JPS6367580A - Ic testing device - Google Patents

Abstract

PURPOSE:To easily replace a performance substrate by pressing the performance substrate against spring contact pins connected electrically to plural pin electronic substrates and connecting electrically them. CONSTITUTION:Lower end parts of the respective spring contact pins 24 implanted in a pin-implanted ring 22 are connected to the wiring pattern (not shown in figure) of a guard board 18 by soldering, etc. This pattern is connected to a connector 20 and connected electrically to a pin electronic substrate 12 through the connector 14. The performance substrate 26 is pressed against the top surface side of the pin implanted ring 22 by a fixing means (not shown in figure) to connect a contact pad (not shown in figure) on the reverse surface of the substrate 26 to the upper end parts of the pins 24. Consequently, no large force is required to attach and detach the performance substrate 26 and its replacement is facilitated.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an IC test device, and more particularly,
This invention relates to improvements related to electrical connections between pin electronics boards and performance boards in IC test equipment.

[Prior Art] Generally, in an IC test device, a large number of pin electronics boards are arranged in a part called a test head, and a performance board according to the purpose is electrically connected to the pin electronics board in a replaceable manner. It looks like this.

Traditionally, electrical connections for this performance board are made by manually pressing the performance board onto the pin electronics board and mating the connectors on the pin electronics board with the corresponding connectors on the backside of the performance board. It is structured to do so.

[Problem to be solved] However, in the case of IC test equipment for testing ICs with many pins, the number of pin electronics boards increases significantly, and the number of connectors also increases accordingly, so it takes a large amount of force to insert and remove connectors. Therefore, there is a problem that it is not easy to replace the performance board.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an IC test device that allows easy replacement of performance boards.

[Means for Solving the Problems] In order to achieve the above object, the present invention provides an IC test device in which a performance board is replaceably electrically connected to a plurality of pin electronics boards. A pin mounting body with spring contact pins embedded therein is interposed between the pin electronics board and the performance board, and the spring pin contacts are electrically connected to the pin electronics board, and the performance board is pushed onto the spring contact pins. The performance board and the pin electronics board are electrically connected by attaching the spring contact pins and bringing the contact pads of the performance board into contact with the spring contact pins.

[Function] Since the performance board is pressed into contact with the spring contact pins embedded in the pin mounting body, a large force is not required to attach or remove the performance board, making it easy to replace the performance board. It can be carried out.

It should be noted that since the pin mounting body can be configured to be compatible with a plurality of types of performance boards, there is almost no need to replace it. Therefore, the electrical connection between the spring contact pin of the pin implant and the pin electronics board may be made by a connector connection or the like.

[Embodiment] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic cross-sectional view with a part of the test head section of the IC test apparatus of the present invention omitted. FIG. 2 is a schematic plan view of the head portion.

In each figure, 10 is an outer frame of the test head section, and a large number of pin electronics M& (pin electronics cards) 12 are arranged radially inside the outer frame. At the upper end of each pin electronics board 12,
The connector 14 is attached in the 1-direction.

A base port 16 is made of an aluminum plate or the like, and is fixed to the upper end of the outer frame 10.

A guard port (printed wiring board) 18 is fixed to this base port 16, and a connector 20 that is fitted to the connector 14 of the pin electronics board 12 is provided on the back surface thereof.

A pin planting ring (pin planting body) 22 is attached to the surface of the guard board 18. A large number of spring contact pins 24 are installed in this pin installation ring 22 so as to penetrate through the front and back sides thereof.

At least one end of the spring contact pin 24 is movable in the axial direction and is urged upward by a built-in spring (not shown).

The lower end of each spring contact pin 24 planted in the pin planting ring 22 is electrically connected to a wiring pattern (not shown) on the guard board 18 by soldering or the like, and is connected to the connector 20 through the wiring pattern. electrically connected. Therefore, connector 20 is
4, each spring contact pin 24 can be electrically connected to the pin electronics board 12.

26 is a performance board (printed wiring board), which needs to be replaced depending on the purpose of the test.

This performance board 26 is fixed to the base port 16 by being pressed against the upper surface side of the pin planting ring 22 as shown in the figure by a pressing and fixing means to be described later. A contact pad (not shown) corresponding to each spring contact pin 24 of the pin planting ring 22 is provided on the back surface of the performance board 26, and is pressed against one end of the corresponding spring contact pin 24. electrically interconnected. Through this connection, the performance board 26 and the pin electronics board 12 are electrically connected to each other via the spring contact pins 24, the wiring pattern of the guard board 18, and the connectors 14.degree.

In addition, for the purpose of positioning the performance board 26, a positioning post 28 is provided to protrude from the pin mounting ring 22, and a positioning hole that fits with the positioning post 28 is formed in the performance board 26.

As described above, since the performance board 26 is pressed into contact with the spring contact pin 24, the performance board 26 is
Since less force is required to attach and detach the performance board 26, it is easy to replace the performance board 26.

In addition, the guard board 18 and the pin electronics board 1
Since the guard board 18 is connected to the guard board 18 by a connector, a large amount of force is required to attach and detach the guard board 18. However, since the pin planting ring 22 can be configured to be shared by multiple types of performance boards 26, the guard board 18 does not need to be replaced frequently, unlike the performance boards 26 (this is not a particular problem).

Here, the performance board 26 is fixed by pressing its periphery by a fixing means, which will be described later. However, if the performance board 28 becomes large, the performance board 26 may warp, etc. The contact between the contact pad and the spring contact pin 24 tends to become unstable.

Therefore, in this embodiment, the central portion of the performance board 26 is tightened to the pin planting ring 22 by means of a tool 30.

This tightening tool 30 has a structure in which a holding ring 32 that comes into contact with the upper surface of the performance board 26 is attached to the lower surface side of the tightening ring 34 so as to be rotatable by a predetermined angle.

The holding ring 32 has a hole (not shown) through which the positioning post 28 can pass.

The tightening ring 34 is bored with an arcuate hole 36 associated with the positioning post 28. One end 38a of this arcuate hole 3B is enlarged to a size that allows the positioning post 28 to pass through, but the other portion does not allow the roller 38 attached to the upper end of the positioning post 28 to pass through. It has a width like that.

Further, for tightening, a sloped portion 40 is formed on the upper surface portion of the ring 34 along the arcuate hole 36. This slope portion 40 is
The height of the arcuate hole 36 gradually increases from one end 36a to the other end.

When tightening the performance board 26, the tightening is done between one end 3E3a of the arcuate hole of the ring 34 and the holding ring 32.
With the holes aligned, place the holes on the positioning post 28.
Place the tightening tool 30 on the performance board 2B accordingly.

To tighten, turn the ring 34 clockwise.
The roller 38 of the positioning post 28 rolls on the slope portion 40, and the holding ring 32 is gradually pressed against the performance board 26 by the tightening ring 34.

Finally, the performance board 28 is sufficiently tightened by rotating the ring 34 to the angle shown in FIG. It can be pressed in a stable manner.

When removing the performance board 26, tighten the ring 34 by turning it in the opposite direction and tightening the one end 36a of the arcuate hole 36.
align with the positioning post 28. In this way, since the tightening tool 30 can be removed upward, the performance board 26 can be removed by releasing the fixing by the fixing means for pressing, which will be described later.

Next, the means for pressing and fixing the performance board 26 will be explained. This pressing and fixing means consists of an operating unit 46 fixed to the reinforcing frame 44 of the performance board 28 and a fixing unit 48 fixed to the base port 16, and two sets are provided as shown.

Inside the operating unit 46, there is a bar (not shown) that moves horizontally back and forth in accordance with the rotation of the operating lever 5°, and a roller is attached to the tip of the bar (not shown). On the other hand, inside the fixing unit 48, a block (not shown) having a downwardly tapered surface is provided.

When the operating lever 50 is tilted horizontally as shown, the bar inside the operating unit 48 moves outward, and the roller at its tip moves along the tapered surface of the block within the fixed unit 48, resulting in the bar inside the operating unit 46 moving outward. The bar is pushed downward.

In this way, the performance board 26 is pressed downward and fixed to the base port 18.

When the operating lever 50 is pulled up to stand almost vertically, the bar within the operating unit 48 is moved back, and the roller at the tip of the solenoid is disengaged from the block within the fixing unit 48. therefore,
The performance board 26 can now be removed.

Although one embodiment has been described above, the present invention is not limited thereto.

For example, if there is no concern that the contact pads of the performance board and the spring pins will become unstable due to warping of the performance board, a tool can be omitted for tightening.

In the embodiments described above, the spring contact pins of the pin planting ring are connected to the pin electronics board via the guard board and its connector, but the connection structure may be changed as appropriate.

Further, in the above embodiment, the pin electronics substrates are arranged radially, but the present invention can be similarly applied to a case where the pin electronics boards are arranged vertically and horizontally along the a' line.

The fixing means for pressing the performance board can also be changed as appropriate.

In addition to the above, the present invention may be modified in various ways without departing from the spirit thereof.

[Effects of the Invention (1) As described above, the present invention provides an IC test device in which a performance board is electrically connected to a plurality of pin electronics boards in a replaceable manner.
A pin implant body with multiple spring contact pins implanted is interposed between the pin electronics board and the performance lambda plate, and the spring pin contacts are electrically connected to the pin electronics board, and the performance This is a configuration in which electrical connection is made between the performance board and the pin electronics board by pressing the board and bringing the contact pads of the performance board into contact with the spring contact pins, so when there are a large number of pin electronics boards. However, it does not require a large amount of force to attach and detach the performance board, and the performance board can be easily replaced.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view, with some parts omitted, showing the configuration of the main parts of a test head section of an IC test apparatus of the present invention, and FIG. 2 is a schematic top view of the head section. 12... Pin electronics board, 14... Connector, 16... Base port, 18... Guard board, 20... Connector, 22... Pin planting ring,
24... Spring contact pin, 26... Performance board, 30... Tightening tool.

Claims (1)

[Claims] (1) A performance board is electrically connected to a multiple pin electronics board in a replaceable manner.
C test device, in which a pin implant body in which a plurality of spring contact pins are implanted is interposed between the pin electronics board and the performance board, and the spring pin contacts are electrically connected to the pin electronics board. and electrically connecting the performance board and the pin electronics board by pressing the performance board onto the spring contact pins and bringing the contact pads of the performance board into contact with the spring contact pins. Features of IC test equipment.