JPS6376888A - 錫または錫合金の剥離液 - Google Patents

錫または錫合金の剥離液

Info

Publication number
JPS6376888A
JPS6376888A JP61219747A JP21974786A JPS6376888A JP S6376888 A JPS6376888 A JP S6376888A JP 61219747 A JP61219747 A JP 61219747A JP 21974786 A JP21974786 A JP 21974786A JP S6376888 A JPS6376888 A JP S6376888A
Authority
JP
Japan
Prior art keywords
tin
copper
mol
acid
salts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61219747A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6352115B2 (enExample
Inventor
Yutaka Kawabe
豊 川辺
Masanori Kishimoto
岸本　全令
Masaki Imanishi
正樹 今西
Toshiko Nakagawa
中川　登志子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
METSUKU KK
Original Assignee
METSUKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by METSUKU KK filed Critical METSUKU KK
Priority to JP61219747A priority Critical patent/JPS6376888A/ja
Publication of JPS6376888A publication Critical patent/JPS6376888A/ja
Publication of JPS6352115B2 publication Critical patent/JPS6352115B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP61219747A 1986-09-19 1986-09-19 錫または錫合金の剥離液 Granted JPS6376888A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61219747A JPS6376888A (ja) 1986-09-19 1986-09-19 錫または錫合金の剥離液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61219747A JPS6376888A (ja) 1986-09-19 1986-09-19 錫または錫合金の剥離液

Publications (2)

Publication Number Publication Date
JPS6376888A true JPS6376888A (ja) 1988-04-07
JPS6352115B2 JPS6352115B2 (enExample) 1988-10-18

Family

ID=16740358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61219747A Granted JPS6376888A (ja) 1986-09-19 1986-09-19 錫または錫合金の剥離液

Country Status (1)

Country Link
JP (1) JPS6376888A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109652806A (zh) * 2019-01-29 2019-04-19 鹤壁市正华有色金属有限公司 一种以紫铜或黄铜为基材的亮锡汽车零部件的退镀液和退镀工艺

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109652806A (zh) * 2019-01-29 2019-04-19 鹤壁市正华有色金属有限公司 一种以紫铜或黄铜为基材的亮锡汽车零部件的退镀液和退镀工艺

Also Published As

Publication number Publication date
JPS6352115B2 (enExample) 1988-10-18

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