JPS6372879U

JPS6372879U -

Info

Publication number: JPS6372879U
Application number: JP16583186U
Authority: JP
Priority date: 1986-10-30
Filing date: 1986-10-30
Publication date: 1988-05-16

Description

[Brief explanation of the drawing]

第１図乃至第４図は本考案の第１実施例を、第
５図乃至第７図は本考案の第２実施例を、第８図
乃至第１１図は従来のＩＣソケツトを夫々示し、
第１図はＩＣソケツトの断面図、第２図はＩＣソ
ケツトの斜視図、第３図はソケツト本体の分解斜
視図、第４図はフレキシブル性導電体の一部拡大
断面図、第５図はＩＣソケツトの断面図、第６図
は第５図の一部拡大断面図、第７図は凹部の拡大
断面図、第８図はフラツト用ＩＣソケツトの側面
図、第９図イ，ロはフラツト型ＩＣパツケージの
斜視図、第１０図はデイツプ用ＩＣソケツトの断
面図、第１１図はデイツプ型ＩＣパツケージの斜
視図である。１，１′…ソケツト本体、１ａ…収容部、２…
押さえカバー、３…ロツクレバー、４…フレキシ
ブル性導電体、５…押さえ板、６…弾性体、１１
…基板、１２…導体、１３…保護膜、１５，１７
…ＩＣパツケージ、１６…リード端子。 FIGS. 1 to 4 show a first embodiment of the present invention, FIGS. 5 to 7 show a second embodiment of the present invention, and FIGS. 8 to 11 show a conventional IC socket.
Fig. 1 is a sectional view of the IC socket, Fig. 2 is a perspective view of the IC socket, Fig. 3 is an exploded perspective view of the socket body, Fig. 4 is a partially enlarged sectional view of the flexible conductor, and Fig. 5 is a perspective view of the IC socket. 6 is a partially enlarged sectional view of FIG. 5, FIG. 7 is an enlarged sectional view of the recess, FIG. 8 is a side view of the IC socket for flat, and FIG. 9 A and B are for flat IC sockets. FIG. 10 is a sectional view of a dip-type IC socket, and FIG. 11 is a perspective view of the dip-type IC package. 1, 1'...Socket body, 1a...Accommodating part, 2...
Holding cover, 3... Lock lever, 4... Flexible conductor, 5... Holding plate, 6... Elastic body, 11
...Substrate, 12...Conductor, 13...Protective film, 15, 17
...IC package cage, 16...Lead terminal.

補正昭６２．２．１６図面の簡単な説明を次のように補正する。明細書第１２頁３行目の「イ，ロ」を「Ａ，Ｂ
」に訂正する。Amendment February 16, 1982 The brief description of the drawing is amended as follows. Change “A, B” to “A, B” on page 12, line 3 of the specification.
” is corrected.

Claims

[Scope of utility model registration request]

a socket body provided with a housing portion for housing an IC package; a flexible conductor disposed in the housing portion of the socket body and in contact with lead terminals of the housed IC package; An IC socket characterized by comprising an elastic body that is placed in contact with a body and elastically connects the lead terminal and the conductor.