JPS63119240U - - Google Patents

Info

Publication number
JPS63119240U
JPS63119240U JP1987011305U JP1130587U JPS63119240U JP S63119240 U JPS63119240 U JP S63119240U JP 1987011305 U JP1987011305 U JP 1987011305U JP 1130587 U JP1130587 U JP 1130587U JP S63119240 U JPS63119240 U JP S63119240U
Authority
JP
Japan
Prior art keywords
capillary
wire bonding
identification display
utility
outer peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987011305U
Other languages
English (en)
Other versions
JPH056656Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987011305U priority Critical patent/JPH056656Y2/ja
Publication of JPS63119240U publication Critical patent/JPS63119240U/ja
Application granted granted Critical
Publication of JPH056656Y2 publication Critical patent/JPH056656Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例に係るワイヤボンデイ
ング用キヤピラリーを示す斜視図、第２図〜第６
図はそれぞれ本考案の他の実施例を示す斜視図で
ある。第７図は従来のワイヤボンデイング用キヤ
ピラリーを示す斜視図である。第８図は本考案実
施例に係るワイヤボンデイング用キヤピラリーを
ホルダーに取付けた状態を示す側面図である。 １０，２０，３０，４０，５０，６０：キヤピ
ラリー、１１，２１，３１，４１，５１，６１：
識別表示部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 外周面に識別表示部を形成したことを特徴とす
    るワイヤボンデイング用キヤピラリー。
JP1987011305U 1987-01-28 1987-01-28 Expired - Lifetime JPH056656Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987011305U JPH056656Y2 (ja) 1987-01-28 1987-01-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987011305U JPH056656Y2 (ja) 1987-01-28 1987-01-28

Publications (2)

Publication Number Publication Date
JPS63119240U true JPS63119240U (ja) 1988-08-02
JPH056656Y2 JPH056656Y2 (ja) 1993-02-19

Family

ID=30798398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987011305U Expired - Lifetime JPH056656Y2 (ja) 1987-01-28 1987-01-28

Country Status (1)

Country Link
JP (1) JPH056656Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231006A (ja) * 1994-02-16 1995-08-29 Nec Corp ワイヤボンディング装置
JP2011502232A (ja) * 2007-10-29 2011-01-20 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電磁弁用のプランジャ、および、電磁弁用のプランジャの識別方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231006A (ja) * 1994-02-16 1995-08-29 Nec Corp ワイヤボンディング装置
JP2011502232A (ja) * 2007-10-29 2011-01-20 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電磁弁用のプランジャ、および、電磁弁用のプランジャの識別方法

Also Published As

Publication number Publication date
JPH056656Y2 (ja) 1993-02-19

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