JPS6360312U - - Google Patents
Info
- Publication number
- JPS6360312U JPS6360312U JP15225186U JP15225186U JPS6360312U JP S6360312 U JPS6360312 U JP S6360312U JP 15225186 U JP15225186 U JP 15225186U JP 15225186 U JP15225186 U JP 15225186U JP S6360312 U JPS6360312 U JP S6360312U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- width
- upper mold
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15225186U JPS6360312U (en:Method) | 1986-10-02 | 1986-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15225186U JPS6360312U (en:Method) | 1986-10-02 | 1986-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6360312U true JPS6360312U (en:Method) | 1988-04-21 |
Family
ID=31070060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15225186U Pending JPS6360312U (en:Method) | 1986-10-02 | 1986-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6360312U (en:Method) |
-
1986
- 1986-10-02 JP JP15225186U patent/JPS6360312U/ja active Pending
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