JPS638138Y2 - - Google Patents
Info
- Publication number
- JPS638138Y2 JPS638138Y2 JP8785282U JP8785282U JPS638138Y2 JP S638138 Y2 JPS638138 Y2 JP S638138Y2 JP 8785282 U JP8785282 U JP 8785282U JP 8785282 U JP8785282 U JP 8785282U JP S638138 Y2 JPS638138 Y2 JP S638138Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- semiconductor device
- external electrodes
- resin
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 16
- NFLLKCVHYJRNRH-UHFFFAOYSA-N 8-chloro-1,3-dimethyl-7H-purine-2,6-dione 2-(diphenylmethyl)oxy-N,N-dimethylethanamine Chemical compound O=C1N(C)C(=O)N(C)C2=C1NC(Cl)=N2.C=1C=CC=CC=1C(OCCN(C)C)C1=CC=CC=C1 NFLLKCVHYJRNRH-UHFFFAOYSA-N 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 210000004899 c-terminal region Anatomy 0.000 description 15
- 239000011810 insulating material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Bipolar Transistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8785282U JPS58189546U (ja) | 1982-06-11 | 1982-06-11 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8785282U JPS58189546U (ja) | 1982-06-11 | 1982-06-11 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58189546U JPS58189546U (ja) | 1983-12-16 |
| JPS638138Y2 true JPS638138Y2 (enrdf_load_html_response) | 1988-03-10 |
Family
ID=30096547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8785282U Granted JPS58189546U (ja) | 1982-06-11 | 1982-06-11 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58189546U (enrdf_load_html_response) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4651092B2 (ja) * | 2005-06-23 | 2011-03-16 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
| JP5776707B2 (ja) * | 2013-02-27 | 2015-09-09 | 株式会社デンソー | 半導体装置 |
-
1982
- 1982-06-11 JP JP8785282U patent/JPS58189546U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58189546U (ja) | 1983-12-16 |