JPS633149U - - Google Patents

Info

Publication number
JPS633149U
JPS633149U JP1986097523U JP9752386U JPS633149U JP S633149 U JPS633149 U JP S633149U JP 1986097523 U JP1986097523 U JP 1986097523U JP 9752386 U JP9752386 U JP 9752386U JP S633149 U JPS633149 U JP S633149U
Authority
JP
Japan
Prior art keywords
capillary
wire
wire bonding
utility
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986097523U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986097523U priority Critical patent/JPS633149U/ja
Publication of JPS633149U publication Critical patent/JPS633149U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78308—Removable capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るワイヤボンデイング用キ
ヤピラリーを示す斜視図、第２図ａは本考案に係
るワイヤボンデイング用キヤピラリーを装着した
ホルダーを示す断面図、第２図ｂは同図ａ中のＡ
部の拡大断面図である。第３図、第４図はそれぞ
れ本考案に係る他の実施例を示す斜視図である。
第５図は従来のワイヤボンデイング用キヤピラリ
ーを示す斜視図、第６図は従来のワイヤボンデイ
ング用キヤピラリーを装着したホルダーを示す斜
視図である。 １，１０，１１，１２：キヤピラリー、２：ホ
ルダー、３：ネジ。

Claims (1)

    【実用新案登録請求の範囲】
  1. ワイヤを送出する貫通孔を備えたキヤピラリー
    のシヤンク部に係止部を形成したことを特徴とす
    るワイヤボンデイング用キヤピラリー。
JP1986097523U 1986-06-24 1986-06-24 Pending JPS633149U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986097523U JPS633149U (ja) 1986-06-24 1986-06-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986097523U JPS633149U (ja) 1986-06-24 1986-06-24

Publications (1)

Publication Number Publication Date
JPS633149U true JPS633149U (ja) 1988-01-11

Family

ID=30964548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986097523U Pending JPS633149U (ja) 1986-06-24 1986-06-24

Country Status (1)

Country Link
JP (1) JPS633149U (ja)

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