JPS637027B2 - - Google Patents

Info

Publication number
JPS637027B2
JPS637027B2 JP57172660A JP17266082A JPS637027B2 JP S637027 B2 JPS637027 B2 JP S637027B2 JP 57172660 A JP57172660 A JP 57172660A JP 17266082 A JP17266082 A JP 17266082A JP S637027 B2 JPS637027 B2 JP S637027B2
Authority
JP
Japan
Prior art keywords
chip
lead rod
recess
manufacturing
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57172660A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5961952A (ja
Inventor
Sadao Umetsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toho Kinzoku Co Ltd
Original Assignee
Toho Kinzoku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toho Kinzoku Co Ltd filed Critical Toho Kinzoku Co Ltd
Priority to JP57172660A priority Critical patent/JPS5961952A/ja
Publication of JPS5961952A publication Critical patent/JPS5961952A/ja
Publication of JPS637027B2 publication Critical patent/JPS637027B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57172660A 1982-09-30 1982-09-30 半導体用部品の製造方法 Granted JPS5961952A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57172660A JPS5961952A (ja) 1982-09-30 1982-09-30 半導体用部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57172660A JPS5961952A (ja) 1982-09-30 1982-09-30 半導体用部品の製造方法

Publications (2)

Publication Number Publication Date
JPS5961952A JPS5961952A (ja) 1984-04-09
JPS637027B2 true JPS637027B2 (https=) 1988-02-15

Family

ID=15946010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57172660A Granted JPS5961952A (ja) 1982-09-30 1982-09-30 半導体用部品の製造方法

Country Status (1)

Country Link
JP (1) JPS5961952A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4237696A (en) * 1994-11-15 1996-06-06 Formfactor, Inc. Mounting spring elements on semiconductor devices, and wafer-level testing methodology
KR100252457B1 (ko) * 1995-05-26 2000-04-15 이고르 와이. 칸드로스 캔틸레버 요소및 희생기층을 사용하는 상호 접속요소의 제작방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756530Y2 (https=) * 1977-07-14 1982-12-04
JPS5550647A (en) * 1978-10-03 1980-04-12 Aaru Jii Toomasu Corp Semiconductor member and method of assembling same

Also Published As

Publication number Publication date
JPS5961952A (ja) 1984-04-09

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