JPS6367289B2 - - Google Patents
Info
- Publication number
- JPS6367289B2 JPS6367289B2 JP56030824A JP3082481A JPS6367289B2 JP S6367289 B2 JPS6367289 B2 JP S6367289B2 JP 56030824 A JP56030824 A JP 56030824A JP 3082481 A JP3082481 A JP 3082481A JP S6367289 B2 JPS6367289 B2 JP S6367289B2
- Authority
- JP
- Japan
- Prior art keywords
- organic
- mixing
- nickel
- conductive paste
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 239000004973 liquid crystal related substance Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 150000002472 indium compounds Chemical class 0.000 claims description 9
- 150000003606 tin compounds Chemical class 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 14
- 239000011521 glass Substances 0.000 description 13
- CUJRVFIICFDLGR-UHFFFAOYSA-N acetylacetonate Chemical compound CC(=O)[CH-]C(C)=O CUJRVFIICFDLGR-UHFFFAOYSA-N 0.000 description 6
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- -1 (acac) 3 Chemical class 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229940007550 benzyl acetate Drugs 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- PWEVMPIIOJUPRI-UHFFFAOYSA-N dimethyltin Chemical compound C[Sn]C PWEVMPIIOJUPRI-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
Description
本発明は、ガラス、セラミツク等の絶縁基板上
に塗布し、450℃〜500℃の低温で焼成して、基板
との密着性が優れた導電体層を形成できる導電性
ペースト特に液晶表示装置に使用して好適な導電
性ペーストに関する。
ガラス、セラミツク等の絶縁基板上に塗布後、
450℃〜500℃の低温で焼成して導電体層を形成す
るための従来の導電性ペーストは、銀、金、白
金、パラジウム、ニツケル、銅等の金属粉末と、
ガラスフリツトとを有機ビヒクル中に混合分散さ
せて作成していた。しかし、従来のこの種ペース
トを、スクリーン印刷等により所定形状にガラス
などの絶縁基板上に塗布し、約500℃で焼成して
作成した導電体層は、シート抵抗値は小さく導電
性に優れたものであつたが、基板との密着性が弱
く、信頼性に欠けていた。従つて、従来の導電ペ
ーストを、外部電源との接続配線材として使用し
作成された液晶表示装置は、信頼性の乏しいもの
であつた。ここで、液晶表示装置について簡単に
説明する。第1図は、液晶表示装置の断側面図
で、液晶表示装置は、表面にIn2O3等の金属酸化
物からなる透明電極1,1aを有する、少なくと
も一方が透明に互に対向した2枚のガラス等から
なる絶縁基板2,2aの間隙に、液晶物質3をガ
ラスフリツト4により封入した構造になつてい
る。5,5aは、それぞれ透明電極1,1aと外
部電源6との接続配線部である。該接続配線部
5,5aの絶縁基板2,2aとの密着性が良くな
いと、接続配線部5,5aの導電性が損なわれる
ばかりでなく、密着性の悪るい部分から湿気が入
り液晶物質3に悪影響を与え、表示装置の寿命が
著しく短かくする。又、従来の導電性ペーストに
は、ガラスフリツトが含まれており、該ガラスフ
リツトが、450℃〜500℃で焼成されるとき、
In2O3等の金属酸化物からなる透明電極1,1a
を喰つてしまい導電性が破壊され易すく、液晶表
示装置の製造歩留りが極端に低下する欠点があつ
た。
本発明の目的は、叙上の従来の欠点を解消し、
導電性に優れ、ガラス等の絶縁基板との密着性が
良い導電体層を提供し、信頼性の高い液晶表示装
置を提供することである。
本発明の特徴は、銀、ニツケル等の金属粉末
と、有機インジウム化合物、又は有機スズ化合
物、又はこれらの混合物と、有機ビヒクルとを混
合してペースト化したことである。
本発明ペーストを、ガラスなどの絶縁基板上に
塗布した後450℃〜500℃で焼成して得られる導電
体層は、シート抵抗値が小さく、基板との接着強
度大であつた。これは、有機インジウム化合物、
又は有機スズ化合物又はこれら混合物の焼成によ
り生成するIn2O3又はSnO2又はこれらの混合物
が、金属粉末とガラス等の絶縁基板材質との無機
バインダーとして働き密着性が向上したためと考
えられる。
本発明導電性ペースト作成にあたつては、ま
ず、テトラアセチルアセトナートインジウムIn
(acac)3等の有機インジウム化合物、又はジメチ
ルスズアセトープ(CH3)Sn(acac)2等の有機ス
ズ化合物、又はこれらの混合物を有機溶媒に溶解
し、さらにエチルセルローズ、ニトロセルローズ
等の粘性剤を添加し混合してビヒクルを作る。こ
れに銀、ニツケル、白金、パラジウム等の金属粉
末を添加混合分散させて、導電性ペーストを作成
する。なお、有機溶媒としては、2−エチルヘキ
サノール、ベンジルアルコール等の高沸点アルコ
ール類、ブチルセロソルブ、ブチルカルビトール
等の高沸点エーテル類、ベンヂルアセテート、ジ
メチルフタレート等の高沸点エステル類等が適用
できる。
本発明ペーストは、液晶表示装置の透明電極の
組成物であるIn2O3又はSnO2を含有しており、さ
らに、ガラスフリツトを含んでいないので、液晶
表示装置の透明電極と外部電極との接続配線部材
として用いた場合、透明電極とも、基板とも密着
性が優れ、導電性を良く、又透明電極を喰うこと
も全くなく従つて信頼性の高い液晶表示装置を歩
The present invention is a conductive paste that can be coated on an insulating substrate such as glass or ceramic and fired at a low temperature of 450°C to 500°C to form a conductive layer with excellent adhesion to the substrate, especially for liquid crystal display devices. The present invention relates to a conductive paste suitable for use. After coating on an insulating substrate such as glass or ceramic,
Conventional conductive pastes for forming conductive layers by firing at low temperatures of 450°C to 500°C are made of metal powders such as silver, gold, platinum, palladium, nickel, copper, etc.
It was made by mixing and dispersing glass frit in an organic vehicle. However, the conventional conductor layer created by applying this type of paste into a predetermined shape onto an insulating substrate such as glass by screen printing etc. and baking it at approximately 500℃ has a low sheet resistance value and excellent conductivity. However, it had poor adhesion to the substrate and lacked reliability. Therefore, a liquid crystal display device manufactured using conventional conductive paste as a wiring material for connection with an external power source has poor reliability. Here, the liquid crystal display device will be briefly explained. FIG. 1 is a cross - sectional side view of a liquid crystal display device. It has a structure in which a liquid crystal material 3 is sealed with a glass frit 4 in a gap between insulating substrates 2 and 2a made of sheets of glass or the like. Reference numerals 5 and 5a are connection wiring portions between the transparent electrodes 1 and 1a and the external power source 6, respectively. If the adhesion of the connection wiring parts 5, 5a to the insulating substrates 2, 2a is not good, not only the conductivity of the connection wiring parts 5, 5a will be impaired, but also moisture will enter from the parts with poor adhesion and damage the liquid crystal material. 3 and significantly shorten the life of the display device. Further, the conventional conductive paste contains a glass frit, and when the glass frit is fired at 450°C to 500°C,
Transparent electrodes 1 and 1a made of metal oxide such as In 2 O 3
This has the disadvantage that the conductivity is likely to be destroyed due to the electroconductivity being eaten away, resulting in an extremely low manufacturing yield of liquid crystal display devices. The purpose of the present invention is to overcome the above-mentioned conventional drawbacks,
It is an object of the present invention to provide a highly reliable liquid crystal display device by providing a conductive layer having excellent conductivity and good adhesion to an insulating substrate such as glass. A feature of the present invention is that a metal powder such as silver or nickel, an organic indium compound, an organic tin compound, or a mixture thereof, and an organic vehicle are mixed and made into a paste. The conductive layer obtained by applying the paste of the present invention onto an insulating substrate such as glass and then firing at 450° C. to 500° C. had a small sheet resistance value and a high adhesive strength with the substrate. This is an organic indium compound,
Alternatively, it is considered that In 2 O 3 or SnO 2 or a mixture thereof produced by firing the organic tin compound or a mixture thereof acts as an inorganic binder between the metal powder and the insulating substrate material such as glass, improving the adhesion. In preparing the conductive paste of the present invention, first, tetraacetylacetonate indium In
An organic indium compound such as (acac) 3 , or an organic tin compound such as dimethyltin acetope (CH 3 )Sn(acac) 2 , or a mixture thereof is dissolved in an organic solvent, and then a viscous solution such as ethyl cellulose or nitrocellulose is dissolved. Add the agent and mix to form the vehicle. Metal powders such as silver, nickel, platinum, palladium, etc. are added to this and mixed and dispersed to create a conductive paste. As the organic solvent, high-boiling alcohols such as 2-ethylhexanol and benzyl alcohol, high-boiling ethers such as butyl cellosolve and butyl carbitol, and high-boiling esters such as benzyl acetate and dimethyl phthalate can be used. The paste of the present invention contains In 2 O 3 or SnO 2 , which is a composition for transparent electrodes of liquid crystal display devices, and does not contain glass frit. When used as a wiring member, it has excellent adhesion to both the transparent electrode and the substrate, has good conductivity, and does not eat away at the transparent electrode, making it a highly reliable liquid crystal display device.
【表】
第1表より、有機インジウム化合物、有機スズ
化合物を含むビヒクル〔B〕を使用して作成した
ペーストの方が、得られる導電体層のシート抵抗
値は低く、又ニツケル粉の添加量が多い程シート
抵抗値が低下することがわかる。
実施例 2
有機インジウム化合物、有機スズ化合物を含む
次の組成のビヒクルに、金属粉末として銀粉末又
はニツケル粉末を50wt%添加して、導電性ペー
ストを作成した。
2−エチルヘキサノール (90−X)32/80wt%
ベンジルアルコール (90−X)48/80wt%
In(acac)3 X87/100wt%
(CH3)2Sn(acac)2 X13/100wt%
エチルセルローズN−200 10wt%
ここで、In(acac)3と(CH3)2Sn(acac)2との添
加量(X)をX=10、20、30wt%と変化させて
ペーストを作成した。
実施例1と同様にして、導電体層を形成した。
さらに、比較のため大気中焼成と窒素雰囲気中焼
成を行つた。形成した導電体層の密着性即ち被膜
強度及びシート抵抗値(Rs)を測定した結果を
第2表に示す。[Table] From Table 1, the sheet resistance of the resulting conductive layer is lower in the paste prepared using vehicle [B] containing an organic indium compound and an organic tin compound, and the amount of nickel powder added is lower. It can be seen that the sheet resistance value decreases as the number increases. Example 2 A conductive paste was prepared by adding 50 wt % of silver powder or nickel powder as a metal powder to a vehicle having the following composition containing an organic indium compound and an organic tin compound. 2-Ethylhexanol (90-X) 32/80wt% Benzyl alcohol (90-X) 48/80wt% In (acac) 3 X87/100wt% (CH 3 ) 2 Sn (acac) 2 X13/100wt% Ethyl cellulose N -200 10wt% Here, pastes were created by changing the addition amount (X) of In(acac) 3 and (CH 3 ) 2 Sn(acac) 2 to X=10, 20, and 30wt%. A conductive layer was formed in the same manner as in Example 1.
Furthermore, for comparison, firing was performed in air and in a nitrogen atmosphere. Table 2 shows the results of measuring the adhesion, ie, coating strength, and sheet resistance (Rs) of the conductive layer formed.
【表】
被膜強度測定には、ペンシル型ひつかき試験器
を使用した。第2表において△印は荷重150g/
cm2できずの付くもの、〇印は荷重400g/cm2でき
ずの付くもの、◎印は荷重400g/cm2できずの付
かないものである。
第2表からわかるように、窒素雰囲気中焼成の
方が基板との密着性がよく、又金属粉としてニツ
ケル粉を用いた場合添加量が多い程密着性に優れ
ている。又金属粉として銀粉を用いた場合、有機
インジウム化合物、有機スズ化合物の添加量の増
加と共に、シート抵抗値(Rs)が増加するが、
ニツケル粉を用いた場合は、逆に減少しているこ
とがわかる。[Table] A pencil-type scratch tester was used to measure the film strength. In Table 2, △ indicates a load of 150g/
Items marked with 〇 are items with cracks under a load of 400 g/cm 2 , and marks with ◎ are items with no cracks under a load of 400 g/cm 2 . As can be seen from Table 2, the adhesion to the substrate is better when fired in a nitrogen atmosphere, and when nickel powder is used as the metal powder, the greater the amount added, the better the adhesion is. Furthermore, when silver powder is used as the metal powder, the sheet resistance value (Rs) increases as the amount of organic indium compound and organic tin compound added increases;
On the contrary, it can be seen that it decreases when nickel powder is used.
第1図は、一般的な液晶表示装置の要部断側面
図である。
1,1a:透明電極、2,2a:絶縁基板、
3:液晶物質、4:ガラスフリツト、5,5a:
接続配線部、6:外部電源。
FIG. 1 is a sectional side view of a main part of a general liquid crystal display device. 1, 1a: transparent electrode, 2, 2a: insulating substrate,
3: Liquid crystal substance, 4: Glass frit, 5, 5a:
Connection wiring section, 6: External power supply.
Claims (1)
物、又はこれらの混合物を、有機溶媒に混合して
溶解せしめた溶液と、銀、ニツケル等の金属粉末
と、粘性剤とを混合して得られる導電性ペース
ト。 2 有機インジウム化合物、又は有機スズ化合
物、又はこれらの混合物を、有機溶媒に混合して
溶解せしめた後、粘性剤を添加混合しビヒクルを
作成する工程と、該ビヒクル中に、銀、ニツケル
等の金属粉末を混合分散する工程とからなること
を特徴とする導電性ペーストの製造方法。 3 有機インジウム化合物、又は有機スズ化合
物、又はこれらの混合物を、有機溶媒に混合して
溶解せしめた溶液と、銀、ニツケル等の金属粉末
と、粘性剤とを混合して得られる導電性ペースト
を用いて、透明電極と外部電源との接続配線部を
形成したことを特徴とする液晶表示装置。[Claims] 1. A solution obtained by mixing an organic indium compound, an organic tin compound, or a mixture thereof in an organic solvent and dissolving it, a metal powder such as silver or nickel, and a viscous agent. The resulting conductive paste. 2 A step of mixing and dissolving an organic indium compound, an organic tin compound, or a mixture thereof in an organic solvent, and then adding and mixing a viscosity agent to create a vehicle, and adding silver, nickel, etc. to the vehicle. A method for producing a conductive paste, comprising the step of mixing and dispersing metal powder. 3 A conductive paste obtained by mixing an organic indium compound, an organic tin compound, or a mixture thereof in an organic solvent and dissolving it, a metal powder such as silver or nickel, and a viscous agent. A liquid crystal display device characterized in that a connection wiring portion between a transparent electrode and an external power source is formed using the above-mentioned material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3082481A JPS57145213A (en) | 1981-03-04 | 1981-03-04 | Conductive paste, method of producing same and liquid crystal display unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3082481A JPS57145213A (en) | 1981-03-04 | 1981-03-04 | Conductive paste, method of producing same and liquid crystal display unit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57145213A JPS57145213A (en) | 1982-09-08 |
JPS6367289B2 true JPS6367289B2 (en) | 1988-12-23 |
Family
ID=12314442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3082481A Granted JPS57145213A (en) | 1981-03-04 | 1981-03-04 | Conductive paste, method of producing same and liquid crystal display unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57145213A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS601703A (en) * | 1983-06-17 | 1985-01-07 | アルプス電気株式会社 | Transparent conductive coating forming liquid |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5421433A (en) * | 1977-07-18 | 1979-02-17 | Murata Manufacturing Co | Conductive silver coating |
JPS5421434A (en) * | 1977-07-18 | 1979-02-17 | Murata Manufacturing Co | Conductive silver coating |
-
1981
- 1981-03-04 JP JP3082481A patent/JPS57145213A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5421433A (en) * | 1977-07-18 | 1979-02-17 | Murata Manufacturing Co | Conductive silver coating |
JPS5421434A (en) * | 1977-07-18 | 1979-02-17 | Murata Manufacturing Co | Conductive silver coating |
Also Published As
Publication number | Publication date |
---|---|
JPS57145213A (en) | 1982-09-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0732310B2 (en) | Method for manufacturing multilayer electronic circuit | |
JP3237497B2 (en) | Conductive paste, conductor and ceramic substrate using the same | |
JP2001110232A (en) | Conductive paste and semiconductor ceramic electronic parts | |
JPH05235497A (en) | Copper conductive paste | |
JPH0817671A (en) | Conductive paste | |
US3434877A (en) | Metallic connection and the method of making same | |
JPS6367289B2 (en) | ||
JPH0153907B2 (en) | ||
JP3405131B2 (en) | Electronic components | |
JP3649775B2 (en) | Thick film conductive paste composition | |
US5707555A (en) | Conductive paste and external electrodes for electronic product formed using same | |
JP2968316B2 (en) | Multilayer ceramic capacitors | |
JP2550630B2 (en) | Copper paste for conductive film formation | |
JP3318299B2 (en) | Pb-free low-temperature firing type conductive paint | |
JPH09161539A (en) | Conductive compound and ceramic electronic parts using the same | |
JPS63245809A (en) | Finely crushed particle and thick film electronic material composition | |
GB2052474A (en) | Liquid Crystal Display Element | |
JPH04269403A (en) | Conductive paste | |
JPH0817136B2 (en) | Conductive composition for ceramic capacitor terminal electrodes | |
JP2747119B2 (en) | Fluorescent display tube | |
JPH1083717A (en) | Conductive composition | |
JPS6025294A (en) | Method of producing circuit board | |
US3648363A (en) | Method of making resistor | |
JPH0368485B2 (en) | ||
JPS5871507A (en) | Conductive paste |