JPS6370487A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS6370487A JPS6370487A JP21466786A JP21466786A JPS6370487A JP S6370487 A JPS6370487 A JP S6370487A JP 21466786 A JP21466786 A JP 21466786A JP 21466786 A JP21466786 A JP 21466786A JP S6370487 A JPS6370487 A JP S6370487A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- manufacture
- punching
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000004080 punching Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- -1 sulfo- Chemical class 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気機器、電子機Ｒｇ、計Ｘ機器、通信機器等
に用いられるプリント配線板の製造方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method of manufacturing a printed wiring board used for electrical equipment, electronic equipment Rg, total X equipment, communication equipment, etc.
従来、両面ス／ｖｙｉ−μプリント′ｒ２腺板において
スルホ−ｙ部分の加工はトリ／Ｌ／ Ｋよって一般的に
おこなわれているが、一部において生産性等の面からパ
ンチング加工によってスルホール部分の加工をおこなう
こともなされている。しかしスμホールをこのようにパ
ンチングでおこなうと、半田付は時にスルホ−μ内にお
いてプローホーμが多数発生し、とのことが問題になる
。すなわちパンチング加工によるスルホール穴壁面は粗
面で非常に吸湿しやすく、半田付時に半田接着性を低下
させ、半田凝固時に下地からの蒸発水分で半田にピンホ
ーμを発生させプローホーμとなシブリント配線板に導
通不良を発生させていた。Conventionally, the processing of the through-hole parts in double-sided S/VYI-μ print 'r2 gland plates has been generally carried out by Tori/L/K, but in some cases, the through-hole parts have been processed by punching from the viewpoint of productivity. Processing has also been carried out. However, when the holes are punched in this manner, a problem arises in that a large number of holes .mu. are generated within the holes during soldering. In other words, the wall surface of the through-hole hole formed by punching is a rough surface that easily absorbs moisture, which reduces solder adhesion during soldering, and when the solder solidifies, moisture evaporates from the base and causes pinhole μ in the solder, resulting in proho μ on the shiblint wiring board. This caused continuity defects.
本発明は、上記の点に濫みて為されたものであシ、パン
チング加工によってスμホールを設けるにあたってプロ
ーホーμの発生を低減することができるプリント配線板
の製造方法を提供することを目的とするものである。The present invention has been made in view of the above points, and an object of the present invention is to provide a method for manufacturing a printed wiring board that can reduce the occurrence of plow holes when forming holes by punching. It is something to do.
本発明はパンチング加工によるスルホ−μ部分に無電解
鍍金及び必要に応じて電解鍍金を施したプリント配線基
板を１１０〜２００℃に加熱してから所要部分に半田付
することを特徴とするプリント配線板の製造方法で、ス
〃ホーｙ穴壁面に蓄積されている吸湿水分を１１０〜２
００″Ｃに加熱することによって除去できるのでプロー
ホー〃のないプリント配線板を得ることができるもので
、以下本発明の詳細な説明する。The present invention is characterized in that a printed wiring board on which through-μ parts by punching are subjected to electroless plating and optionally electrolytic plating is heated to 110 to 200°C and then soldered to desired parts. In the manufacturing method of the board, the hygroscopic moisture accumulated on the wall surface of the holes is reduced to 110~2
Since it can be removed by heating to 00''C, it is possible to obtain a printed wiring board free of protrusions.The present invention will be described in detail below.
プリント配線基板は、紙やガフス布々ど基材にフェノ−
μ樹脂やエボキＶ′ＩｆＩ！脂などの熱硬化性樹脂を含
浸して乾燥することで調製したプリプレグを複数枚重ね
、さらにこの両側に銅箔などの金属箔を重ねて加熱加圧
成形することによって、積層板の表裏面に金属箔が漬層
接着されたものとして得られる。そして金属箔をエツチ
ングしてプリント配線基板にサブトラクテイブ法で回路
を形成させることによってプリント配線板に仕上げられ
る。Printed wiring boards are made of phenol on base materials such as paper and gaff cloth.
μ resin and EBOKI V'IfI! By layering multiple sheets of prepreg prepared by impregnating and drying thermosetting resin such as oil, and then layering metal foil such as copper foil on both sides and forming under heat and pressure, the front and back surfaces of the laminate are coated. The metal foil is obtained by dipping and bonding. The printed wiring board is then finished by etching the metal foil and forming a circuit on the printed wiring board using a subtractive method.
一方、プリント配線基板にはスルホ−μが設けられるが
、本発明においてはこのスルホ−ρは金型によるパンチ
ングで加工される。On the other hand, a printed wiring board is provided with a sulfo-μ, and in the present invention, this sulfo-ρ is processed by punching with a mold.
そしてこのよりにパンチングでスルホール加工したプリ
ント配Ｉ９基板のスルホール部分に無電解鍍金及びｙ）
要に応じて電解鍍金を施したプリント配線基板の所要部
分をフローソルダー等で半田付するのであるが、この半
田付を打なう酎にプリント配線基板を１１０〜２００°
Ｃに加熱しスルホール穴壁面にｆｆｌされている吸湿水
分を除去するものである。加熱が１１０℃禾満では吸湿
水分は殆んど９発することがシ＜、２００”Ｃをこえる
とプリント配線基板の寸法安定性、！ｉシが悪くなる。Then, electroless plating was applied to the through-hole portions of the printed wiring board I9, which had been processed through-holes by punching.
The required parts of the electrolytically plated printed wiring board are soldered using flow solder, etc., as required.
It is heated to C and removes the hygroscopic moisture that is ffl on the wall surface of the through hole. If the heating temperature exceeds 110°C, most of the absorbed moisture will be released.If the heating temperature exceeds 200''C, the dimensional stability of the printed wiring board will deteriorate.
従って最も好ましいのは１５０〜１８０°Ｃに加熱する
ことである。加熱方法については好ましくはプリント配
線基板の上部から赤外機加熱する方式が望ましい。Therefore, heating to 150-180°C is most preferred. As for the heating method, it is preferable to use infrared heating from the top of the printed wiring board.
次に本発明を実施例によってさらに説明する。Next, the present invention will be further explained by examples.
実施例１
厚み１．６藺の両面銅張紙フェノー１Ｉ／債層板（松下
電工株式会社！ＡＲ８７０５）をプリント配線基板とし
て用い、これに金型パンチングしてスルホ−ρを設けた
。次にこのプリント配線ユ板（′Ｃ無電解メッキと電解
メッキとをシとなって鋼メッキを施すことｔでよって、
合計厚みあμのスμホー〜メフキを設けた。次いでプリ
ント配線基板の銅箔をエツチングして回路形成したのち
にソルダーレジストを塗布し、硬化させた。次にプリン
ト配線基板上部から赤外線加熱し基板表面温度を１５０
℃に加熱してからフローソルダーで半田付した。Example 1 A double-sided copper-clad paper phenol I/bond board (Matsushita Electric Works Co., Ltd.! AR8705) having a thickness of 1.6 mm was used as a printed wiring board, and a sulfo-rho was provided on it by die punching. Next, this printed wiring board (by applying steel plating by combining electroless plating and electrolytic plating),
A screen with a total thickness of Aμ was provided. Next, after etching the copper foil of the printed wiring board to form a circuit, a solder resist was applied and cured. Next, infrared heat is applied from the top of the printed wiring board to raise the board surface temperature to 150°C.
It was heated to ℃ and soldered using flow solder.
実施例２
実施例１と同じプリント配線基板を用い、基板表面温度
を１８０″Ｃに加熱した以外は実施例１と同様に処理し
た。Example 2 The same printed wiring board as in Example 1 was used, and the same process as in Example 1 was carried out except that the board surface temperature was heated to 180''C.
比較例
実施例１と同じプリント配線基板を月い、基板下部から
パイプヒーターで加熱し基板表面温度を８０℃に加熱し
てからフローソルダーで半田付 した。Comparative Example The same printed wiring board as in Example 1 was heated from the bottom of the board with a pipe heater to a board surface temperature of 80°C, and then soldered with a flow solder.
実施例１と２及び比較例のプリン）＋Ｓ！１１基板のグ
ローホー！発生率は第１表のようであった。Pudding of Examples 1 and 2 and Comparative Example) +S! 11 board glow ho! The incidence rate was as shown in Table 1.
第１表
〔発明の効果〕
上述のように本発明にあっては、プリント配線基板のス
μホー！部分をパンチングで加工したのちスｙホーｙ部
分に無フと解鍍金等を施した後、１１０〜２００°Ｃに
加熱してから所要部分に半田付するようにしたので、ス
ルホ−μの内周から揮発分を事剪に除去することができ
、揮発分が半田付は時の高温の作用で出ることによって
発生すると考えられるプローホーｙを低減することがで
きるものである。Table 1 [Effects of the Invention] As mentioned above, in the present invention, the speed of the printed wiring board is improved. After processing the part by punching, we applied non-filling and deplating to the su-ho-y part, and then heated it to 110 to 200°C before soldering to the required part, so that the inner part of the sulfo-μ It is possible to thoroughly remove volatile matter from the periphery, and it is possible to reduce pro-ho y, which is thought to occur when volatile matter comes out due to the action of high temperatures during soldering.
Claims (2)
金及び必要に応じて電解鍍金を施したプリント配線基板
を、１１０〜２００℃に加熱してから所要部分に半田付
することを特徴とするプリント配線板の製造方法。(1) A printed wiring board characterized in that a printed wiring board with electroless plating and, if necessary, electrolytic plating applied to the through-hole portions formed by punching, is heated to 110 to 200°C and then soldered to the required parts. manufacturing method.
を特徴とする特許請求の範囲第１項記載のプリント配線
板の製造方法。(2) The method for manufacturing a printed wiring board according to claim 1, wherein the printed wiring board is heated by infrared rays from above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21466786A JPS6370487A (en) | 1986-09-11 | 1986-09-11 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21466786A JPS6370487A (en) | 1986-09-11 | 1986-09-11 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6370487A true JPS6370487A (en) | 1988-03-30 |
Family
ID=16659571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21466786A Pending JPS6370487A (en) | 1986-09-11 | 1986-09-11 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6370487A (en) |
-
1986
- 1986-09-11 JP JP21466786A patent/JPS6370487A/en active Pending
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