JPS61106024U - - Google Patents
Info
- Publication number
- JPS61106024U JPS61106024U JP19146484U JP19146484U JPS61106024U JP S61106024 U JPS61106024 U JP S61106024U JP 19146484 U JP19146484 U JP 19146484U JP 19146484 U JP19146484 U JP 19146484U JP S61106024 U JPS61106024 U JP S61106024U
- Authority
- JP
- Japan
- Prior art keywords
- vacuum chamber
- leak gas
- manufacturing apparatus
- semiconductor manufacturing
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Pipeline Systems (AREA)
Description
第1図は本考案による半導体製造装置の一実施
例を示す構成図、第2図は、従来の半導体製造装
置の構成図である。
1…副真空室、5…ゲートバルブ、6…真空室
、7…真空装置、8…リークガス供給管、9…質
量流量制御装置、10…リークガス源。
FIG. 1 is a block diagram showing an embodiment of a semiconductor manufacturing apparatus according to the present invention, and FIG. 2 is a block diagram of a conventional semiconductor manufacturing apparatus. DESCRIPTION OF SYMBOLS 1... Sub-vacuum chamber, 5... Gate valve, 6... Vacuum chamber, 7... Vacuum device, 8... Leak gas supply pipe, 9... Mass flow control device, 10... Leak gas source.
Claims (1)
開放が必要な副真空室とリークガス源とを連結す
るリークガス供給管に質量流量制御装置を設けた
ことを特徴とする半導体製造装置。 A semiconductor manufacturing apparatus characterized in that a mass flow rate control device is provided in a leak gas supply pipe that connects a leak gas source to a sub-vacuum chamber that is provided in the vacuum chamber via a vacuum space gate and that needs to be opened to the atmosphere.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19146484U JPS61106024U (en) | 1984-12-19 | 1984-12-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19146484U JPS61106024U (en) | 1984-12-19 | 1984-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61106024U true JPS61106024U (en) | 1986-07-05 |
Family
ID=30748903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19146484U Pending JPS61106024U (en) | 1984-12-19 | 1984-12-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61106024U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63111936A (en) * | 1986-10-28 | 1988-05-17 | Ulvac Corp | Vacuum treating equipment |
JPS63111937A (en) * | 1986-10-28 | 1988-05-17 | Ulvac Corp | Vacuum treating equipment |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4417881Y1 (en) * | 1965-12-08 | 1969-08-02 | ||
JPS58156593A (en) * | 1982-03-10 | 1983-09-17 | Nippon Telegr & Teleph Corp <Ntt> | Apparatus for vapor-phase epitaxial growth |
-
1984
- 1984-12-19 JP JP19146484U patent/JPS61106024U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4417881Y1 (en) * | 1965-12-08 | 1969-08-02 | ||
JPS58156593A (en) * | 1982-03-10 | 1983-09-17 | Nippon Telegr & Teleph Corp <Ntt> | Apparatus for vapor-phase epitaxial growth |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63111936A (en) * | 1986-10-28 | 1988-05-17 | Ulvac Corp | Vacuum treating equipment |
JPS63111937A (en) * | 1986-10-28 | 1988-05-17 | Ulvac Corp | Vacuum treating equipment |
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