JPS6364033U - - Google Patents
Info
- Publication number
- JPS6364033U JPS6364033U JP1986158384U JP15838486U JPS6364033U JP S6364033 U JPS6364033 U JP S6364033U JP 1986158384 U JP1986158384 U JP 1986158384U JP 15838486 U JP15838486 U JP 15838486U JP S6364033 U JPS6364033 U JP S6364033U
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- semiconductor device
- metal conductor
- conductor base
- matching substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986158384U JPS6364033U (enExample) | 1986-10-16 | 1986-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986158384U JPS6364033U (enExample) | 1986-10-16 | 1986-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6364033U true JPS6364033U (enExample) | 1988-04-27 |
Family
ID=31081822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986158384U Pending JPS6364033U (enExample) | 1986-10-16 | 1986-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364033U (enExample) |
-
1986
- 1986-10-16 JP JP1986158384U patent/JPS6364033U/ja active Pending
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