JPS6360313B2 - - Google Patents
Info
- Publication number
- JPS6360313B2 JPS6360313B2 JP5761280A JP5761280A JPS6360313B2 JP S6360313 B2 JPS6360313 B2 JP S6360313B2 JP 5761280 A JP5761280 A JP 5761280A JP 5761280 A JP5761280 A JP 5761280A JP S6360313 B2 JPS6360313 B2 JP S6360313B2
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- particles
- heat
- transfer surface
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002245 particle Substances 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 238000009835 boiling Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000007747 plating Methods 0.000 abstract description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000002826 coolant Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007767 bonding agent Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Dispersion Chemistry (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5761280A JPS56155397A (en) | 1980-04-29 | 1980-04-29 | Heat conductive surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5761280A JPS56155397A (en) | 1980-04-29 | 1980-04-29 | Heat conductive surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56155397A JPS56155397A (en) | 1981-12-01 |
| JPS6360313B2 true JPS6360313B2 (enExample) | 1988-11-24 |
Family
ID=13060680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5761280A Granted JPS56155397A (en) | 1980-04-29 | 1980-04-29 | Heat conductive surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56155397A (enExample) |
-
1980
- 1980-04-29 JP JP5761280A patent/JPS56155397A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56155397A (en) | 1981-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7603775B2 (en) | Heat spreader with vapor chamber and method of manufacturing the same | |
| JP2569003B2 (ja) | 熱伝導装置 | |
| CN112151481B (zh) | 一种表面强化沸腾散热结构 | |
| US4748491A (en) | Redundant circuit of semiconductor device and method of producing same | |
| KR20070085553A (ko) | 열전도도가 개선된 내화금속 기판 | |
| US4291758A (en) | Preparation of boiling heat transfer surface | |
| JP4565249B2 (ja) | 金属−セラミックス接合基板およびその製造方法 | |
| US20240244797A1 (en) | Two-phase immersion-type composite heat dissipation device | |
| JPS6360313B2 (enExample) | ||
| JPH02114597A (ja) | 電子素子の冷却方法 | |
| US5089443A (en) | Method of making a semiconductor heat sink | |
| US7820488B2 (en) | Microelectronic devices and methods | |
| JPH03182081A (ja) | 電気的接続部材の製造方法 | |
| US20230284417A1 (en) | Immersion-type liquid cooling heat dissipation sink | |
| TWI807635B (zh) | 浸沒式液冷散熱結構 | |
| TWM629670U (zh) | 兩相浸沒式散熱鰭片複合結構 | |
| TWI790835B (zh) | 浸沒式散熱結構及其製造方法 | |
| TWI795012B (zh) | 具有厚導電層之基材結構之蝕刻成形方法、以及具有厚導電層之基材結構 | |
| JPH073844B2 (ja) | 熱伝達装置 | |
| TWI823668B (zh) | 兩相浸沒式複合型散熱裝置 | |
| TWM631672U (zh) | 具微孔結構之浸沒式散熱基材 | |
| JPS5875860A (ja) | 冷媒封入型半導体装置 | |
| US2804580A (en) | Unidirectionally conducting elements | |
| JP2005026476A (ja) | 配線基板および配線基板の製造方法 | |
| JPS634645A (ja) | 導体膜の選択形成方法 |