JPS636843A - 基板現像処理方法 - Google Patents

基板現像処理方法

Info

Publication number
JPS636843A
JPS636843A JP14820886A JP14820886A JPS636843A JP S636843 A JPS636843 A JP S636843A JP 14820886 A JP14820886 A JP 14820886A JP 14820886 A JP14820886 A JP 14820886A JP S636843 A JPS636843 A JP S636843A
Authority
JP
Japan
Prior art keywords
substrate
wafer
treating solution
cylindrical body
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14820886A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0334207B2 (enrdf_load_html_response
Inventor
Katsuhiro Yoshida
勝洋 吉田
Moritaka Yano
守隆 矢野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP14820886A priority Critical patent/JPS636843A/ja
Publication of JPS636843A publication Critical patent/JPS636843A/ja
Publication of JPH0334207B2 publication Critical patent/JPH0334207B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP14820886A 1986-06-26 1986-06-26 基板現像処理方法 Granted JPS636843A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14820886A JPS636843A (ja) 1986-06-26 1986-06-26 基板現像処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14820886A JPS636843A (ja) 1986-06-26 1986-06-26 基板現像処理方法

Publications (2)

Publication Number Publication Date
JPS636843A true JPS636843A (ja) 1988-01-12
JPH0334207B2 JPH0334207B2 (enrdf_load_html_response) 1991-05-21

Family

ID=15447681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14820886A Granted JPS636843A (ja) 1986-06-26 1986-06-26 基板現像処理方法

Country Status (1)

Country Link
JP (1) JPS636843A (enrdf_load_html_response)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5279926A (en) * 1992-05-06 1994-01-18 International Business Machines Corporation Method and apparatus for removing vapor from a pressurized sprayed liquid in the manufacture of semiconductor integrated circuits
JP2003514379A (ja) * 1999-11-10 2003-04-15 セミトゥール・インコーポレイテッド 半導体ウェハ処理用反応炉
US7267129B2 (en) 1999-04-28 2007-09-11 Sez Ag Device and process for liquid treatment of wafer-shaped articles
JP2009277872A (ja) * 2008-05-14 2009-11-26 Tokyo Electron Ltd 基板処理装置、基板処理方法、塗布、現像装置及び記憶媒体
JP2009277870A (ja) * 2008-05-14 2009-11-26 Tokyo Electron Ltd 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
US7799695B2 (en) 2000-10-31 2010-09-21 Lam Research Ag Device for liquid treatment of wafer-shaped articles
JP2011139099A (ja) * 2011-03-31 2011-07-14 Dainippon Screen Mfg Co Ltd 基板周縁処理装置および基板周縁処理方法
JP2011159989A (ja) * 2011-03-31 2011-08-18 Dainippon Screen Mfg Co Ltd 基板周縁処理装置および基板周縁処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61162859U (enrdf_load_html_response) * 1985-03-29 1986-10-08
JPS6262869U (enrdf_load_html_response) * 1985-10-07 1987-04-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61162859U (enrdf_load_html_response) * 1985-03-29 1986-10-08
JPS6262869U (enrdf_load_html_response) * 1985-10-07 1987-04-18

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5279926A (en) * 1992-05-06 1994-01-18 International Business Machines Corporation Method and apparatus for removing vapor from a pressurized sprayed liquid in the manufacture of semiconductor integrated circuits
US7267129B2 (en) 1999-04-28 2007-09-11 Sez Ag Device and process for liquid treatment of wafer-shaped articles
US7726323B2 (en) 1999-04-28 2010-06-01 Lam Research Ag Device and process for liquid treatment of wafer-shaped articles
JP2003514379A (ja) * 1999-11-10 2003-04-15 セミトゥール・インコーポレイテッド 半導体ウェハ処理用反応炉
US7799695B2 (en) 2000-10-31 2010-09-21 Lam Research Ag Device for liquid treatment of wafer-shaped articles
US7988818B2 (en) 2000-10-31 2011-08-02 Lam Research Ag Device for liquid treatment of wafer-shaped articles
JP2009277872A (ja) * 2008-05-14 2009-11-26 Tokyo Electron Ltd 基板処理装置、基板処理方法、塗布、現像装置及び記憶媒体
JP2009277870A (ja) * 2008-05-14 2009-11-26 Tokyo Electron Ltd 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
JP2011139099A (ja) * 2011-03-31 2011-07-14 Dainippon Screen Mfg Co Ltd 基板周縁処理装置および基板周縁処理方法
JP2011159989A (ja) * 2011-03-31 2011-08-18 Dainippon Screen Mfg Co Ltd 基板周縁処理装置および基板周縁処理方法

Also Published As

Publication number Publication date
JPH0334207B2 (enrdf_load_html_response) 1991-05-21

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees