JPS6367176B2 - - Google Patents
Info
- Publication number
- JPS6367176B2 JPS6367176B2 JP7831681A JP7831681A JPS6367176B2 JP S6367176 B2 JPS6367176 B2 JP S6367176B2 JP 7831681 A JP7831681 A JP 7831681A JP 7831681 A JP7831681 A JP 7831681A JP S6367176 B2 JPS6367176 B2 JP S6367176B2
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- acid
- parts
- photosensitive resin
- monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920002647 polyamide Polymers 0.000 claims description 42
- 239000000178 monomer Substances 0.000 claims description 41
- 239000004952 Polyamide Substances 0.000 claims description 36
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 30
- 150000001875 compounds Chemical class 0.000 claims description 26
- 239000011342 resin composition Substances 0.000 claims description 24
- 229910052757 nitrogen Inorganic materials 0.000 claims description 22
- 125000004432 carbon atom Chemical group C* 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000006367 bivalent amino carbonyl group Chemical group [H]N([*:1])C([*:2])=O 0.000 claims description 2
- 239000003999 initiator Substances 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 21
- -1 Nt-butylacrylamide Chemical compound 0.000 description 16
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 10
- 239000002253 acid Substances 0.000 description 8
- 125000005907 alkyl ester group Chemical group 0.000 description 7
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 7
- 150000004985 diamines Chemical class 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000012965 benzophenone Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 150000002430 hydrocarbons Chemical group 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229960005141 piperazine Drugs 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000012719 thermal polymerization Methods 0.000 description 6
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 5
- 150000004820 halides Chemical class 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000003504 photosensitizing agent Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000005562 fading Methods 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- IPQKIOGNAKWLSO-UHFFFAOYSA-N 3-[2-carboxyethyl(methyl)amino]propanoic acid Chemical compound OC(=O)CCN(C)CCC(O)=O IPQKIOGNAKWLSO-UHFFFAOYSA-N 0.000 description 2
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000001413 amino acids Chemical class 0.000 description 2
- 229960002684 aminocaproic acid Drugs 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O ammonium group Chemical class [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- ABIJRNDFOJAXMV-UHFFFAOYSA-N cyclohexane;n-methylmethanamine Chemical compound CNC.C1CCCCC1 ABIJRNDFOJAXMV-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- VMHYWKBKHMYRNF-UHFFFAOYSA-N (2-chlorophenyl)-phenylmethanone Chemical compound ClC1=CC=CC=C1C(=O)C1=CC=CC=C1 VMHYWKBKHMYRNF-UHFFFAOYSA-N 0.000 description 1
- RBKHNGHPZZZJCI-UHFFFAOYSA-N (4-aminophenyl)-phenylmethanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC=C1 RBKHNGHPZZZJCI-UHFFFAOYSA-N 0.000 description 1
- 150000005206 1,2-dihydroxybenzenes Chemical class 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- BBKSAKNJPDBWMG-UHFFFAOYSA-N 1-(3-methylpiperazin-1-yl)propan-2-amine Chemical compound CC(N)CN1CCNC(C)C1 BBKSAKNJPDBWMG-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- PIPWSBOFSUJCCO-UHFFFAOYSA-N 2,2-dimethylpiperazine Chemical compound CC1(C)CNCCN1 PIPWSBOFSUJCCO-UHFFFAOYSA-N 0.000 description 1
- SCEICQWBUFWUMP-UHFFFAOYSA-N 2,4,7-trimethylocta-2,6-dienediamide Chemical compound NC(=O)C(C)=CC(C)CC=C(C)C(N)=O SCEICQWBUFWUMP-UHFFFAOYSA-N 0.000 description 1
- ARKDCHXUGNPHJU-UHFFFAOYSA-N 2,7-dimethylocta-2,6-dienediamide Chemical compound NC(=O)C(C)=CCCC=C(C)C(N)=O ARKDCHXUGNPHJU-UHFFFAOYSA-N 0.000 description 1
- MBWAUPPOQKPRNN-UHFFFAOYSA-N 2-(2,5-dimethylpiperazin-1-yl)ethanamine Chemical compound CC1CN(CCN)C(C)CN1 MBWAUPPOQKPRNN-UHFFFAOYSA-N 0.000 description 1
- XSCRXCDDATUDLB-UHFFFAOYSA-N 2-(2-methylpropoxymethyl)prop-2-enamide Chemical compound CC(C)COCC(=C)C(N)=O XSCRXCDDATUDLB-UHFFFAOYSA-N 0.000 description 1
- IEQDCFHLYWTAFV-UHFFFAOYSA-N 2-(3-methylpiperazin-1-yl)ethanamine Chemical compound CC1CN(CCN)CCN1 IEQDCFHLYWTAFV-UHFFFAOYSA-N 0.000 description 1
- XTUKCSVGEYCVHT-UHFFFAOYSA-N 2-[2-[aminomethyl(methyl)amino]ethyl-methylamino]acetic acid Chemical compound NCN(C)CCN(C)CC(O)=O XTUKCSVGEYCVHT-UHFFFAOYSA-N 0.000 description 1
- AVHSSMVTBDPMIP-UHFFFAOYSA-N 2-[2-[carboxymethyl(methyl)amino]ethyl-methylamino]acetic acid Chemical compound OC(=O)CN(C)CCN(C)CC(O)=O AVHSSMVTBDPMIP-UHFFFAOYSA-N 0.000 description 1
- LZUCUODFMXLSBZ-UHFFFAOYSA-N 2-[4-(2-aminoethyl)-3-methylpiperazin-1-yl]ethanamine Chemical compound CC1CN(CCN)CCN1CCN LZUCUODFMXLSBZ-UHFFFAOYSA-N 0.000 description 1
- PAOXFRSJRCGJLV-UHFFFAOYSA-N 2-[4-(2-aminoethyl)piperazin-1-yl]ethanamine Chemical compound NCCN1CCN(CCN)CC1 PAOXFRSJRCGJLV-UHFFFAOYSA-N 0.000 description 1
- LLALCPHRPIWTEO-UHFFFAOYSA-N 2-[4-(aminomethyl)-3-methylpiperazin-1-yl]acetic acid Chemical compound CC1CN(CC(O)=O)CCN1CN LLALCPHRPIWTEO-UHFFFAOYSA-N 0.000 description 1
- WVEYNIYFSLEUCQ-UHFFFAOYSA-N 2-[4-(aminomethyl)piperazin-1-yl]acetic acid Chemical compound NCN1CCN(CC(O)=O)CC1 WVEYNIYFSLEUCQ-UHFFFAOYSA-N 0.000 description 1
- WHXFZAIYFRCDIB-UHFFFAOYSA-N 2-[4-(aminomethyl)piperazin-1-yl]ethanamine Chemical compound NCCN1CCN(CN)CC1 WHXFZAIYFRCDIB-UHFFFAOYSA-N 0.000 description 1
- WRYGFOHQVMVHDM-UHFFFAOYSA-N 2-[4-(carboxymethyl)-3,5-dimethylpiperazin-1-yl]acetic acid Chemical compound CC1CN(CC(O)=O)CC(C)N1CC(O)=O WRYGFOHQVMVHDM-UHFFFAOYSA-N 0.000 description 1
- MZTLRNYNDPZLFM-UHFFFAOYSA-N 2-[4-(carboxymethyl)-3-methylpiperazin-1-yl]acetic acid Chemical compound CC1CN(CC(O)=O)CCN1CC(O)=O MZTLRNYNDPZLFM-UHFFFAOYSA-N 0.000 description 1
- JERMFLFKXHHROS-UHFFFAOYSA-N 2-[4-(carboxymethyl)piperazin-1-yl]acetic acid Chemical compound OC(=O)CN1CCN(CC(O)=O)CC1 JERMFLFKXHHROS-UHFFFAOYSA-N 0.000 description 1
- ZOBMEMBAPTUNSO-UHFFFAOYSA-N 2-[aminomethyl(methyl)amino]acetic acid Chemical compound NCN(C)CC(O)=O ZOBMEMBAPTUNSO-UHFFFAOYSA-N 0.000 description 1
- XWSGEVNYFYKXCP-UHFFFAOYSA-N 2-[carboxymethyl(methyl)amino]acetic acid Chemical compound OC(=O)CN(C)CC(O)=O XWSGEVNYFYKXCP-UHFFFAOYSA-N 0.000 description 1
- QUBNFZFTFXTLKH-UHFFFAOYSA-N 2-aminododecanoic acid Chemical compound CCCCCCCCCCC(N)C(O)=O QUBNFZFTFXTLKH-UHFFFAOYSA-N 0.000 description 1
- RDFMDVXONNIGBC-UHFFFAOYSA-N 2-aminoheptanoic acid Chemical compound CCCCCC(N)C(O)=O RDFMDVXONNIGBC-UHFFFAOYSA-N 0.000 description 1
- AKVBCGQVQXPRLD-UHFFFAOYSA-N 2-aminooctanoic acid Chemical compound CCCCCCC(N)C(O)=O AKVBCGQVQXPRLD-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- DIVXVZXROTWKIH-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(C)C(=O)C1=CC=CC=C1 DIVXVZXROTWKIH-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- WRJZKSHNBALIGH-UHFFFAOYSA-N 2-piperazin-1-ium-1-ylacetate Chemical compound OC(=O)CN1CCNCC1 WRJZKSHNBALIGH-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- RNPOEYJHSTXNEE-UHFFFAOYSA-N 3-(2,5-dimethylpiperazin-1-yl)propanoic acid Chemical compound CC1CN(CCC(O)=O)C(C)CN1 RNPOEYJHSTXNEE-UHFFFAOYSA-N 0.000 description 1
- JJZZCEGXLISDMW-UHFFFAOYSA-N 3-(3-methylpiperazin-1-yl)propanoic acid Chemical compound CC1CN(CCC(O)=O)CCN1 JJZZCEGXLISDMW-UHFFFAOYSA-N 0.000 description 1
- OYWOFSNRZINJQZ-UHFFFAOYSA-N 3-[2-[(dimethylamino)methyl]-2-(propoxymethyl)butoxy]propane-1,1-diamine Chemical compound CCCOCC(CC)(CN(C)C)COCCC(N)N OYWOFSNRZINJQZ-UHFFFAOYSA-N 0.000 description 1
- VZMDHBGPXSANLB-UHFFFAOYSA-N 3-[2-[2-aminoethyl(methyl)amino]ethyl-methylamino]propanoic acid Chemical compound NCCN(C)CCN(C)CCC(O)=O VZMDHBGPXSANLB-UHFFFAOYSA-N 0.000 description 1
- XYAWQRGITVQKII-UHFFFAOYSA-N 3-[2-[2-carboxyethyl(methyl)amino]ethyl-methylamino]propanoic acid Chemical compound OC(=O)CCN(C)CCN(C)CCC(O)=O XYAWQRGITVQKII-UHFFFAOYSA-N 0.000 description 1
- CYSMADATNBUHAL-UHFFFAOYSA-N 3-[2-aminoethyl(methyl)amino]propanoic acid Chemical compound NCCN(C)CCC(O)=O CYSMADATNBUHAL-UHFFFAOYSA-N 0.000 description 1
- WYQAQULXVGJSDU-UHFFFAOYSA-N 3-[2-carboxyethyl(propan-2-yl)amino]propanoic acid Chemical compound OC(=O)CCN(C(C)C)CCC(O)=O WYQAQULXVGJSDU-UHFFFAOYSA-N 0.000 description 1
- GODIVIHMXDOVPR-UHFFFAOYSA-N 3-[4-(2-aminoethyl)piperazin-1-yl]propanoic acid Chemical compound NCCN1CCN(CCC(O)=O)CC1 GODIVIHMXDOVPR-UHFFFAOYSA-N 0.000 description 1
- DOQXEIOBJNVSGE-UHFFFAOYSA-N 3-[4-(aminomethyl)piperazin-1-yl]propanoic acid Chemical compound NCN1CCN(CCC(O)=O)CC1 DOQXEIOBJNVSGE-UHFFFAOYSA-N 0.000 description 1
- PCIRIOLCHWHYSX-UHFFFAOYSA-N 3-[4-(carboxymethyl)piperazin-1-yl]propanoic acid Chemical compound OC(=O)CCN1CCN(CC(O)=O)CC1 PCIRIOLCHWHYSX-UHFFFAOYSA-N 0.000 description 1
- VTCDUXIXVYBZBD-UHFFFAOYSA-N 3-[6-[aminomethyl(methyl)amino]hexyl-methylamino]propanoic acid Chemical compound NCN(C)CCCCCCN(C)CCC(O)=O VTCDUXIXVYBZBD-UHFFFAOYSA-N 0.000 description 1
- INVREGIJQSOKJG-UHFFFAOYSA-N 3-[aminomethyl(propan-2-yl)amino]propanoic acid Chemical compound CC(C)N(CN)CCC(O)=O INVREGIJQSOKJG-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- FGSUUFDRDVJCLT-UHFFFAOYSA-N 3-methylazepan-2-one Chemical compound CC1CCCCNC1=O FGSUUFDRDVJCLT-UHFFFAOYSA-N 0.000 description 1
- UVLSCMIEPPWCHZ-UHFFFAOYSA-N 3-piperazin-1-ylpropan-1-amine Chemical compound NCCCN1CCNCC1 UVLSCMIEPPWCHZ-UHFFFAOYSA-N 0.000 description 1
- RSEHHYMPNZWTGQ-UHFFFAOYSA-N 3-piperazin-4-ium-1-ylpropanoate Chemical compound OC(=O)CCN1CCNCC1 RSEHHYMPNZWTGQ-UHFFFAOYSA-N 0.000 description 1
- GFLJTEHFZZNCTR-UHFFFAOYSA-N 3-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OCCCOC(=O)C=C GFLJTEHFZZNCTR-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- UMGVFXHQGJFXJW-UHFFFAOYSA-N 4-[4-(3-carboxypropyl)piperazin-1-yl]butanoic acid Chemical compound OC(=O)CCCN1CCN(CCCC(O)=O)CC1 UMGVFXHQGJFXJW-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- YKXAYLPDMSGWEV-UHFFFAOYSA-N 4-hydroxybutyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCO YKXAYLPDMSGWEV-UHFFFAOYSA-N 0.000 description 1
- OQAOQXNFYZLMNJ-UHFFFAOYSA-N 4-methylocta-2,6-dienediamide Chemical compound NC(=O)C=CC(C)CC=CC(N)=O OQAOQXNFYZLMNJ-UHFFFAOYSA-N 0.000 description 1
- QNUAPDZZKKIKGU-UHFFFAOYSA-N 4-piperazin-1-ylbutanoic acid Chemical compound OC(=O)CCCN1CCNCC1 QNUAPDZZKKIKGU-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- JAWSTIJAWZBKOU-UHFFFAOYSA-N 7-methylazepan-2-one Chemical compound CC1CCCCC(=O)N1 JAWSTIJAWZBKOU-UHFFFAOYSA-N 0.000 description 1
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 description 1
- 229940076442 9,10-anthraquinone Drugs 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical group O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- JKEZSJIWQWVVQR-UHFFFAOYSA-N [2-hydroxy-3-(2-methoxyphenoxy)propyl]-propan-2-ylazanium;chloride Chemical compound Cl.COC1=CC=CC=C1OCC(O)CNC(C)C JKEZSJIWQWVVQR-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- PCIFXGOJRVVQGH-UHFFFAOYSA-N [4-(aminomethyl)piperazin-1-yl]methanamine Chemical compound NCN1CCN(CN)CC1 PCIFXGOJRVVQGH-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 150000004054 benzoquinones Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 1
- 229940106681 chloroacetic acid Drugs 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- CGZZMOTZOONQIA-UHFFFAOYSA-N cycloheptanone Chemical compound O=C1CCCCCC1 CGZZMOTZOONQIA-UHFFFAOYSA-N 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- IIRFCWANHMSDCG-UHFFFAOYSA-N cyclooctanone Chemical compound O=C1CCCCCCC1 IIRFCWANHMSDCG-UHFFFAOYSA-N 0.000 description 1
- KRQQDOJWSDMFEG-UHFFFAOYSA-N deca-2,8-dienediamide Chemical compound NC(=O)C=CCCCCC=CC(N)=O KRQQDOJWSDMFEG-UHFFFAOYSA-N 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 125000001142 dicarboxylic acid group Chemical group 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- IQIJRJNHZYUQSD-UHFFFAOYSA-N ethenyl(phenyl)diazene Chemical compound C=CN=NC1=CC=CC=C1 IQIJRJNHZYUQSD-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- LQAWSZYJRFRCHK-UHFFFAOYSA-N n'-(2-aminoethyl)-n'-ethylethane-1,2-diamine Chemical compound NCCN(CC)CCN LQAWSZYJRFRCHK-UHFFFAOYSA-N 0.000 description 1
- BQUQUASUHNZZLS-UHFFFAOYSA-N n'-(3-aminopropyl)-n'-cyclohexylpropane-1,3-diamine Chemical compound NCCCN(CCCN)C1CCCCC1 BQUQUASUHNZZLS-UHFFFAOYSA-N 0.000 description 1
- KMBPCQSCMCEPMU-UHFFFAOYSA-N n'-(3-aminopropyl)-n'-methylpropane-1,3-diamine Chemical compound NCCCN(C)CCCN KMBPCQSCMCEPMU-UHFFFAOYSA-N 0.000 description 1
- LPUPVANAAKTYDS-UHFFFAOYSA-N n'-(3-aminopropyl)-n'-propan-2-ylpropane-1,3-diamine Chemical compound NCCCN(C(C)C)CCCN LPUPVANAAKTYDS-UHFFFAOYSA-N 0.000 description 1
- COJUXMTZOSXAOW-UHFFFAOYSA-N n'-[2-[3-aminopropyl(methyl)amino]ethyl]-n'-methylpropane-1,3-diamine Chemical compound NCCCN(C)CCN(C)CCCN COJUXMTZOSXAOW-UHFFFAOYSA-N 0.000 description 1
- OJHPLXDRTZENSP-UHFFFAOYSA-N n,n'-bis(3-aminopropyl)-2,2,4-trimethylhexane-1,6-diamine Chemical compound NCCCNCCC(C)CC(C)(C)CNCCCN OJHPLXDRTZENSP-UHFFFAOYSA-N 0.000 description 1
- YDHPIRXPVAELGD-UHFFFAOYSA-N n,n'-bis(3-aminopropyl)-n,n'-bis(2-methylpropyl)hexane-1,6-diamine Chemical compound NCCCN(CC(C)C)CCCCCCN(CCCN)CC(C)C YDHPIRXPVAELGD-UHFFFAOYSA-N 0.000 description 1
- JLMFTYWECVXOEU-UHFFFAOYSA-N n,n'-bis(3-aminopropyl)-n,n'-dicyclohexylhexane-1,6-diamine Chemical compound C1CCCCC1N(CCCN)CCCCCCN(CCCN)C1CCCCC1 JLMFTYWECVXOEU-UHFFFAOYSA-N 0.000 description 1
- VCYSCRLAZCOBBO-UHFFFAOYSA-N n,n'-bis(3-aminopropyl)-n,n'-dimethylbutane-1,4-diamine Chemical compound NCCCN(C)CCCCN(C)CCCN VCYSCRLAZCOBBO-UHFFFAOYSA-N 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- UTSYWKJYFPPRAP-UHFFFAOYSA-N n-(butoxymethyl)prop-2-enamide Chemical compound CCCCOCNC(=O)C=C UTSYWKJYFPPRAP-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229960002205 piperazine adipate Drugs 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- GGHDAUPFEBTORZ-UHFFFAOYSA-N propane-1,1-diamine Chemical compound CCC(N)N GGHDAUPFEBTORZ-UHFFFAOYSA-N 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- XJIAZXYLMDIWLU-UHFFFAOYSA-N undecane-1,1-diamine Chemical compound CCCCCCCCCCC(N)N XJIAZXYLMDIWLU-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Description
æ¬çºæã¯æ°ŽçŸåå¯èœãªããªã¢ããç³»æå
æ§æš¹è
çµæç©ã«é¢ãããã®ã§ããã
åŸæ¥ããå°å·çšåžæ¿ã¯ãæå
æ§æš¹èçµæç©ã®å±€
ïŒä»¥äžæå
æ§å±€ãšç§°ãïŒãšæ¯æäœãšãããªãæå
æ§åçã®æå
æ§å±€ã«éæç»åéšãæãããã¬ãã€
ã«ã ãŸãã¯ããžãã€ã«ã ãéããŠé²å
ãè¡ãªãã
é²å
éšåã®æå
æ§æš¹èçµæç©ã硬åãããŠäžæº¶å
ããåŸãæªé²å
éšåã®åèšæš¹èçµæç©ãé©åœãªçŸ
å液ã«ãã溶解é€å»ããŠè£œé ãããŠããããã®ã
ããªæå
æ§æš¹èçµæç©ã¯éåžžãå
éåå¯èœãªäžé£œ
åçµåãæããåéäœãé©åœãªçŸå液ã«å¯æº¶æ§ã®
éåäœã§ãããåèšåéäœã®å
éåã«ããäžæº¶å
ããéåäœãå
å¢æå€ããã³ç±éåé²æ¢å€ãå«
ããæªé²å
éšåã«ãããŠè©²æå
æ§æš¹èçµæç©ãç¹
ã«åèšéåäœã¯é©åœãªçŸå液ã«å¯æº¶æ§ã§ãããã
é²å
éšåã«ãããŠè©²åäžæº¶å€ã«äžæº¶æ§ãšãªãããŸ
ãåèšéåäœã¯å
éåå¯èœãªäžé£œåçµåãæãã
åéäœã®å
éååŸãæ©æ¢°ç匷床ã倧ãããææ©æº¶
å€ã«ãã€ãŠèšæœ€ãããããªãéåäœã§ããããã®
ãããªéåäœãšããŠã¯ãã¢ã«ã³ãŒã«å¯æº¶æ§å
±éå
ããªã¢ãããææ¡ãããããšãã°ç¹å
¬æ35â
14719å·å
¬å ±ãç¹å
¬æ35â15513å·å
¬å ±ãç¹å
¾45
â7330å·å
¬å ±ãªã©ã«èšèŒãããŠããã
ãšãããããããåèšããªã¢ããç³»æå
æ§æš¹è
çµæç©ã¯å
šãŠã¢ã«ã³ãŒã«ã«ã¯å¯æº¶ã§ããããæ°Žã«
ã¯äžæº¶ã§ãããåŸã€ãŠäžèšããªã¢ããç³»çæã¯ã
å
šãŠæªé²å
éšã®æš¹èå±€ã溶解é€å»ããçŸå液ãšã
ãŠãã¢ã«ã³ãŒã«ãªã©ã®ææ©æº¶å€ã䜿çšããªããã°
ãªããªãããããã®ææ©æº¶å€ãçŸå液ãšããŠäœ¿çš
ããããšã¯åæ±ãäœæ¥æ§ã貯èµãå»æ¶²ãé«äŸ¡ãªé²
çåçŸåè£
眮ãªã©ã®ç¹ã§åé¡ãããã ãã§ãªãã
äžèšããªã¢ãããã¢ã«ã³ãŒã«ãªã©ã®ææ©æº¶å€ãžã®
溶解é床ãå°ããããã«ããããäœæãããçµæ
ç©ã®çŸåã«æ¯èŒçé·ãæéãå¿
èŠãšãããªã©ã®æ¬
ç¹ãæãããããã§ããããã解決ããæ¹æ³ãšã
ãŠãæ°Žå¯æº¶åããªã¢ããç³»éåäœã䜿çšããæ°ŽçŸ
åå¯èœåããªã¢ããç³»æå
æ§æš¹èçµæç©ãç¹å
¾
54â22229å·å
¬å ±ã«èšèŒãããŠããããã®æ¹æ³ã«
ãã補é ãããæ°ŽçŸåå¯èœåããªã¢ããç³»æå
æ§
æš¹èçã¯åå³ã«å¯ŸããŠã®åçŸæ§ãè¯å¥œã§ãããã€
ã³ãã®åçã転移æ§ãããã«åäžããåå°å·æã®
èå·æ§ãéåžžã«è¯å¥œã§ãããæå
æ§æš¹èçµæç©ã
å
硬åããŠçæãã硬åç©ïŒä»¥äžå
硬åç©ãšç¥
ããïŒã硬ãã®ã§ãã®çš®ã®æå
æ§æš¹èã¯å°å·é床
ã®é
ãå¹³å°åŒå°å·æ©ã«äŸããããŸãå°å·ãããçŽ
ãã³ãŒãçŽçã®æ¯èŒçè¡šé¢ã®å¹³ããªçŽãžã®å°å·ã«
éãããŠããŸãã
ããããªãããè¿å¹Žå°å·ã®çååãé«éåãç®
çãšããŠå°å·é床ã®éã茪転åŒå°å·æ©ã®å©çšãé²
ãã§ããããŸãå°å·çšéãäŒç¥šé¡ãã³ã³ããŠãŒã¿
ãŒããªãŒã é¡ãžãæ¡å€§ããŠããŠãããå°å·ããã
çŽãäžè³ªçŽçã®è¡šé¢ã®ç²ãªçŽãžãšåºãã€ãŠããŠã
ãããã®æ§ãªæ°ããªçšéã«ã€ããŠã¯åŸæ¥ã®å
硬å
ç©ã®ããã«ç¡¬åºŠãæ¯èŒç硬ããã®ãå©çšãããšã
çŽè¡šé¢ã®å¹åžã®éšåã®åžéšã«ã®ã¿ã€ã³ãã転äœã
ããå¹éšã«ã¯ã€ã³ãã®ã®ããªãå°å·ç©ïŒéåžžã€ã³
ãã®ã«ã¹ã¬ãšç§°ãããã®ïŒãåŸãããŠããŸããã
ã®æ¬ ç¹ã解決ããããã«ã¯å
硬åç©ã®ç¡¬åºŠãæ¯èŒ
çæããããå°å·æã«å å§ãããå°å§ã«ããçŽè¡š
é¢ã«æ¥ããŠããéšåã®å
硬åç©ãçŽã®å¹åžã«å¿ã
ãŠå€åœ¢ããå¯çäžè¯éšããªããªãæ§ã«ããªããŠã¯
ãªããªãã
æ¬çºæè
ãã¯ä»¥äžã®ãããªæ¬ ç¹ã解æ¶ãã¹ãã
å
硬åç©ã®ç¡¬åºŠãæããããé«éå°å·ãè¡šé¢ã®ç²
ãªçŽãžã®å°å·ã«äŸããŠãã€ã³ãã®ã«ã¹ã¬ã®ãªãè¯
奜ãªå°å·ç©ãäžãããããæ©æ¢°ç匷床ã«åªããè
å·åã®åªãããæ°ŽçŸåå¯èœåããªã¢ããç³»æå
æ§
æš¹èçµæç©ã«ã€ããŠçš®ã
éæç 究ããçµæãæ¬çº
æãå®æããã«å°ã€ããããªãã¡æ¬çºæã¯ãå¡©åº
æ§çªçŽ ãæããããªã¢ãããå
éåå¯èœãªäžé£œå
çµåãæããåéäœããã³å
éåéå§å€ãããªã
æå
æ§æš¹èçµæç©ã«ãããŠãå
éåå¯èœãªäžé£œå
çµåãæããåéäœã®å
šéšãŸãã¯äžéšãšããŠäžèš
äžè¬åŒ(1)ã§è¡šããããååç©ãå«æããããšãç¹
城ãšããæå
æ§æš¹èçµæç©ã§ããã
åŒäžãã¯ççŽ ååæ°ãïŒã24ã®äºäŸ¡ã®çåæ°Ž
çŽ åºãŸãã¯ååäžã«ââãâCOOâãâ
NHCOâãæããççŽ ååæ°ïŒã24ã®äºäŸ¡ã®ç
åæ°ŽçŽ åºãã¯âSO3Hã
The present invention relates to a water-developable polyamide photosensitive resin composition. Conventionally, printing convex plates have been produced by exposing the photosensitive layer of a photosensitive original plate consisting of a layer of a photosensitive resin composition (hereinafter referred to as a photosensitive layer) and a support through a negative film or a positive film having a transparent image area. conduct,
After the photosensitive resin composition in the exposed areas is cured and made insolubilized, the resin composition in the unexposed areas is dissolved and removed using a suitable developer. Such photosensitive resin compositions usually contain a monomer having a photopolymerizable unsaturated bond, a polymer that is soluble in a suitable developer and becomes insolubilized by photopolymerization of the monomer, and a photointensifier. Contains a sensitizer and a thermal polymerization inhibitor. In the unexposed areas, the photosensitive resin composition, particularly the polymer, is soluble in a suitable developer;
The exposed areas become insoluble in the same solvent. Further, the polymer has high mechanical strength after photopolymerization of a monomer having a photopolymerizable unsaturated bond, and is not swollen by organic solvents. As such a polymer, an alcohol-soluble copolymer polyamide has been proposed, for example,
Publication No. 14719, Special Publication No. 15513, Publication No. 15513, Special Publication No. 15513
- Described in Publication No. 7330, etc. However, all of these polyamide-based photosensitive resin compositions are soluble in alcohol but insoluble in water, so the polyamide-based plate material is
An organic solvent such as alcohol must be used as a developer to dissolve and remove all unexposed areas of the resin layer. The use of these organic solvents as developing solutions not only poses problems in terms of handling, storage, waste liquid, and expensive explosion-proof developing equipment, but also
The above-mentioned polyamide has drawbacks such as a slow dissolution rate in organic solvents such as alcohol, and therefore a relatively long time is required for development of a composition prepared from it. Therefore, as a method to solve these problems, a water-developable polyamide-based photosensitive resin composition using a water-soluble polyamide-based polymer was developed by Tokko Sho.
It is described in Publication No. 54-22229. The water-developable polyamide-based photosensitive resin plate produced by this method has good reproducibility with respect to the original image, further improves ink acceptance and transfer properties, and has excellent printing durability during printing. However, since the cured product produced by photocuring the photosensitive resin composition (hereinafter referred to as photocured product) is hard, this type of photosensitive resin is used in flatbed printing machines with slow printing speeds, and Printing is also limited to paper with a relatively flat surface, such as coated paper. However, in recent years, with the aim of saving labor and speeding up printing, the use of high-speed rotary printing presses has progressed, and printing applications have also expanded to include slips and computer forms. It is spreading to papers with rough surfaces such as high-quality paper. For such new applications, if we use a relatively hard material like the conventional photocured material,
Ink is transferred only to the convex portions of the uneven portion of the paper surface, resulting in printed matter (usually referred to as ink smearing) in which no ink is applied to the concave portions. In order to solve this problem, the hardness of the photocured material is relatively soft, and the pressure applied during printing causes the photocured material in the part that is in contact with the paper surface to deform according to the unevenness of the paper, resulting in poor adhesion. We have to make sure that the parts disappear. In order to eliminate the above drawbacks, the present inventors
A water developable product that has a soft hardness of the photocured material and produces good prints without ink fading even when used for high-speed printing or printing on paper with a rough surface, and has excellent mechanical strength and printing durability. As a result of various intensive studies on photosensitive polyamide-based resin compositions, the present invention has been completed. That is, the present invention provides a photosensitive resin composition comprising a polyamide having basic nitrogen, a monomer having a photopolymerizable unsaturated bond, and a photopolymerization initiator. This is a photosensitive resin composition characterized by containing a compound represented by the following general formula (1) as all or a part of the compound. In the formula, X is the number of carbon atoms, a divalent hydrocarbon group of 1 to 24, or -O-, -COO-, - in the molecule
A divalent hydrocarbon group having 1 to 24 carbon atoms having NHCO-, Y is -SO 3 H,
ãåŒããformulaã
ãåŒãã瀺ããã¯ççŽ ååæ°ïŒã10ã®ã¢ã«
ãã«åºãŸãã¯ããšãã«åºã瀺ãã
æ¬çºæã®æå
æ§æš¹èçµæç©ã¯äž»æãšãªãããªã¢
ããããå¡©åºæ§çªçŽ ãæããããªã¢ãããšäžè¬åŒ
(1)ã§ç€ºãããå
éåå¯èœãªäžé£œåçµåãæããå
éäœãšäžéšãããã¯å
šéšãã€ãªã³çµåããŠçæã
ãã¢ã³ã¢ããŠã å¡©åçªçŽ ååãæããéåäœã§ã
ããããæ°Žã«å®¹æã«æº¶è§£ããæ°Žã«ããçŸåãå¯èœ
ãšãªããããã«è©²æå
æ§æš¹èçµæç©ã¯äžè¬åŒ(1)ã§
è¡šããããååç©ãšã®ã€ãªã³çµåã«ãããäž»æãš
ãªãããªã¢ããã®æ°ŽçŽ çµåãç«äœé害ã®ããæžå°
ããå¯å¡å¹æãåããŠæè»ã«ãªããããã«å
硬å
ããå Žåãäžè¬åŒ(1)ã§è¡šããããååç©ãåç¬ã§
éåãããã¯ä»ã®å
éå¯èœãªäžé£œåçµåãæãã
åéäœãšå
±éåããã®ã§ãå
éåçæç©ã®ïŒæ¬¡å
ççµåã®ç¶²ç®ãç²ã«ãªãããã®ããæè»ã«ãªãã
ãããå
硬ååŸã®æå
æ§æš¹èã§ã¯ãããªã¢ãããš
å
éåå¯èœãªäžé£œåçµåãæããåéäœã®å
éå
äœãšãã€ãªã³çµåããŠããã®ã§ãè湿æ§ãè溶å€
æ§ãããããã€ååŠçç¹æ§ãç¹ã«èæ©èæ§ã®ãã
ãããã®ãåŸãããã
æ¬çºæã«ãããŠãå
éåå¯èœãªäžé£œåçµåãæ
ããåéäœã®å
šéšãŸãã¯äžéšãšããŠäœ¿çšãããäž
è¬åŒ(1)ã§è¡šããããååç©ã¯ãããšãã°äžèšåŒã§
瀺ãããååç©ã§ããã
ãªã©ãããããããã®åéäœãåç¬ãããã¯ïŒçš®
以äžæ··åããŠäœ¿çšããããããã®åéäœã¯å¡©åºæ§
çªçŽ ãå«æããããªã¢ããã«å¯ŸããŠåçŽåå€ãšã
ãŠåå¿ãããåçŽåå€ãšããŠäžè¬åŒ(1)ã§ç€ºãåå
ç©ã®ä»ã«ãå¡©é
žãç¡«é
žãªã©ã®ç¡æ©é
žãè»é
žãé
¢
é
žãã¯ãã«é
¢é
žããã¬ã€ã³é
žããã¿ã«é
žãã¢ãžã
ã³é
žãã¢ã¯ãªã«é
žãã¡ã¿ã¯ãªã«é
žãªã©ã®ææ©é
žã
å©çšã§ããããŸããåèšäžè¬åŒ(1)ã§ç€ºãååç©ã
å«ãåçŽåå€ã®æ·»å éã¯ããªã¢ããäžã«ååšãã
å¡©åºæ§çªçŽ ã®éãæ°Žã«å¯Ÿãã溶解æ§ãªã©ãèæ
®ã
ãŠé©å®éžæããããšãã§ãããããªã¢ããäžã«å
åšããå¡©åºæ§çªçŽ ã®éã«å¯ŸããŠãäžè¬åŒ(1)ã§è¡šã
ãããååç©ãïŒã¢ã«ïŒ
以äžç¹ã«50ã100ã¢ã«ïŒ
ååšããããšãå¿
èŠã§ãããäžè¬åŒ(1)ã§è¡šããã
ãååç©ãïŒã¢ã«ïŒ
æªæºã§ã¯å
æ¶æ©åŸã®æå
æ§æš¹
èçµæç©ã®å¿
èŠãªæè»æ§ãæ¬ ããã®ã§å¥œãŸãããª
ãã
æ¬çºæã«ãããŠã䜵çšå¯èœãªåèšäžè¬åŒ(1)ã§ç€º
ãããååç©ä»¥å€ã®å
éåãåŸãäžé£œåçµåãæ
ããåéäœãšããŠã¯ãããšãã°ã¡ãã«ã¢ã¯ãªã¬ãŒ
ããã¡ãã«ã¡ã¿ã¢ã¯ãªã¬ãŒãããã³ãžã«ã¢ã¯ãªã¬
ãŒããããªããã ããšãã«ã¢ã¯ãªã¬ãŒããã·ã¯ã
ããã·ã«ã¢ã¯ãªã¬ãŒããïŒâããããã·ãããã«
ã¢ã¯ãªã¬ãŒããã¢ã¯ãªã«ã¢ãããã¡ã¿ã¢ã¯ãªã«ã¢
ãããâã¡ãããŒã«ã¢ã¯ãªã«ã¢ãããïœâãã
ãã·ã¡ãã«ã¢ã¯ãªã«ã¢ãããisoâãããã·ã¡ã
ã«ã¢ã¯ãªã«ã¢ãããâïœâããã«ã¢ã¯ãªã«ã¢ã
ããã¢ã¯ãªããããªã«ãã¹ãã¬ã³ãããã«ããªãž
ã³çã®äžé£œåäºéçµåãïŒåæããåéäœãæã
ã¯ã¢ãªã«ã¡ã¿ã¢ã¯ãªã¬ãŒãããšãã¬ã³ã°ãªã³ãŒã«
ãžã¢ã¯ãªã¬ãŒãããšãã¬ã³ã°ãªã³ãŒã«ãžã¡ã¿ã¢ã¯
ãªã¬ãŒããïŒïŒïŒâãããã³ãžãªãŒã«ãžã¢ã¯ãªã¬
ãŒããïŒïŒïŒâãããã³ãžãªãŒã«ã¡ã¿ã¢ã¯ãªã¬ãŒ
ããïŒïŒïŒâãã¿ã³ãžãªãŒã«ãžã¢ã¯ãªã¬ãŒãã
ïŒïŒïŒâãã¿ã³ãžãªãŒã«ã¡ã¿ã¢ã¯ãªã¬ãŒããïŒïŒ
ïŒâãããµã³ãžãªãŒã«ãžã¢ã¯ãªã¬ãŒããïŒïŒïŒâ
ãããµã³ãžãªãŒã«ãžã¡ã¿ã¢ã¯ãªã¬ãŒããããªã¡ã
ããŒã«ãããã³ããªã¢ã¯ã¬ãŒããããªã¡ãããŒã«
ãããã³ããªã¡ã¿ã¢ã¯ãªã¬ãŒããããã©ã¡ãããŒ
ã«ã¡ã¿ã³ããªã¢ã¯ãªã¬ãŒããããªã¢ã¯ãªãã€ã«ãª
ãã·ãšãã«ãã¹ããšã€ããã¡ãã¬ã³ãã¹ã¢ã¯ãªã«
ã¢ããããšãã¬ã³ãã¹ã¢ã¯ãªã«ã¢ããããããã¬
ã³ãã¹ã¢ã¯ãªã«ã¢ãããããã¬ã³ãã¹ã¢ã¯ãªã«ã¢
ãããã¡ãã¬ã³ãã¹ã¡ã¿ã¯ãªã«ã¢ããããšãã¬ã³
ãã¹ã¡ã¿ã¯ãªã«ã¢ããããããã¬ã³ãã¹ã¡ã¿ã¯ãª
ã«ã¢ããçã®äžé£œåäºéçµåãïŒå以äžæããå
éäœãããã
å°ãããªã¢ããäžã«ååšããå¡©åºæ§çªçŽ ã®éã«
察ããŠãäžè¬åŒ(1)ã§è¡šããããååç©ãšäœµçšãã
åèšåçŽåå€ã®åã®éã®æ¯ã100ã¢ã«ïŒ
以äžã«ãª
ãå Žåãå¡©åºæ§çªçŽ ã®ã¢ã«éãã䜵çšããåçŽå
å€ã®ã¢ã«éãåŒããããã«åŒ(1)ã®ååç©ããæ®äœ
ã®çã¢ã«éã«ããé以äžã®åŒ(1)ã®ååç©ã¯äŸ¿å®
äžãæ¬çºæã«æŒãŠã䜵çšå¯èœãªåçŽåå€ä»¥å€ã®å
éåå¯èœãªäžé£œåçµåãæããåéäœã®é¡äžã«å
¥
ããã
æ¬çºæã«ãããŠå¡©åºæ§çªçŽ ãæããããªã¢ãã
ãšã¯ãããšãã°äžèšäžè¬åŒïŒïŒãïŒïŒã§ç€ºã
ããåéäœãéååæãšããŠåŸããããã®ã§ã
ãã
ïŒäžèšäžè¬åŒïŒïŒãïŒïŒã«ãããŠãïŒ
Râ²ã¯æ°ŽçŽ ååãŸãã¯ççŽ ååæ°ïŒã10åã®çå
æ°ŽçŽ æ®åºãR1ïŒR2ïŒR3ã¯ççŽ ååæ°ïŒã15åã®
ã¢ã«ãã¬ã³åºãR4ïŒR5ã¯ççŽ ååæ°ïŒã10åã®
çåæ°ŽçŽ æ®åºãïŒïŒ¢ã¯âNH2ãâCOOHãâ
COORâ³ã瀺ãããšïŒ¢ã¯åæã«åããããã¯çž
éããŠããããããã§Râ³ã¯ççŽ ååæ°ïŒã10å
ã®çåæ°ŽçŽ æ®åºã瀺ããïŒ
ïŒäžèšäžè¬åŒïŒïŒã«ãããŠãR6ïŒR7ã¯ççŽ
ååæ°ïŒã10åã®çåæ°ŽçŽ æ®åºã瀺ããR6ãšR7
ã¯å
±åããŠç°ãç°ç¯ç°ã圢æããŠãè¯ãããŸã
R8ã¯ççŽ ååæ°ïŒãïŒåã®äœçŽã¢ã«ãã«åºãã
ãã¯[Formula] is shown, and R represents an alkyl group having 1 to 10 carbon atoms or a phenyl group. In the photosensitive resin composition of the present invention, the main material polyamide is a polyamide having basic nitrogen and the general formula
It is an ammonium salt-type nitrogen atom-containing polymer produced by partially or fully ionic bonding with the photopolymerizable unsaturated bond-containing monomer shown in (1), so it easily dissolves in water. Development with water becomes possible. Furthermore, due to the ionic bonding with the compound represented by general formula (1), the hydrogen bonds in the polyamide, which is the main material, are reduced due to steric hindrance, and the photosensitive resin composition becomes flexible due to the plasticizing effect, and furthermore, the photosensitive resin composition becomes flexible and photosensitive. When cured, the compound represented by formula (1) is polymerized alone or copolymerized with other photopolymerizable monomers having unsaturated bonds, so that the three-dimensional bond network of the photopolymerized product is It becomes coarser and therefore more flexible.
In addition, in the photosensitive resin after photocuring, the polyamide and the monomer photopolymer having photopolymerizable unsaturated bonds are ionicly bonded, so it has good moisture resistance, solvent resistance, and mechanical properties. In particular, products with excellent abrasion resistance can be obtained. In the present invention, the compound represented by the general formula (1) used as all or part of the monomer having a photopolymerizable unsaturated bond is, for example, a compound represented by the following formula. and so on. These monomers may be used alone or in combination. These monomers react as quaternizing agents for polyamides containing basic nitrogen. In addition to the compound represented by general formula (1) as a quaternizing agent, inorganic acids such as hydrochloric acid and sulfuric acid, and organic acids such as formic acid, acetic acid, chloroacetic acid, maleic acid, phthalic acid, adipic acid, acrylic acid, and methacrylic acid Also available. Further, the amount of the quaternizing agent containing the compound represented by the general formula (1) can be appropriately selected in consideration of the amount of basic nitrogen present in the polyamide, the solubility in water, and the like. The amount of the compound represented by general formula (1) is 5 mol% or more, especially 50 to 100 mol%, based on the amount of basic nitrogen present in the polyamide.
It is necessary to exist. If the amount of the compound represented by general formula (1) is less than 5 mol %, the photosensitive resin composition after photocrosslinking will lack the necessary flexibility, which is not preferred. In the present invention, monomers having a photopolymerizable unsaturated bond other than the compound represented by the general formula (1) that can be used in combination include, for example, methyl acrylate, methyl methacrylate, benzyl acrylate, tribromphenyl acrylate. , cyclohexyl acrylate, 2-hydroxypropyl acrylate, acrylamide, methacrylamide, N-methylolacrylamide, n-butoxymethylacrylamide, iso-butoxymethylacrylamide, Nt-butylacrylamide, acrylonitrile, styrene, vinylpyridine, etc. Monomers having one heavy bond, or allyl methacrylate, ethylene glycol diacrylate, ethylene glycol dimethacrylate, 1,3-propanediol diacrylate, 1,3-propanediol methacrylate, 1,4-butanediol diacrylate,
1,4-butanediol methacrylate, 1,
6-hexanediol diacrylate, 1,6-
Hexanediol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, tetramethylolmethane triacrylate, triacryloyloxyethyl phosphate, methylenebisacrylamide, ethylenebisacrylamide, propylenebisacrylamide, butylenebisacrylamide, methylenebis There are monomers having two or more unsaturated double bonds, such as methacrylamide, ethylenebismethacrylamide, and propylenebismethacrylamide. In addition, when the ratio of the sum of the quaternizing agent used in combination with the compound represented by general formula (1) to the amount of basic nitrogen present in the polyamide is 100 mol% or more, the basic nitrogen For convenience, in the present invention, the compound of formula (1) in an amount equal to or more than the equivalent molar amount of the compound of formula (1) after subtracting the molar amount of the quaternizing agent used in combination from the molar amount of nitrogen, It is included in the category of monomers having photopolymerizable unsaturated bonds other than quaternizing agents that can be used in combination. In the present invention, the polyamide having basic nitrogen is obtained, for example, by using monomers represented by the following general formulas () to () as polymerization raw materials. (In the above general formulas () to (), R,
R' is a hydrogen atom or a hydrocarbon residue having 1 to 10 carbon atoms, R 1 , R 2 , and R 3 are alkylene groups having 1 to 15 carbon atoms, and R 4 and R 5 are 1 to 1 carbon atoms. 10 hydrocarbon residues, A and B are -NH 2 , -COOH, -
COOR'', and A and B may be the same or different at the same time.R'' represents a hydrocarbon residue having 1 to 10 carbon atoms. ) (In the above general formula (), R 6 and R 7 represent hydrocarbon residues having 1 to 10 carbon atoms. R 6 and R 7
may join together to form a ring or a heterocyclic ring. Also
R 8 is a lower alkyl group having 1 to 3 carbon atoms or
ãåŒãã瀺ããããã§ã¯R6ïŒR7ã¯
åè¿°ã®åºã§ãããã¯Î³âã¢ãããããã«åºã瀺
ããïŒ
åèšäžè¬åŒïŒïŒã§ç€ºãããå
·äœçãªåéäœãš
ããŠã¯ïŒ®ïŒNâ²âãã¹ïŒã¢ããã¡ãã«ïŒâããã©
ãžã³ãïŒNâ²âãã¹ïŒÎ²âã¢ãããšãã«ïŒâã
ãã©ãžã³ãïŒNâ²âãã¹ïŒÎ²âã¢ãããšãã«ïŒ
âã¡ãã«ããã©ãžã³ãâïŒã¢ããã¡ãã«ïŒâ
Nâ²âïŒÎ²âã¢ãããšãã«ïŒâããã©ãžã³ãïŒ
Nâ²âãã¹ïŒÎ³âã¢ãããããã«ïŒâããã©ãžã³
çã®ãžã¢ãã³é¡ãïŒNâ²âãã¹âïŒã«ã«ããã·
ã¡ãã«ïŒâããã©ãžã³ãïŒNâ²âãã¹ïŒã«ã«ã
ãã·ã¡ãã«ïŒâã¡ãã«ããã©ãžã³ãïŒNâ²âã
ã¹ïŒã«ã«ããã·ã¡ãã«ïŒâïŒïŒïŒâãžã¡ãã«ãã
ã©ãžã³ãïŒNâ²âãã¹ïŒÎ²âã«ã«ããã·ãšãã«ïŒ
âããã©ãžã³ãïŒNâ²âãã¹ïŒÎ³âã«ã«ããã·
ãããã«ïŒâããã©ãžã³ãâïŒÎ²âã«ã«ããã·
ãšãã«ïŒâNâ²âïŒã«ã«ããã·ã¡ãã«ïŒâããã©
ãžã³ãªã©ã®ãžã«ã«ãã³é
žé¡ãããã¯ãããã®äœçŽ
ã¢ã«ãã«ãšã¹ãã«ãé
žããã²ã³åç©ããã³ïŒ®â
ïŒã¢ããã¡ãã«ïŒâNâ²âïŒã«ã«ããã·ã¡ãã«ïŒâ
ããã©ãžã³ãâïŒã¢ããã¡ãã«ïŒâNâ²âïŒÎ²
âã«ã«ããã·ãšãã«ïŒâããã©ãžã³ãâïŒÎ²â
ã¢ãããšãã«ïŒâNâ²âïŒÎ²âã«ã«ããã·ãšãã«ïŒ
âããã©ãžã³ãâïŒã¢ããã¡ãã«ïŒâNâ²â
ïŒã«ã«ããã·ã¡ãã«ïŒâïŒâã¡ãã«ããã©ãžã³ãª
ã©ã®Ïâã¢ããé
žã§ããã
äžèšäžè¬åŒïŒïŒã§ç€ºãããå
·äœçãªåéäœãš
ããŠã¯ãâïŒÎ²âã¢ãããšãã«ïŒããã©ãžã³ã
âïŒÎ³âã¢ãããããã«ïŒããã©ãžã³ãâ
ïŒÏâã¢ããããã·ã«ïŒããã©ãžã³ãâïŒÎŽâ
ã¢ããã·ã¯ãããã·ã«ïŒããã©ãžã³ãâïŒÎ²â
ã¢ãããšãã«ïŒâïŒâã¡ãã«ããã©ãžã³ãâ
ïŒÎ²âã¢ãããšãã«ïŒâïŒïŒïŒâãžã¡ãã«ããã©
ãžã³ãâïŒÎ²âã¢ãããããã«ïŒâïŒâã¡ãã«
ããã©ãžã³ãâïŒÎ³âã¢ãããããã«ïŒâïŒïŒ
ïŒâãžã¡ãã«ããã©ãžã³ãªã©ã®ãžã¢ãã³é¡ãâ
ã«ã«ããã·ã¡ãã«ããã©ãžã³ãâïŒÎ²âã«ã«ã
ãã·ãšãã«ïŒâããã©ãžã³ãâïŒÎ³âã«ã«ãã
ã·ãããã«ïŒããã©ãžã³ãâïŒÏâã«ã«ããã·
ããã·ã«ïŒããã©ãžã³ãâïŒÎŽâã«ã«ããã·ã·
ã¯ãããã·ã«ïŒããã©ãžã³ãâïŒÎ²âã«ã«ãã
ã·ãšãã«ïŒâïŒâã¡ãã«ããã©ãžã³ãâïŒÎ²â
ã«ã«ããã·ãšãã«ïŒâïŒïŒïŒâãžã¡ãã«ããã©ãž
ã³ãªã©ã®Ïâã¢ããé
žãããã¯ãããã®äœçŽã¢ã«
ãã«ãšã¹ãã«é¡ãªã©ã§ããã
åèšäžè¬åŒïŒïŒã§ç€ºãããå
·äœçãªåéäœãš
ããŠã¯ãïŒïŒ®âãžïŒÎ²âã¢ãããšãã«ïŒãšãã«
ã¢ãã³ãïŒïŒ®âãžïŒÎ³âã¢ãããããã«ïŒã¡ã
ã«ã¢ãã³ãïŒïŒ®âãžïŒÎ²âã¢ãããšãã«ïŒâã¡
ãã«ã¢ãã³ãïŒNâ²âãžïŒÎ³âã¢ãããããã«ïŒ
âãšãã«ã¢ãã³ãïŒïŒ®âãžïŒÎ³âã¢ããããã
ã«ïŒã€ãœãããã«ã¢ãã³ãïŒïŒ®âãžïŒÎ³âã¢ã
ããããã«ïŒâã·ã¯ãããã·ã«ã¢ãã³ãïŒïŒ®â
ãžïŒÎŽâã¢ããâïœâããã«ïŒããšãã«ã¢ãã³ã
âã¡ãã«ââïŒÎ²âã¢ãããšãã«ïŒâïŒïŒïŒ
âãããã³ãžã¢ãã³ãªã©ã®ãžã¢ãã³é¡ãïŒïŒ®â
ãžïŒã«ã«ããã·ã¡ãã«ïŒâã¡ãã«ã¢ãã³ãïŒïŒ®
âãžïŒÎ²âã«ã«ããã·ãšãã«ïŒã¡ãã«ã¢ãã³ã
ïŒïŒ®âãžïŒÎ²âã«ã«ããã·ãšãã«ïŒâã¡ãã«ã¢
ãã³ãïŒïŒ®âãžïŒÎ²âã«ã«ããã·ãšãã«ïŒâã€
ãœãããã«ã¢ãã³ãâã«ã«ããã·ã¡ãã«ââ
ïŒÎ²âã«ã«ããã·ãšãã«ïŒâã¡ãã«ã¢ãã³ãªã©ã®
ãžã«ã«ãã³é
žé¡ãããã¯ãããã®äœçŽã¢ã«ãã«ãš
ã¹ãã«ãé
žããã²ã³åç©ãããã³ïŒ®âïŒã¢ããã¡
ãã«ïŒââïŒã«ã«ããã·ã¡ãã«ïŒâã¡ãã«ã¢ã
ã³ãâïŒÎ²âã¢ãããšãã«ïŒââïŒÎ²âã«ã«
ããã·ãšãã«ïŒâã¡ãã«ã¢ãã³ãâïŒã¢ããã¡
ãã«ïŒââïŒÎ²âã«ã«ããã·ã«ãšãã«ïŒâã€ãœ
ãããã«ã¢ãã³ãâïŒÎ³âã¢ãããããã«ïŒâ
âïŒÎ³âã«ã«ããã·ãããã«ïŒâã€ãœãããã«
ã¢ãã³ãâïŒÎ³âã¢ãããããã«ïŒââïŒÎ²
âã«ã«ããã·ãšãã«ïŒâã¡ãã«ã¢ãã³ãªã©ã®Ïâ
ã¢ãã³é
žé¡ã§ããã
åèšäžè¬åŒïŒïŒã§ç€ºãããå
·äœçãªåéäœãš
ããŠã¯ãïŒNâ²âãžã¡ãã«âïŒNâ²âãžâïŒÎ³
âã¢ãããããã«ïŒâãšãã¬ã³ãžã¢ãã³ãïŒ
Nâ²âãžã¡ãã«âïŒNâ²âãžâïŒÎ³âã¢ãããã
ãã«ïŒâããã©ã¡ãã¬ã³ãžã¢ãã³ãïŒNâ²âãž
ã€ãœããã«âïŒNâ²âãžâïŒÎ³âã¢ããããã
ã«ïŒâãããµã¡ãã¬ã³ãžã¢ãã³ãïŒNâ²âãžã·
ã¯ãããã·ã«âïŒNâ²âãžâïŒÎ³âã¢ãããã
ãã«ïŒâãããµã¡ãã¬ã³ãžã¢ãã³ãïŒNâ²âãž
âïŒÎ³âã¢ãããããã«ïŒâïŒïŒïŒïŒïŒâããªã¡
ãã«âãããµã¡ãã¬ã³ãžã¢ãã³ãªã©ã®ãžã¢ãã³
é¡ãïŒNâ²âãžã¡ãã«âïŒNâ²âãžïŒã«ã«ãã
ã·ã¡ãã«ïŒâãšãã¬ã³ãžã¢ãã³ãïŒNâ²âãžã¡
ãã«âïŒNâ²âãžâïŒÎ²âã«ã«ããã·ãšãã«ïŒ
âãšãã¬ã³ãžã¢ãã³ãïŒNâ²âãžã¡ãã«âïŒ
Nâ²âãžâïŒÎ³âã«ã«ããã·ãããã«ïŒâãããµ
ã¡ãã¬ã³ãžã¢ãã³ãªã©ã®ãžã«ã«ãã³é
žé¡ãããã¯
ãããã®äœçŽã¢ã«ãã«ãšã¹ãã«ãé
žããã²ã³åç©
ããã³ïŒ®ïŒNâ²âãžã¡ãã«ââïŒã¢ããã¡ãã«ïŒ
âNâ²âïŒã«ã«ããã·ã¡ãã«ïŒâãšãã¬ã³ãžã¢ã
ã³ãïŒNâ²âãžã¡ãã«ââïŒÎ²ã¢ãããšãã«ïŒ
âNâ²âïŒÎ²âã«ã«ããã·ãšãã«ïŒâãšãã¬ã³ãž
ã¢ãã³ãïŒNâ²âãžã¡ãã«ââïŒã¢ããã¡ã
ã«ïŒâNâ²âïŒã«ã«ããã·ãšãã«ïŒâãããµã¡ã
ã¬ã³ãžã¢ãã³ãªã©ã®Ïâã¢ããé
žã§ããã
äžèšäžè¬åŒïŒïŒã§ç€ºãããå
·äœçãªåéäœãš
ããŠã¯ãïŒâã¡ãã«âïŒâïŒïŒ®ïŒNâ²âãžã¡ãã«
ã¢ããã¡ãã«ïŒâïŒïŒïŒâãžãªããµâãŠã³ãã«ã³
ãžã¢ãã³ãïŒâã¡ãã«âïŒâïŒïŒ®ïŒNâ²âãžãšã
ã«ã¢ããã¡ãã«ïŒâïŒïŒïŒâãžãªããµâãŠã³ãã«
ã³ãžã¢ãã³ãïŒâãšãã«âïŒâïŒïŒ®ïŒïŒ®âãžã¡ã
ã«ã¢ããã¡ãã«ïŒâïŒïŒïŒâãžãªããµâãŠã³ãã«
ã³ãžã¢ãã³ãïŒïŒïŒâãã¹ïŒïŒ®ïŒïŒ®âãžã¡ãã«ã¢
ããã¡ãã«ïŒâïŒïŒïŒâãžãªããµã³ãŠã³ãã«ã³ãž
ã¢ãã³ãªã©ã®ãžã¢ãã³é¡ã§ããã
ãããå¡©åºæ§çªçŽ ãããããåéäœãåç¬ãã
ãã¯ïŒçš®ä»¥äžçšããŠçž®éåãè¡ãããªã¢ããã圢
æãããããªãã¡ãäžèšåéäœãÏâã¢ããé
žã
ããã¯ãã®ã¢ã«ãã«ãšã¹ãã«é¡ãªã©ã®ããã«åç¬
éåã«ãã€ãŠããªã¢ããã圢æãåŸãåéäœã¯å
ç¬ã§çšããããšãã§ãããäžæ¹ãäžèšåéäœããž
ã«ã«ãã³é
žãããã¯ãã®ã¢ã«ãã«ãšã¹ãã«é¡ãé
ž
ããã²ã³åç©ãªã©ã§ããã°ãžã¢ãã³ãšããŸãäžèš
åéäœããžã¢ãã³ã§ããã°ãžã«ã«ãã³é
žãããã¯
ãã®èªå°äœãšãçž®éåãããããšã«ãã€ãŠããªã¢
ããã圢æããããã
ããã«æ¬çºæã«çšããããªã¢ããã®éååæãš
ããŠã¯ãåèšäžè¬åŒïŒïŒãïŒïŒã§ç€ºãããå
éäœã®ã»ãã«ãéåžžã®ããªã¢ããã®éåã«çšãã
ããèèªæããã³ïŒãŸãã¯è³éŠæã®ãžã«ã«ãã³
é
žããžã¢ãã³ãÏâã¢ããé
žãã©ã¯ã¿ã ãªã©ã䜵
çšããŠãããã䜵çšå¯èœãªãžã«ã«ãã³é
žãšããŠ
ã¯ãããšãã°ã³ãã¯é
žãã¢ãžãã³é
žãã°ã«ã¿ã«
é
žãã¢ãŒã©ã€ã³é
žãã»ãã·ã³é
žããã«ã³ãžã«ã«ã
ã³é
žããã¬ãã¿ã«é
žãã€ãœãã¿ã«é
žãã·ã¯ããã
ãµã³ãžã«ã«ãã³é
žãªã©ã®èèªæããã³ïŒãŸãã¯è³
éŠæã®ãžã«ã«ãã³é
žãããã¯ãããã®é
žã®äœçŽã¢
ã«ãã«ãšã¹ãã«ãé
žããã²ã³åç©ãªã©ãçšããã
ãžã¢ãã³ãšããŠã¯ããšãã°ããã©ã¡ãã¬ã³ãžã¢ã
ã³ããã³ã¿ã¡ãã¬ã³ãžã¢ãã³ããããµã¡ãã¬ã³ãž
ã¢ãã³ãããã¿ã¡ãã¬ã³ãžã¢ãã³ããªã¯ã¿ã¡ãã¬
ã³ãžã¢ãã³ãããã¡ãã¬ã³ãžã¢ãã³ããã«ã¡ãã¬
ã³ãžã¢ãã³ããªã©ã®çŽé飜åèèªæãžã¢ãã³ãã¡
ã¿ãã·ãªã¬ã³ãžã¢ãã³ããã©ãã·ãªã¬ã³ãžã¢ãã³
ãªã©ã®è³éŠæãžã¢ãã³ãã·ã¯ããããµã³ãã¹ã¡ã
ã«ã¢ãã³ãªã©ã®èèªæãžã¢ãã³ãªã©ãçšãããÏ
âã¢ããé
žãšããŠã¯ãããšãã°ã¢ããã«ããã³
é
žãã¢ããããã¿ã³é
žãã¢ããã«ããªã«é
žãã¢ã
ãã«ããã³é
žãã¢ããã©ãŠãªã«é
žãªã©ãçšããã
ã©ã¯ã¿ã ãšããŠã¯ãããšãã°Îµâã«ããã©ã¯ã¿
ã ãαâã¡ãã«âεã«ããã©ã¯ã¿ã ãεâã¡ãã«
âεã«ããã©ã¯ã¿ã ãã·ã¯ãããã¿ãã³ã€ãœãªã
ã·ã ãã·ã¯ããªã¯ã¿ãã³ã€ãœãªãã·ã ãªã©ãçšã
ãã
以äžã®åéäœããåŸãããå¡©åºæ§çªçŽ ååãæ
ããããªã¢ããã®éåæ¹æ³ã¯åŸæ¥å
¬ç¥ã®ããªã¢ã
ãã®è£œé æ¹æ³ã«åŸã€ãŠè¡ãªãããšãã§ãããå¡©åº
æ§çªçŽ ãå«æããåéäœæåã¯å
šããªã¢ããæ§æ
æåã®ïŒã100ã¢ã«ïŒ
ã§ãããç¹ã«20ã50ã¢ã«ïŒ
ã§ããããšã奜ãŸããããªããäžè¿°ã«ç€ºãããå¡©
åºæ§çªçŽ ãå«æããåéäœã®ä»ã«ãäžè¬åŒïŒïŒ
ã§ç€ºãããååç©ãšåå¿ã第åçŽã¢ã³ã¢ããŠã å¡©
ãçæããæ§ãªçªçŽ ãå«æããåéäœã¯ãã¹ãŠå©
çšã§ããã
以äžã®åéäœãåç¬ãããã¯ïŒçš®ä»¥äžæ··åããŠ
䜿çšãããç¹ã«äžé£œåäºéçµåãå°ãªããšãïŒå
以äžæããåéäœãåç¬ã§çšããããããã¯å°ãª
ããšãïŒçš®ä»¥äžå«ãåéäœæ··åç©ãçšããããšã
æãŸããã該åéäœã®äœ¿çšéã¯ãæå
æ§æš¹èçµæ
ç©äžã®ããªã¢ããã«å¯ŸããïŒã150ééïŒ
ãç¹ã«
10ã100ééïŒ
ã§ããããšã奜ãŸããã該åéäœ
ãïŒééïŒ
æªæºã§ãããšãé²å
éšã®æº¶å€ã«å¯Ÿãã
äžæº¶åãå
åã§ãªããªãããŸã150ééïŒ
ãè¶ã
ããšãæå
æ§å±€ã®é²å
åŸãæ©æ¢°åŒ·åºŠãæãªãã
ãã
å
å¢æå€ã¯åèšããªã¢ããã®ãããªãã¯ã¹å
ã§
ã®åèšåéäœã®éååå¿ãä¿é²ãããããã«æ·»å
ããããã®ãããªå
å¢æå€ãšããŠã¯åŸæ¥å
¬ç¥ã®ã
ã®ã䜿çšããããšãã§ãããããšãã°ïŒïŒ10âã¢
ã³ãã©ããã³ãïŒâã¯ãã«ã¢ã³ãã©ããã³ãïŒâ
ã¯ãã«ã¢ã³ãã©ããã³ãªã©ã®ã¢ã³ãã©ããã³é¡ã
ãã³ãŸããšãã³ãïœâã¢ãããã³ãŸããšãã³ãïœ
âã¯ãã«ãã³ãŸããšãã³ãªã©ã®ãã³ãŸããšãã³
é¡ããã³ãŸã€ã³ããã³ãŸã€ã³ã¡ãã«ãšãŒãã«ãã
ã³ãŸã€ã³ãšãã«ãšãŒãã«ãαâã¡ãã«ãã³ãŸã€ã³
ãªã©ã®ãã³ãŸã€ã³é¡ããããã¯ãã³ãžã«é¡ãã
ããå
å¢æå€ã®äœ¿çšéã¯åèšããªã¢ãããäžè¬åŒ
ïŒïŒã§ç€ºãããååç©ããã³å
éåå¯èœãªäžé£œ
åçµåãæããåéäœãšã®ç·éã«å¯Ÿãã0.01ãïŒ
ééïŒ
ãç¹ã«0.1ãïŒééïŒ
ã§ããããšã奜ãŸã
ãã
ç±éåé²æ¢å€ã¯æå
æ§æš¹èçµæç©ã®èª¿åãæ
åãå å·¥æã®å ç±ã«ããå
éåå¯èœãªäžé£œååºã
æããåéäœã®ç±éåãããã¯è©²æå
æ§æš¹èçµæ
ç©ã®ä¿åäžã®æåå¿ãé²æ¢ããããã«æ·»å ããã
ãã®ãããªç±éåé²æ¢å€ãšããŠã¯åŸæ¥å
¬ç¥ã®ãã®
ãçšããããšãã§ãããããšãã°ãã€ãããã
ã³ãã¢ãâïœâããã«ãã€ããããã³ãªã©ã®ãã€
ããããã³é¡ããã³ãŸããã³ãïŒïŒïŒâãžâïœâ
ãã³ãŸããã³ãªã©ã®ãã³ãŸããã³é¡ãã«ãã³ãŒ
ã«ãïœâïœâããã«ã«ãã³ãŒã«ãªã©ã®ã«ãã³ãŒã«
é¡ããã¯ãªã³é
žé¡ãªã©ããããç±éåé²æ¢å€ã®äœ¿
çšéã¯åèšããªã¢ãããšãåŒïŒïŒã§ç€ºãããå
åç©ããã³å
éåå¯èœãªäžé£œåçµåãæããåé
äœãšã®ç·éã«å¯Ÿãã0.001ãïŒééïŒ
ãç¹ã«0.05
ã0.5ééïŒ
ã§ããããšã奜ãŸããã
以äžãäžè¬åŒïŒïŒã§ç€ºãããååç©ãå¡©åºæ§
çªçŽ ãæããããªã¢ãããå
éåå¯èœãªäžé£œåçµ
åãæããåéäœãå
å¢æå€ããã³ç±éåé²æ¢å€
ãå«æããæ¬çºæã®æå
æ§æš¹èçµæç©ã¯ãæ°Žãã¡
ã¿ããŒã«ããšã¿ããŒã«ãåå¡©åççŽ ããã«ãšã³ã
ããã¯ãã·ã¬ã³ãªã©ã®æº¶åªã«æº¶è§£ãããã®æº¶æ¶²ã
ã溶åªã®ã¿ãèžçºãããŠåäžã«æ··åããããšã«ã
ã€ãŠå®¹æã«åŸãããã
æ¬çºæã®æå
æ§æš¹èçµæç©ã¯éåžžã·ãŒãç¶ç©ãª
ã©ã«æ圢ããŠæå
æ§æš¹èåçãšããŠçšãããå³ã¡
äžè¿°ã®çµæãããªãæ··åç©ãç±ãã¬ã¹ã泚åãã
ãã¯æº¶èæŒåºããªã©ã®æ¹æ³ã«ããææã®åãã®
æ¿ããã€ã«ã ãŸãã¯ç®ãªã©ã®ã·ãŒãç¶ç©ãšããã
ãŸããã®ã·ãŒãç¶ç©ãæ¥çå€ãä»ããŠãããã¯
ä»ããã«æ¯æäœäžã«ç©å±€ãããæ¯æäœãšããŠã¯ã¹
ããŒã«ãã¢ã«ãããŠã ãã¬ã©ã¹ããã©ã¹ããã¯ã
ã€ã«ã ãªã©ä»»æã®ãã®ã䜿çšã§ããã
åŸãããæå
æ§æš¹èåçã¯æå
æ§å±€ã«éæç»å
éšãæãããã¬ãã€ã«ã ãŸãã¯ããžãã€ã«ã ãå¯
çããŠéãåãããã®äžæ¹ãã掻æ§å
ç·ãç
§å°ã
ããšãé²å
éšã®ã¿äžæº¶åãªãã³ã«ç¡¬åããããã®
ãããªæŽ»æ§å
ç·ãçºããå
æºãšããŠã¯å皮氎é
ç¯ãççŽ ã¢ãŒã¯ç¯ããã»ãã³ã©ã³ãã玫å€ç·ãè¢
å
ç¯ãªã©ã䜿çšã§ããã
å
ç
§å°åŸã¯é©åœãªæº¶å€ã«ããéé²å
éšåã溶解
é€å»ãããšãé®®æãªç»åéšãæããåžçãåŸãã
ããæ¬çºæã«ãããŠã¯ãåºæã«äžè¬åŒïŒïŒã§ç€º
ãããååç©ãšå¡©åºæ§çªçŽ ãæããããªã¢ãããš
ãåå¿ããŠã§ããã¢ã³ã¢ããŠã å¡©åçªçŽ ååãæ
ããããªã¢ããã䜿çšãããããåãªãæ°Žã«ãã€
ãŠå®¹æã«éãã«çŸåããããšãã§ããããã¡ãã
åçš®é
žæ°Žæº¶æ¶²ãæ°Žãšã¢ã«ã³ãŒã«ã®æ··å液ãäœçŽè
èªæã¢ã«ã³ãŒã«ãäœçŽçŽèªæã¢ã«ã³ãŒã«ãšå¡©åã«
ã«ã·ãŠã ãããã¯å¡©åäºéãªã©çµåæã®ããªã¢ã
ããå¯æº¶åãåŸã溶å€ã«ãã€ãŠãçŸåã§ããã
ãã®ããã«ããŠåŸãããæ¬çºæã®åžçã¯ãé²å
ããã³çŸåã«èŠããæéã極ããŠçãããåŸãã
ãç»åã¯éåžžã«ã·ã€ãŒããªèŒªå»ãæãããããã
該åžçã¯ãåŒïŒïŒã§ç€ºãããååç©ã®å¹æã«ã
ãéåžžã«æè»ã«ãªããäžè³ªçŽçç²é¢ãæããçŽäž
ã«ããããã«ã€ã³ãã転移ãã茪転å°å·æ©ã§é«é
å°å·ããŠãã€ã³ãã®ã«ã¹ã¬ããªããéåžžã«é®®æã§
ããã
以äžæ¬çºæãå®æœäŸã«ãã詳现ã«èª¬æããããª
ããå®æœäŸäžã«ãããŠåã«éšãšããã®ã¯ãããã
éééšã瀺ãã
åèäŸ ïŒ
ïŒïŒ®âãã¹ïŒÎ³âã¢ãããããã«ïŒããã©ãž
ã³ã¢ãžããŒã40éšãšÎµâã«ããã©ã¯ã¿ã 60éšãå
å¿å®¹åšã«å ããå
åãªçªçŽ 眮æãè¡ã€ãã®ã¡ãå¯
éããŠåŸã
ã«å ç±ãããå
å§ã10KgïŒm2ã«éãã
æç¹ããããã®å§åãä¿æã§ããªããªããŸã§æ°Žã
çåºãããçŽïŒæéã§åžžå§ã«ãã©ãããã®åŸ1.5
æéåžžå§ã§åå¿ããããåŸãããéåäœã¯æ¯ç²åºŠ
1.59ãè»åç¹110âã®ä¹³çœè²ããªã¢ããã§ããã
äžæ§æ°Žã«ã¯å®è³ªçã«äžæº¶ã§ãã€ãã
å®æœäŸ ïŒ
äžèšåŒïŒïŒã§ç€ºãããååç©34éšãåèäŸïŒ
ã§åŸãããããªã¢ãã100éšããšãã¬ã³ã°ãªã³ãŒ
ã«ãžã°ãªã·ãžã«ãšãŒãã«ãšã¢ã¯ãªã«é
žã®ïŒïŒïŒçž®
åç©30éšããã³ãŸããšãã³ïŒéšããã³ãã€ããã
ãã³0.2éšãã¡ã¿ããŒã«300éšã«å ãå ç±ããŠæº¶è§£
ããããã®æº¶æ¶²ãã¬ã©ã¹æ¿äžã«æµå»¶ããŠæžå§äžã«
æŸçœ®ããŠå®å
šã«ã¡ã¿ããŒã«ãé€å»ãããšåã0.6
mmã®éæãªãã€ã«ã ç¶ã®æå
æ§æš¹èçµæç©ãåŸã
ããããã®çµæç©ã¯åžžæž©ã®æ°Žã«å®¹æã«æº¶è§£ããã
åŸããããã€ã«ã ããåã0.25mmã®ããªãšã¹ã
ã«ãã€ã«ã äžã«è²ŒçããŠãæå
æ§åçãåŸãã
ãã®åçã®æå
æ§å±€ã«ã133ç·ã®ç¶²å解ããå
çåãã¬ãã€ã«ã ãå¯çãããŠã倧æ¥æ¬ã¹ã¯ãªãŒ
ã³è£œé²å
æ©ïŒ°â113âã§ïŒåéé²å
ãããé²å
åŸã倧æ¥æ¬ã¹ã¯ãªãŒã³è£œããªã³ã¿ã€ããŠãªãã·ã€
ãŒBRâA3ã§ïŒåéçŸåãã也ç¥åŸåŸé²å
ããã
åŸãããåžçã¯ååãå¿ å®ã«åçŸããŠããã次ã«
ãã®åžçãæµ®ç°å·¥æ¥è£œåžç茪転å°å·æ©BFâ201ã«
è£
çããŠå°å·ãè¡ã€ããšãããã·ã€ããŠéšã®ã«ã¹
ã¬ããªãããŸããã€ã©ã€ãéšã®å€ªãããªããéåžž
ã«è¯å¥œãªå°å·ç©ãåŸãããããŸãäžèšåžçã®20
âã65ïŒ
RHã§ã®ç¡¬åºŠã¯28ãïŒã·ãšã¢âïŒã§ããª
ãæè»ã§ãã€ãã
å®æœäŸ ïŒ
äžèšåŒ(2)ã§ç€ºãããååç©63éšãåèäŸïŒã§åŸ
ãããããªã¢ãã100éšããšãã¬ã³ã°ãªã³ãŒã«ãž
ã°ãªã·ãžã«ãšãŒãã«ãšã¢ã¯ãªã«é
žã®ïŒïŒïŒçž®åç©
30éšããã³ãŸããšãã³ïŒéšããã€ããããã³0.2
éšãã¡ã¿ããŒã«300éšã«å ãå ç±ããŠæº¶è§£ããã
ãã®æº¶æ¶²ããå®æœäŸïŒãšåæ§ãªæ¹æ³ã§æå
æ§åç
ãåŸãé²å
ãçŸåã也ç¥ãåŸé²å
ãè¡ã€ããåŸã
ããåžçã¯ååãåçŸããè¯å¥œãªå°å·ç©ãåŸãã
ãããŸã硬床ã¯30ãïŒã·ãšã¢âïŒã§ãã€ãã
å®æœäŸ ïŒ
äžèšåŒ(3)ã§ç€ºãããååç©29éšãåèäŸïŒã§åŸ
ãããããªã¢ãã100éšããšãã¬ã³ã°ãªã³ãŒã«ãž
ã°ãªã·ãžã«ãšãŒãã«ãšã¢ã¯ãªã«é
žïŒïŒïŒçž®åç©30
éšããã³ãŸããšãã³ïŒéšããã€ããããã³0.2éš
ãã¡ã¿ããŒã«300éšã«å ãå ç±ããŠæº¶è§£ãããã
ã®æº¶æ¶²ããå®æœäŸïŒãšåæ§ãªæ¹æ³ã§æå
æ§åçã
åŸãé²å
ãçŸåã也ç¥ãåŸé²å
ãè¡ã€ããåŸãã
ãåžçã¯ååãåçŸããŠããããã®ã¬ãªãŒããå®
æœäŸïŒãšåæ§ã«å°å·ãããšããéåžžã«è¯å¥œãªå°å·
ç©ãåŸãããããŸãåžçã®ç¡¬åºŠã¯33ãã§ãã€ãã
æ¯èŒäŸ ïŒ
ã¡ã¿ã¢ã¯ãªã«é
ž10éšãåèäŸïŒã§åŸãããããª
ã¢ãã100éšããšãã¬ã³ã°ãªã³ãŒã«ãžã°ãªã·ãžã«
ãšãŒãã«ãšã¢ã¯ãªã«é
žïŒïŒïŒçž®åç©30éšããã³ãŸ
ããšãã³ïŒéšããã€ããããã³0.2éšãã¡ã¿ããŒ
ã«300éšã«å ãå ç±ããŠæº¶è§£ããããã®æº¶æ¶²ãã
å®æœäŸïŒãšåæ§ãªæ¹æ³ã§æå
æ§åçãåŸãé²å
ã
çŸåã也ç¥ãåŸé²å
ãè¡ã€ããåŸãããåžçãçš
ããŠå®æœäŸïŒãšåæ§ã«ããŠå°å·ãè¡ã€ããšããã
ã·ã€ããŠéšã«ã«ã¹ã¬ãçããå°å·ç©ã¯è¯å¥œã§ãªã
ã€ãããŸãåžçã®ç¡¬åºŠã¯50ãïŒã·ãšã¢âïŒã§ãã
æè»æ§ã«æ¬ ããŠããã
å®æœäŸ ïŒ
äžèšåŒ(4)ã§ç€ºãããååç©21éšãåèäŸïŒã§åŸ
ãããããªã¢ãã100éšããšãã¬ã³ã°ãªã³ãŒã«ãž
ã°ãªã·ãžã«ãšãŒãã«ãšã¢ã¯ãªã«é
žïŒïŒïŒçž®åç©30
éšããã³ãŸããšãã³ïŒéšããã€ããããã³0.2éš
ãã¡ã¿ããŒã«300éšã«å ãå ç±ããŠæº¶è§£ãããã
ã®æº¶æ¶²ããå®æœäŸïŒãšåæ§ãªæ¹æ³ã§æå
æ§åçã
åŸãé²å
ãçŸåã也ç¥ãåŸé²å
ãè¡ã€ããåŸãã
ãåžçã¯ååãåçŸããŠããããã®ã¬ãªãŒããå®
æœäŸïŒãšåæ§ã«å°å·ãããšããéåžžã«è¯å¥œãªå°å·
ç©ãåŸãããããŸãåžçã®ç¡¬åºŠã¯33ãã§ãã€ãã
[Formula] is shown. Here, R 6 and R 7 are the aforementioned groups. Y represents a γ-aminopropyl group. ) Specific monomers represented by the above general formula () include N,N'-bis(aminomethyl)-piperazine, N,N'-bis(β-aminoethyl)-piperazine, N,N'- Bis(β-aminoethyl)
-Methylpiperazine, N-(aminomethyl)-
Nâ²-(β-aminoethyl)-piperazine, N,
Diamines such as N'-bis(γ-aminopropyl)-piperazine, N,N'-bis-(carboxymethyl)-piperazine, N,N'-bis(carboxymethyl)-methylpiperazine, N,N'- Bis(carboxymethyl)-2,6-dimethylpiperazine, N,N'-bis(β-carboxyethyl)
-Dicarboxylic acids such as piperazine, N,N'-bis(γ-carboxypropyl)-piperazine, N-(β-carboxyethyl)-N'-(carboxymethyl)-piperazine, or their lower alkyl esters and acid halides and N-
(aminomethyl)-N'-(carboxymethyl)-
Piperazine, N-(aminomethyl)-N'-(β
-carboxyethyl)-piperazine, N-(β-
aminoethyl)-Nâ²-(β-carboxyethyl)
-Piperazine, N-(aminomethyl)-N'-
(carboxymethyl)-2-methylpiperazine and other Ï-amino acids. Specific monomers represented by the above general formula () include N-(β-aminoethyl)piperazine,
N-(γ-aminopropyl)piperazine, N-
(Ï-aminohexyl)piperazine, N-(ÎŽ-
aminocyclohexyl)piperazine, N-(β-
aminoethyl)-3-methylpiperazine, N-
(β-aminoethyl)-2,5-dimethylpiperazine, N-(β-aminopropyl)-3-methylpiperazine, N-(γ-aminopropyl)-2,
Diamines such as 5-dimethylpiperazine, N-
Carboxymethylpiperazine, N-(β-carboxyethyl)-piperazine, N-(γ-carboxypropyl)piperazine, N-(Ï-carboxyhexyl)piperazine, N-(ÎŽ-carboxycyclohexyl)piperazine, N-(β- carboxyethyl)-3-methylpiperazine, N-(β-
These include Ï-amino acids such as (carboxyethyl)-2,5-dimethylpiperazine, or lower alkyl esters thereof. Specific monomers represented by the general formula () include N,N-di(β-aminoethyl)ethylamine, N,N-di(γ-aminopropyl)methylamine, and N,N-di( β-aminoethyl)-methylamine, N,N'-di(γ-aminopropyl)
-Ethylamine, N,N-di(γ-aminopropyl)isopropylamine, N,N-di(γ-aminopropyl)-cyclohexylamine, N,N-
di(ÎŽ-amino-n-butyl)phenylamine,
N-methyl-N-(β-aminoethyl)-1,3
-Diamines such as propanediamine, N,N-
Di(carboxymethyl)-methylamine, N,N
-di(β-carboxyethyl)methylamine,
N,N-di(β-carboxyethyl)-methylamine, N,N-di(β-carboxyethyl)-isopropylamine, N-carboxymethyl-N-
Dicarboxylic acids such as (β-carboxyethyl)-methylamine or their lower alkyl esters, acid halides, and N-(aminomethyl)-N-(carboxymethyl)-methylamine, N-(β-aminoethyl) -N-(β-carboxyethyl)-methylamine, N-(aminomethyl)-N-(β-carboxylethyl)-isopropylamine, N-(γ-aminopropyl)-
N-(γ-carboxypropyl)-isopropylamine, N-(γ-aminopropyl)-N-(β
-Carboxyethyl)-Ï of methylamine, etc.-
They are amino acids. A specific monomer represented by the general formula () is N,N'-dimethyl-N,N'-di-(γ
-aminopropyl)-ethylenediamine, N,
N'-dimethyl-N,N'-di-(γ-aminopropyl)-tetramethylenediamine, N,N'-diisobutyl-N,N'-di-(γ-aminopropyl)-hexamethylenediamine, N, N'-dicyclohexyl-N,N'-di-(γ-aminopropyl)-hexamethylenediamine, N,N'-di-(γ-aminopropyl)-2,2,4-trimethyl-hexamethylenediamine, etc. Diamines, N,N'-dimethyl-N,N'-di(carboxymethyl)-ethylenediamine, N,N'-dimethyl-N,N'-di-(β-carboxyethyl)
-ethylenediamine, N,N'-dimethyl-N,
Dicarboxylic acids such as N'-di-(γ-carboxypropyl)-hexamethylene diamine or their lower alkyl esters, acid halides, and N,N'-dimethyl-N-(aminomethyl)
-N'-(carboxymethyl)-ethylenediamine, N,N'-dimethyl-N-(βaminoethyl)
-N'-(β-carboxyethyl)-ethylenediamine, N,N'-dimethyl-N-(aminomethyl)-N'-(carboxyethyl)-hexamethylenediamine, and other Ï-amino acids. Specific monomers represented by the above general formula () include 6-methyl-6-(N,N'-dimethylaminomethyl)-4,8-dioxa-undecanediamine, 6-methyl-6-( N,N'-diethylaminomethyl)-4,8-dioxa-undecanediamine, 6-ethyl-6-(N,N-dimethylaminomethyl)-4,8-dioxa-undecanediamine, 6,6-bis(N , N-dimethylaminomethyl)-4,8-dioxane undecane diamine. Polyamide is formed by condensation polymerization using one or more of these monomers containing basic nitrogen. That is, monomers that can form polyamide by homopolymerization, such as Ï-amino acids or alkyl esters thereof, can be used alone. On the other hand, if the monomer is a dicarboxylic acid, its alkyl esters, acid halides, etc., it can be condensed with a diamine, and if the monomer is a diamine, it can be condensed with a dicarboxylic acid or a derivative thereof to form a polyamide. to form. Furthermore, as polymerization raw materials for polyamide used in the present invention, in addition to the monomers represented by the above general formulas () to (), aliphatic and/or aromatic dicarboxylic acids and diamines used in ordinary polyamide polymerization are used. , Ï-amino acids, lactams, etc. may be used in combination. Examples of dicarboxylic acids that can be used in combination include aliphatic and/or aromatic dicarboxylic acids such as succinic acid, adipic acid, glutaric acid, azelaic acid, sebacic acid, decanedicarboxylic acid, terephthalic acid, isophthalic acid, and cyclohexanedicarboxylic acid; Lower alkyl esters, acid halides, etc. of these acids are used.
Examples of diamines include linear saturated aliphatic diamines such as tetramethylene diamine, pentamethylene diamine, hexamethylene diamine, heptamethylene diamine, octamethylene diamine, nonamethylene diamine, and decamethylene diamine, metaxylylene diamine, and paraxylylene diamine. Aromatic diamines such as cyclohexane bismethylamine, aliphatic diamines such as cyclohexane bismethylamine, etc. are used. Ï
- As the amino acid, for example, aminocaproic acid, aminoheptanoic acid, aminocaprylic acid, aminocaproic acid, aminolauric acid, etc. are used.
Examples of the lactam used include ε-caprolactam, α-methyl-ε-caprolactam, ε-methyl-ε-caprolactam, cycloheptanone isoxime, and cyclooctanone isoxime. Polyamides having basic nitrogen atoms obtained from the above-mentioned monomers can be polymerized according to conventionally known methods for producing polyamides. The monomer component containing basic nitrogen accounts for 5 to 100 mol% of the total polyamide constituents, especially 20 to 50 mol%.
It is preferable that In addition to the basic nitrogen-containing monomers shown above, general formula ()
Any nitrogen-containing monomer that reacts with the compound represented by to form a quaternary ammonium salt can be used. The above monomers may be used alone or in combination of two or more. In particular, it is desirable to use a single monomer having at least two or more unsaturated double bonds or to use a monomer mixture containing at least one kind. The amount of the monomer used is 5 to 150% by weight, especially 5 to 150% by weight, based on the polyamide in the photosensitive resin composition.
It is preferably 10 to 100% by weight. If the monomer content is less than 5% by weight, the exposed area will not be sufficiently insolubilized in the solvent. Moreover, if it exceeds 150% by weight, the mechanical strength of the photosensitive layer will be impaired after exposure. A photosensitizer is added to accelerate the polymerization reaction of the monomers within the polyamide matrix. As such a photosensitizer, conventionally known ones can be used. For example, 9,10-anthraquinone, 1-chloranthraquinone, 2-
anthraquinones such as chloranthraquinone,
benzophenone, p-aminobenzophenone, p
- Benzophenones such as chlorbenzophenone, benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, α-methylbenzoin, and benzyls. The amount of the photosensitizer to be used is 0.01 to 5% relative to the total amount of the polyamide, the compound represented by the general formula (), and the monomer having a photopolymerizable unsaturated bond.
It is preferably 0.1 to 2% by weight, especially 0.1 to 2% by weight. Thermal polymerization inhibitors prevent thermal polymerization of monomers having photopolymerizable unsaturated groups due to heating during preparation, molding, and processing of photosensitive resin compositions, or dark reactions during storage of the photosensitive resin compositions. Add to.
As such a thermal polymerization inhibitor, conventionally known ones can be used. For example, hydroquinones such as hydroquinone, mono-t-butylhydroquinone, benzoquinone, 2,5-di-p-
Examples include benzoquinones such as benzoquinone, catechols such as catechol and pt-butylcatechol, and picric acids. The amount of thermal polymerization inhibitor used is 0.001 to 2% by weight, especially 0.05% by weight, based on the total amount of the polyamide, the compound represented by formula (), and the monomer having a photopolymerizable unsaturated bond.
~0.5% by weight is preferred. As described above, the photosensitive resin composition of the present invention contains a compound represented by the general formula (), a polyamide having basic nitrogen, a monomer having a photopolymerizable unsaturated bond, a photosensitizer, and a thermal polymerization inhibitor. The compound can be easily obtained by dissolving it in a solvent such as water, methanol, ethanol, carbon tetrachloride, toluene, or xylene, evaporating only the solvent from this solution, and mixing uniformly. The photosensitive resin composition of the present invention is usually formed into a sheet-like material and used as a photosensitive resin original plate. That is, a mixture having the above-mentioned composition is formed into a sheet-like product such as a plate, film, or foil having a desired thickness by a method such as hot pressing, casting, or melt extrusion. Further, this sheet-like material is laminated on a support with or without an adhesive. Any material such as steel, aluminum, glass, or plastic film can be used as the support. When the obtained photosensitive resin original plate is closely stacked with a negative film or a positive film having a transparent image area on the photosensitive layer and active light is irradiated from above, only the exposed area becomes insolubilized and hardened. As a light source that emits such actinic rays, various mercury lamps, carbon arc lamps, xenon lamps, ultraviolet rays, fluorescent lamps, etc. can be used. After irradiation with light, the non-exposed areas are dissolved and removed using a suitable solvent to obtain a relief plate with clear image areas. In the present invention, since an ammonium salt-type polyamide having a nitrogen atom, which is produced by the reaction of a compound represented by the general formula () with a polyamide having a basic nitrogen, is used as the base material, it can be easily and quickly treated with just water. It can be developed easily. Of course, development can also be carried out using various acid aqueous solutions, mixtures of water and alcohol, lower aliphatic alcohols, lower paper aliphatic alcohols, and solvents that can solubilize the polyamide binder, such as calcium chloride or zinc chloride. Since the relief plate of the present invention obtained in this way has extremely short exposure and development times, the resulting image has very sharp edges. Moreover, the letterpress is extremely flexible due to the effect of the compound represented by the formula (), and the ink is transferred neatly even to paper with a rough surface such as high-quality paper, and the ink does not smear even when printed at high speed with a rotary printing press. It is very clear. The present invention will be explained in detail below with reference to Examples. In addition, in the examples, all parts simply indicate parts by weight. Reference Example 1 40 parts of N,N-bis(γ-aminopropyl)piperazine adipate and 60 parts of ε-caprolactam were added to a reaction vessel, and after sufficient nitrogen purging, the vessel was sealed and gradually heated. From the time the internal pressure reached 10Kg/ m2 , water was distilled out until the pressure could no longer be maintained, and the pressure returned to normal pressure in about 1 hour.
The reaction was carried out at normal pressure for a period of time. The resulting polymer has a specific viscosity of
1.59, is a milky white polyamide with a softening point of 110â,
It was virtually insoluble in neutral water. Example 1 34 parts of a compound represented by the following formula (), Reference Example 1
100 parts of the polyamide obtained above, 30 parts of a 1:2 condensate of ethylene glycol diglycidyl ether and acrylic acid, 2 parts of benzophenone and 0.2 parts of hydroquinone were added to 300 parts of methanol and dissolved by heating. When this solution is cast onto a glass plate and left under reduced pressure to completely remove methanol, the thickness becomes 0.6 mm.
A transparent film-like photosensitive resin composition with a diameter of 1.0 mm was obtained. This composition was easily dissolved in water at room temperature. The obtained film was adhered onto a 0.25 mm thick polyester film to obtain a photosensitive original plate. A 133-line mesh-resolved photographic image negative film was brought into close contact with the photosensitive layer of this original plate, and exposed for 4 minutes using an exposure machine P-113-D manufactured by Dainippon Screen. After exposure, the film was developed for 2 minutes using Dainippon Screen's Printite Washer BR-A3, dried, and then post-exposed.
The resulting letterpress faithfully reproduced the original image. Next, when this letterpress was attached to a letterpress rotary printing machine BF-201 manufactured by Ukita Kogyo and printed, very good prints were obtained, with no fading in the shadow areas and no thickening in the highlight areas. . Also, 20 of the above letterpress
The hardness at 65% RH was 28° (Shore D) and it was quite flexible. Example 2 63 parts of the compound represented by the following formula (2), 100 parts of the polyamide obtained in Reference Example 1, 1:2 condensate of ethylene glycol diglycidyl ether and acrylic acid
30 parts, 2 parts of benzophenone, 0.2 parts of hydroquinone
1 part was added to 300 parts of methanol and heated to dissolve.
A photosensitive original plate was obtained from this solution in the same manner as in Example 1, and subjected to exposure, development, drying, and post-exposure. The obtained letterpress reproduced the original image, and a good printed matter was obtained. In addition, the hardness was 30° (Shore D). Example 3 29 parts of the compound represented by the following formula (3), 100 parts of the polyamide obtained in Reference Example 1, 30 parts of a 1:2 condensate of ethylene glycol diglycidyl ether and acrylic acid
1 part, 2 parts of benzophenone, and 0.2 parts of hydroquinone were added to 300 parts of methanol and dissolved by heating. A photosensitive original plate was obtained from this solution in the same manner as in Example 1, and subjected to exposure, development, drying, and post-exposure. The resulting letterpress reproduced the original image. When this relief was printed in the same manner as in Example 1, very good printed matter was obtained. The hardness of the letterpress was 33°. Comparative Example 1 10 parts of methacrylic acid, 100 parts of the polyamide obtained in Reference Example 1, 30 parts of a 1:2 condensate of ethylene glycol diglycidyl ether and acrylic acid, 2 parts of benzophenone, and 0.2 parts of hydroquinone were added to 300 parts of methanol and heated. and dissolved. A photosensitive original plate was obtained from this solution in the same manner as in Example 1, exposed to light,
Development, drying, and post-exposure were performed. When printing was performed using the obtained letterpress in the same manner as in Example 1,
Fading occurred in the shadow areas, and the printed matter was not good. Furthermore, the hardness of the letterpress was 50° (Shore D) and lacked flexibility. Example 4 21 parts of the compound represented by the following formula (4), 100 parts of the polyamide obtained in Reference Example 1, 30 parts of a 1:2 condensate of ethylene glycol diglycidyl ether and acrylic acid
1 part, 2 parts of benzophenone, and 0.2 parts of hydroquinone were added to 300 parts of methanol and dissolved by heating. A photosensitive original plate was obtained from this solution in the same manner as in Example 1, and subjected to exposure, development, drying, and post-exposure. The resulting letterpress reproduced the original image. When this relief was printed in the same manner as in Example 1, very good printed matter was obtained. The hardness of the letterpress was 33°.
Claims (1)
ãªäžé£œåçµåãæããåéäœããã³å éåéå§å€
ãããªãæå æ§æš¹èçµæç©ã«ãããŠãå éåå¯èœ
ãªäžé£œåçµåãæããåéäœã®å šéšãŸãã¯äžéšãš
ããŠäžèšäžè¬åŒ(1)ã§è¡šããããååç©ãå«æãã
ããšãç¹åŸŽãšããæå æ§æš¹èçµæç©ã åŒäžãã¯ççŽ ååæ°ïŒã24ã®äºäŸ¡ã®çåæ°ŽçŽ
åºãŸãã¯ååäžã«ãââãâCOOâãâ
NHCOâãæããççŽ ååæ°ïŒã24ã®äºäŸ¡ã®ç
åæ°ŽçŽ åºãã¯âSO3HããåŒã ãåŒãã瀺ããã¯ççŽ ååæ°ïŒã10ã®ã¢ã« ãã«åºãŸãã¯ããšãã«åºã瀺ãã[Scope of Claims] 1. In a photosensitive resin composition comprising a polyamide having basic nitrogen, a monomer having a photopolymerizable unsaturated bond, and a photopolymerization initiator, a monomer having a photopolymerizable unsaturated bond 1. A photosensitive resin composition comprising a compound represented by the following general formula (1) as all or part of the polymer. In the formula, X is a divalent hydrocarbon group having 1 to 24 carbon atoms or -O-, -COO-, -
A divalent hydrocarbon group having 1 to 24 carbon atoms and having NHCO-, Y is -SO 3 H, [Formula] [Formula], and R is an alkyl group or phenyl group having 1 to 10 carbon atoms. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7831681A JPS57192461A (en) | 1981-05-22 | 1981-05-22 | Photosensitive resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7831681A JPS57192461A (en) | 1981-05-22 | 1981-05-22 | Photosensitive resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57192461A JPS57192461A (en) | 1982-11-26 |
JPS6367176B2 true JPS6367176B2 (en) | 1988-12-23 |
Family
ID=13658526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7831681A Granted JPS57192461A (en) | 1981-05-22 | 1981-05-22 | Photosensitive resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57192461A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NZ215095A (en) * | 1985-02-12 | 1989-04-26 | Napp Systems Inc | Photosensitive resin compositions |
JPS6392618A (en) * | 1986-10-07 | 1988-04-23 | Sumitomo Chem Co Ltd | Photocurable composition containing phosphoric ester |
JP2639728B2 (en) * | 1989-04-27 | 1997-08-13 | å¯å£«åçãã€ã«ã æ ªåŒäŒç€Ÿ | Photosensitive lithographic printing plate |
JP4217341B2 (en) * | 1999-05-24 | 2009-01-28 | æ¥æ¬åè¬æ ªåŒäŒç€Ÿ | Aromatic polyamide resin composition |
JP2001253916A (en) * | 2000-03-10 | 2001-09-18 | Nippon Chem Ind Co Ltd | Fluoroalkyl group-containing phosphonic acid oligomers, method of producing the same and their use |
-
1981
- 1981-05-22 JP JP7831681A patent/JPS57192461A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57192461A (en) | 1982-11-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0085472B1 (en) | Photosensitive polymer composition | |
JP2891704B2 (en) | Water developable photosensitive resin composition, resin printing plate using the same, and method for producing resin printing plate | |
US4287290A (en) | Process for producing polymeric image by diffusion step | |
US4035189A (en) | Image forming curable resin compositions | |
US5175076A (en) | Water-developable photosensitive composition for producing relief plates | |
US3770435A (en) | Production of gravure printing plates based on plastics materials | |
US4145222A (en) | Water soluble photosensitive resin composition comprising a polyamide or its ammonium salt | |
EP0273113B1 (en) | Photosensitive polymer composition and master printing plate | |
JPS6367176B2 (en) | ||
US4188221A (en) | Photosensitive polyamide resin composition useful for making relief printing plate | |
JPS6365932B2 (en) | ||
JPS6367175B2 (en) | ||
JPS6367177B2 (en) | ||
JP2001272776A (en) | Photosensitive resin composition | |
CA1172086A (en) | Photopolymerizable recording material including a thermoplastic diisocyanate-modified nylon binder possessing quaternary nitrogen atoms and photopolymerizable double bonds in side branches | |
JP2745928B2 (en) | Photosensitive resin printing plate | |
JPS6412378B2 (en) | ||
JP3632513B2 (en) | Photosensitive resin composition | |
JPS6412377B2 (en) | ||
JPS6163837A (en) | Photosensitve resin composition | |
JP2001092132A (en) | Photosensitive resin composition | |
JP2000162770A (en) | Photosensitive resin composition | |
JPS5811933A (en) | Photosensitive resin composition | |
JPH0363739B2 (en) | ||
JPS5950051B2 (en) | Photosensitive polyamide resin composition |