JPS6375577A - Ic test device - Google Patents

Abstract

PURPOSE:To facilitate the replacement of a performance substrate by pressing the performance substrate against the spring contact pin of a pin implanted body. CONSTITUTION:The part of the unshown contact pad of the performance substrate 26 is clamped to the pin implanted body where the spring contact pin 24 is implanted by a clamper 30. Then the contact pad and spring contact pin 24 are pressed against each other to connect the performance substrate 26 to a pin electronics substrate 12 electrically. Therefore, even when the number of pin electronics substrates 12 is large, no large force is required to attach and detach the performance substrate 26, which is therefore easily replaced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to an IC test device, and more specifically,
This invention relates to improvements related to electrical connections between pin electronics boards and performance boards in IC test equipment.

[Prior Art] Generally, in an IC test device, a large number of pin electronics boards are arranged in a part called a test head, and a performance board according to the purpose is electrically connected to the pin electronics board in a replaceable manner. It looks like this.

Conventionally, the electrical connection of this performance board is made by manually pressing the performance board onto the pin electronics board and mating the connector of the pin electronics Ml with the corresponding connector provided on the back side of the performance board. It is structured to do so.

[Problems to be solved] However, in the case of IC test equipment for testing ICs with many pins, the number of pin electronics boards increases significantly, and the number of connectors also increases accordingly, so it takes a lot of force to insert and remove connectors. Therefore, there is a problem that it is not easy to replace the performance board.

OBJECTS OF THE INVENTION Accordingly, one object of the present invention is to provide an IC test device that allows easy replacement of performance boards.

[Means for Solving the Problems] To achieve the above object, the present invention provides an IC test device in which a performance board is electrically connected to a plurality of pin electronics boards in a replaceable manner. A pin implanted body with multiple spring contact pins electrically connected to the board;
and a fastener, and by tightening the part of the performance board where the contact pad is provided to the pin implant body with the fastener, and pressing the contact pad and the spring contact pin into contact, the performance board and the pin electronics board can be connected to each other. This is a configuration for making electrical connection with.

[Function] Since the performance board is pressed into contact with the spring contact pins embedded in the pin mounting body, a large force is not required to attach or remove the performance board, making it easy to replace the performance board. It can be carried out.

Since the contact pad part of the performance board is tightened to the pin mounting body using a tightening tool, the contact pad and spring contact pin can be brought into stable contact without being affected by warping of the performance board, and a reliable electrical connection can be achieved. Can be maintained.

[Embodiments] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic cross-sectional view of the test head section of the IC test apparatus of the present invention, with the -- section omitted. FIG. 2 is a schematic plan view of the head portion. FIG. 3 is a sectional view taken along the line ■--■ in FIG. 2.

In each figure, reference numeral 10 denotes an outer frame of the test head section, and inside thereof a large number of pin electronics boards (pin electronics cards) 12 are arranged radially. A connector 14 is attached to one -1 end of each pin electronics board 12 in the -1 direction.

A base port 16 is made of an aluminum plate or the like and is fixed to an end of the outer frame 10.

A guard board (printed wiring board) 18 is fixed to this base port 16, and a connector 20 that is fitted to the connector 14 of the pin electronics board 12 is provided on the back surface thereof.

A pin planting ring (pin planting body) 22 is attached to the surface of the guard board 18. A large number of spring contact pins 24 are implanted in this pin implant ring 22 so as to penetrate through the front and back sides.

This spring contact pin 24 is movable in the axial direction at least at the negative end thereof, and is biased in the negative direction by a built-in spring (not shown).

The lower end of each spring contact pin 24 planted in the pin planting ring 22 is electrically connected to a wiring pattern (not shown) on the guard board 18 by soldering or the like, and is connected to the connector 20 through the wiring pattern. electrically connected. Therefore, connector 20 is
4, each spring contact pin 24 can be electrically connected to the pin electronics board 12.

26 is a performance board (printed wiring board), which needs to be replaced depending on the purpose of the test.

This performance board 26 is fixed to the base port 16 by being pressed against the L surface side of the pin planting ring 22 as shown in the figure by a pressing and fixing means to be described later. A contact pad (not shown) corresponding to each spring contact pin 24 of the pin implant ring 22 is provided on the back surface of the performance board 26, and is pressed into contact with the lower end of the corresponding spring contact pin 24 to provide electrical contact. are interconnected.

-6= With this connection, the performance board 26 and the pin electronics board 12 are connected to the spring contact pins 24.
, wiring pattern of guard board 18, and connector 1
They are electrically connected to each other via 4.20.

In addition, for the purpose of positioning the performance board 26, a positioning post 28 is provided to protrude from the pin-planting ring 22, and a positioning hole to fit with the positioning post 28 is formed in the performance board 26.

As described above, since the performance board 26 is pressed into contact with the spring contact pin 24, the performance board 26 is
Since less force is required to attach and detach the performance board 26, it is easy to replace the performance board 26.

In addition, the guard board 18 and the pin electronics board 1
Since the guard board 18 is connected to the guard board 18 by a connector, a large amount of force is required to attach and detach the guard board 18. However, since the pin planting ring 22 can be configured to be shared by multiple types of ρ puff 1-month boards 26, the guard board 18 does not need to be replaced frequently, unlike the performance board 26, and there is no particular problem in this respect. .

Here, the performance board 26 is fixed by pressing its periphery by a pressing and fixing means to be described later, but if the performance board 26 becomes large, the contact pads of the performance board 26 may warp due to the performance board 26 being warped. The contact between the spring contact pin 24 and the spring contact pin 24 tends to become unstable.

Therefore, in the present invention, the fastener 30 is used to tighten the central portion of the performance board 26 (spring pin 2
4)
is tightened to the pin planting ring 22.

This fastener 30 is attached to the performance board 26 from 1-
The holding ring 32 that comes into contact with the tightening ring 34
It has a structure in which it is rotatably coupled to the F side of the body by a predetermined angle. As shown in FIG. 3, this connection is performed by inserting an arcuate hole 31 formed in the holding ring 32 into an arcuate hole 31 which is widened on the do side.
Pass the coupling pin 33 from the F side and tighten it with the ring 3.
This is done by screwing it into 4.

The holding link 32 has a hole (not shown) through which the positioning post 28 can pass.

The clamping ring 34 is bored with an arcuate hole 36 associated with the positioning post 28 . The - end 36a of this arcuate hole 36 is enlarged to a size that allows the positioning post 28 to pass through, but the other part is covered by the roller 38 attached to the -1 end of the positioning post 28. The width is such that it does not allow penetration.

Further, a slope portion 40 is formed on one surface along the arcuate hole 36. The slope portion 40 is lowest at one end 36a of the arcuate hole 36 and gradually becomes higher toward the other end.

When tightening the performance board 26, one end 36a of the arc-shaped hole of the tightening ring 34 and the hole of the holding ring 32 are aligned, and the tightening shell 30 is placed on the performance board 26 with the hole aligned with the positioning post 28.

Then, when the tightening ring 34 is turned clockwise,
The roller 38 of the guide post 28 rolls on the fal surface 40, and the holding ring 32 is gradually pressed against the performance board 26 by the tightening ring 34.

Finally, by rotating the tightening ring 34 to the angle shown in FIG. It can be pressed in a stable manner.

When removing the performance board 26, turn the tightening ring 34 in the opposite direction to remove one end 36a of the arcuate hole 36.
to the positioning post 28. In this way, the fastener 30 can be removed toward the t side, and the performance board 26 can be removed by releasing the fixing by the pressing fixing means described later.

Next, the means for pressing and fixing the performance board 26 will be explained. This pressing and fixing means consists of an operating unit 46 fixed to the reinforcing frame 44 of the buff A-mans board 26 and a fixing unit 48 fixed to the base port 16, and two sets are provided as shown in the figure. .

Inside the operating unit 46, there is a bar (not shown) that moves horizontally forward and backward according to the rotation of the operating lever 50, and a roller is attached to the tip of the bar (not shown). On the other hand, a block (not shown) having a downward taper is provided inside the fixing unit 48.

When the operating lever 50 is tilted downward (as shown in the figure), the bar inside the operating unit 46 moves outward, and the roller at its tip rolls on the taper of the block within the fixed unit 48.
As a result, the bar inside the operating unit yt-46 is pushed in the F direction. In this way, the performance board 26 is pressed to the one side and fixed to the base board 16.

When the operating lever 50 is pulled out -1- and set up almost vertically,
The bar in the operating unit 46 is moved back, and the roller at its tip is removed from the block in the fixing unit 48. Therefore, the performance board 26 can be removed.

Although the embodiment 1-1 has been described below, the present invention is not limited thereto.

For example, the structure of the tightening shell may be modified as appropriate.

Further, in the above embodiment, the spring contact pin of the pin planting ring is connected to the pin electronics board via the guard board and its connector.
The connection structure can be changed as appropriate.

Further, in the above embodiment, the pin electronics substrates are arranged radially, but the present invention can be similarly applied to cases where the pin electronics boards are arranged linearly in the vertical and horizontal directions.

The means for pressing and fixing the performance board may also be changed as appropriate.

In addition to the above, the present invention may be modified in various ways without departing from the scope of the device.

[Effects of the Invention] As explained below, the present invention provides performance and board replacement for a plurality of pin electronics boards.
An IC test device that is electrically connected to a pin electronics board and has a pin mounting body in which a plurality of spring contact pins electrically connected to a pin electronics board are implanted, and a tightening shell, and has a performance By tightening the portion of the circuit board where the contact pad is provided to the pin mounting body using a tightening shell, and pressing the contact pad and spring contact pin into contact with each other,
Since the configuration makes electrical connection between the performance board and the pin electronics board, even if there are a large number of pin electronics boards, no manual effort is required to attach or remove the performance board, making it possible to easily replace the performance board. In addition, the contact pad and the spring contact pin can be brought into stable contact without being affected by warping of the performance board, and a reliable electrical connection can be maintained.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view showing the configuration of the main parts of the test head section of the IC test device of the present invention, with parts omitted. FIG. 2 is a schematic top view of the head section, and FIG. -III line sectional view. 12... Pin electronics board, 14... Connector, 16... Base port, 18... Guard board, 20... Connector, 22... Pin planting ring,
24... Spring contact pin, 26... Performance board, 28... Positioning post, 30...
...Tightening ring, 32...Pressure ring, 34...
tightening ring. Special jF 11th applicant
Hon Tomio

Claims (1)

[Claims] (1) A performance board is electrically connected to a multiple pin electronics board in a replaceable manner.
C test device, comprising a pin implant body in which a plurality of spring contact pins are implanted and electrically connected to the pin electronics board, and a tightening device, and the contact pad of the performance board is provided. The performance board and the pin electronics board are electrically connected by tightening the part of the spring contact pin to the pin implant body using the fastener, and pressing the contact pad and the spring contact pin into contact with each other. IC test equipment.