JPS6365653A - セラミックス配線基板の製造方法 - Google Patents
セラミックス配線基板の製造方法Info
- Publication number
- JPS6365653A JPS6365653A JP61208942A JP20894286A JPS6365653A JP S6365653 A JPS6365653 A JP S6365653A JP 61208942 A JP61208942 A JP 61208942A JP 20894286 A JP20894286 A JP 20894286A JP S6365653 A JPS6365653 A JP S6365653A
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- copper
- temperature
- metallized
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61208942A JPS6365653A (ja) | 1986-09-05 | 1986-09-05 | セラミックス配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61208942A JPS6365653A (ja) | 1986-09-05 | 1986-09-05 | セラミックス配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6365653A true JPS6365653A (ja) | 1988-03-24 |
| JPH058866B2 JPH058866B2 (enExample) | 1993-02-03 |
Family
ID=16564687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61208942A Granted JPS6365653A (ja) | 1986-09-05 | 1986-09-05 | セラミックス配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6365653A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1349206A2 (en) | 2002-03-29 | 2003-10-01 | Dowa Mining Co., Ltd. | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| JP2011199209A (ja) * | 2010-03-24 | 2011-10-06 | Dowa Metaltech Kk | 金属−セラミックス接合回路基板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60150653A (ja) * | 1984-01-18 | 1985-08-08 | Toshiba Corp | 半導体装置 |
| JPS60156791A (ja) * | 1984-01-25 | 1985-08-16 | Mitsui Eng & Shipbuild Co Ltd | 石炭の水添液化方法 |
-
1986
- 1986-09-05 JP JP61208942A patent/JPS6365653A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60150653A (ja) * | 1984-01-18 | 1985-08-08 | Toshiba Corp | 半導体装置 |
| JPS60156791A (ja) * | 1984-01-25 | 1985-08-16 | Mitsui Eng & Shipbuild Co Ltd | 石炭の水添液化方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1349206A2 (en) | 2002-03-29 | 2003-10-01 | Dowa Mining Co., Ltd. | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| US7387741B2 (en) | 2002-03-29 | 2008-06-17 | Dowa Mining Co., Ltd. | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| EP1349206B1 (en) * | 2002-03-29 | 2019-10-09 | Dowa Metaltech Co., Ltd. | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| JP2011199209A (ja) * | 2010-03-24 | 2011-10-06 | Dowa Metaltech Kk | 金属−セラミックス接合回路基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058866B2 (enExample) | 1993-02-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |