JPS6367241U - - Google Patents
Info
- Publication number
- JPS6367241U JPS6367241U JP16189686U JP16189686U JPS6367241U JP S6367241 U JPS6367241 U JP S6367241U JP 16189686 U JP16189686 U JP 16189686U JP 16189686 U JP16189686 U JP 16189686U JP S6367241 U JPS6367241 U JP S6367241U
- Authority
- JP
- Japan
- Prior art keywords
- gas inlet
- vacuum chamber
- sample
- diffusion plate
- accommodating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009792 diffusion process Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Description
第１図は本考案の一実施例を示す概略断面図、
第２図は拡散板の有無による異物の付着数を示す
図である。
２……真空室、４……排気口、６……ガス導入
口、１４，１６……試料、１８……拡散板。
FIG. 1 is a schematic sectional view showing an embodiment of the present invention;
FIG. 2 is a diagram showing the number of foreign particles attached depending on the presence or absence of a diffuser plate. 2...Vacuum chamber, 4...Exhaust port, 6...Gas inlet, 14, 16...Sample, 18...Diffusion plate.
Claims (1)
容する真空室において、前記ガス導入口と試料設
置位置の間で前記ガス導入口に接近して対向する
拡散板を設けたことを特徴とする半導体製造装置
の真空室。 A vacuum chamber having a gas inlet for leakage and accommodating a sample therein is characterized by providing a diffusion plate close to and facing the gas inlet between the gas inlet and the sample installation position. Vacuum chamber of semiconductor manufacturing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16189686U JPS6367241U (en) | 1986-10-21 | 1986-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16189686U JPS6367241U (en) | 1986-10-21 | 1986-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6367241U true JPS6367241U (en) | 1988-05-06 |
Family
ID=31088641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16189686U Pending JPS6367241U (en) | 1986-10-21 | 1986-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367241U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748226A (en) * | 1980-09-05 | 1982-03-19 | Matsushita Electronics Corp | Plasma processing method and device for the same |
-
1986
- 1986-10-21 JP JP16189686U patent/JPS6367241U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748226A (en) * | 1980-09-05 | 1982-03-19 | Matsushita Electronics Corp | Plasma processing method and device for the same |
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