Method and apparatus for aligning a mask and a workpiece
KR100577476B1 (ko) 노광 장치 및 이 장치를 이용한 반도체 장치의 제조 방법
US5726757A (en) Alignment method
JP2006313866A (ja) 露光装置及び方法
KR920001027B1 (ko) 제1물체와 제2물체를 광학적으로 위치맞춤하는 방법 및 장치
Schlueter et al. Next-generation mask metrology tool
US4723846A (en) Optical path length compensating optical system in an alignment apparatus
US7327466B2 (en) Multi-corner retroreflector
JP7731699B2 (ja) ステージ装置、露光装置、及び物品の製造方法
JP2819592B2 (ja) 位置合わせ装置
KR100205064B1 (ko) 차광부를 지닌 리소그래피 광학계용 웨이퍼 자동촛점장치 및 자동촛점방법
EP1473597A2 (en) Lithographic apparatus, device manufacturing method and angular encoder
JPH11257919A (ja) 測定装置および測定方法、並びに露光装置
JPH02207522A (ja) 露光装置
JPS6097623A (ja) 露光装置
JPH02207520A (ja) 露光装置
JPH01181520A (ja) 露光装置
JPS63199417A (ja) 露光装置