JPS6373963U - - Google Patents

Info

Publication number
JPS6373963U
JPS6373963U JP1986167717U JP16771786U JPS6373963U JP S6373963 U JPS6373963 U JP S6373963U JP 1986167717 U JP1986167717 U JP 1986167717U JP 16771786 U JP16771786 U JP 16771786U JP S6373963 U JPS6373963 U JP S6373963U
Authority
JP
Japan
Prior art keywords
semiconductor laser
laser device
bonding electrode
letter
top surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986167717U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986167717U priority Critical patent/JPS6373963U/ja
Publication of JPS6373963U publication Critical patent/JPS6373963U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の平面図、第２図は
第１図の半導体レーザ素子をヒートシンクにマウ
ントした状態を示す斜視図、第３図は従来の半導
体レーザ素子の平面図、第４図は第３図のレーザ
素子をヒートシンクにマウントした状態を示す斜
視図である。 １，１１……ボンデイング側電極、２……電極
空白部分、３……活性部、４……ワイヤボンデイ
ング部、５……主レーザ光、６……モニター光、
７……ヒートシンク、８……ボンデイング線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 素子本体上面にボンデイング用電極が形成され
    ている半導体レーザ素子において、前記ボンデイ
    ング用電極は四角形の一つの隅の部分を除いたＬ
    字形パターンに形成されていることを特徴とする
    半導体レーザ素子。
JP1986167717U 1986-10-30 1986-10-30 Pending JPS6373963U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986167717U JPS6373963U (ja) 1986-10-30 1986-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986167717U JPS6373963U (ja) 1986-10-30 1986-10-30

Publications (1)

Publication Number Publication Date
JPS6373963U true JPS6373963U (ja) 1988-05-17

Family

ID=31099908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986167717U Pending JPS6373963U (ja) 1986-10-30 1986-10-30

Country Status (1)

Country Link
JP (1) JPS6373963U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161389A (ja) * 1982-03-19 1983-09-24 Fujitsu Ltd 光半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161389A (ja) * 1982-03-19 1983-09-24 Fujitsu Ltd 光半導体装置

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