JPS6371543U - - Google Patents
Info
- Publication number
- JPS6371543U JPS6371543U JP16581986U JP16581986U JPS6371543U JP S6371543 U JPS6371543 U JP S6371543U JP 16581986 U JP16581986 U JP 16581986U JP 16581986 U JP16581986 U JP 16581986U JP S6371543 U JPS6371543 U JP S6371543U
- Authority
- JP
- Japan
- Prior art keywords
- aluminum nitride
- substrate
- joint
- nitride substrate
- alumina substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 238000005219 brazing Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
Landscapes
- Ceramic Products (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986165819U JPH0739236Y2 (ja) | 1986-10-30 | 1986-10-30 | アルミナ質基板と窒化アルミニウム基板の接合部 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986165819U JPH0739236Y2 (ja) | 1986-10-30 | 1986-10-30 | アルミナ質基板と窒化アルミニウム基板の接合部 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6371543U true JPS6371543U (enrdf_load_stackoverflow) | 1988-05-13 |
| JPH0739236Y2 JPH0739236Y2 (ja) | 1995-09-06 |
Family
ID=31096208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986165819U Expired - Lifetime JPH0739236Y2 (ja) | 1986-10-30 | 1986-10-30 | アルミナ質基板と窒化アルミニウム基板の接合部 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739236Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0354173A (ja) * | 1989-07-21 | 1991-03-08 | Ngk Spark Plug Co Ltd | ヒートシンク付きセラミックパッケージ |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59148384A (ja) * | 1983-02-14 | 1984-08-25 | イビデン株式会社 | 電子回路用炭化珪素質基板およびその製造方法 |
| JPS59182281A (ja) * | 1983-03-26 | 1984-10-17 | 新明和工業株式会社 | 拡散接合方法 |
| JPS6077178A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | 窒化物セラミックス接合体およびその製造方法 |
-
1986
- 1986-10-30 JP JP1986165819U patent/JPH0739236Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59148384A (ja) * | 1983-02-14 | 1984-08-25 | イビデン株式会社 | 電子回路用炭化珪素質基板およびその製造方法 |
| JPS59182281A (ja) * | 1983-03-26 | 1984-10-17 | 新明和工業株式会社 | 拡散接合方法 |
| JPS6077178A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | 窒化物セラミックス接合体およびその製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0354173A (ja) * | 1989-07-21 | 1991-03-08 | Ngk Spark Plug Co Ltd | ヒートシンク付きセラミックパッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739236Y2 (ja) | 1995-09-06 |