JPS6361133U - - Google Patents
Info
- Publication number
- JPS6361133U JPS6361133U JP1986155890U JP15589086U JPS6361133U JP S6361133 U JPS6361133 U JP S6361133U JP 1986155890 U JP1986155890 U JP 1986155890U JP 15589086 U JP15589086 U JP 15589086U JP S6361133 U JPS6361133 U JP S6361133U
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- circumferential surface
- head
- transfer pot
- plunger body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
- B29C45/586—Injection or transfer plungers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
図は本考案に係る半導体装置の樹脂封止装置を
示す断面図である。 １……トランスフアポツト、２……型板、３…
…プランジヤー、４……プランジヤー本体、４ａ
……ヘツド取付孔、５……プランジヤーヘツド、
７，８……シールリング。
示す断面図である。 １……トランスフアポツト、２……型板、３…
…プランジヤー、４……プランジヤー本体、４ａ
……ヘツド取付孔、５……プランジヤーヘツド、
７，８……シールリング。
Claims (1)
- 型板の内部に取り付けられその内部を型締め状
態において真空排気可能なトランスフアポツトと
、このトランスフアポツト内に進退自在に設けら
れヘツド取付孔を有するプランジヤー本体および
このプランジヤー本体のヘツド取付孔内に着脱自
在に取り付けられたプランジヤーヘツドからなる
タブレツト加圧用のプランジヤーとを備え、プラ
ンジヤーヘツドの外周面とヘツド取付孔の内周面
間およびプランジヤー本体の外周面とトランスフ
アポツトの内周面間にシールリングを介装したこ
とを特徴とする半導体装置の樹脂封止装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986155890U JPS6361133U (ja) | 1986-10-09 | 1986-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986155890U JPS6361133U (ja) | 1986-10-09 | 1986-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6361133U true JPS6361133U (ja) | 1988-04-22 |
Family
ID=31077001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986155890U Pending JPS6361133U (ja) | 1986-10-09 | 1986-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6361133U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009279844A (ja) * | 2008-05-22 | 2009-12-03 | Apic Yamada Corp | プランジャとこれを用いた樹脂モールド方法 |
| WO2018169388A1 (en) * | 2017-03-16 | 2018-09-20 | Besi Netherlands B.V. | Plunger for feeding encapsulating material to a mould cavity |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6323131U (ja) * | 1986-07-31 | 1988-02-16 |
-
1986
- 1986-10-09 JP JP1986155890U patent/JPS6361133U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6323131U (ja) * | 1986-07-31 | 1988-02-16 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009279844A (ja) * | 2008-05-22 | 2009-12-03 | Apic Yamada Corp | プランジャとこれを用いた樹脂モールド方法 |
| WO2018169388A1 (en) * | 2017-03-16 | 2018-09-20 | Besi Netherlands B.V. | Plunger for feeding encapsulating material to a mould cavity |
| NL2018533B1 (en) * | 2017-03-16 | 2018-09-24 | Besi Netherlands Bv | Plunger for feeding encapsulating material to a mould cavity |
| JP2020512212A (ja) * | 2017-03-16 | 2020-04-23 | ベシ ネーデルランズ ビー．ヴイ．Ｂｅｓｉ Ｎｅｔｈｅｒｌａｎｄｓ Ｂ．Ｖ． | 金型キャビティに封止材料を供給するプランジャ |