JPS6356948A - リ−ドフレ−ム - Google Patents
リ−ドフレ−ムInfo
- Publication number
- JPS6356948A JPS6356948A JP20244286A JP20244286A JPS6356948A JP S6356948 A JPS6356948 A JP S6356948A JP 20244286 A JP20244286 A JP 20244286A JP 20244286 A JP20244286 A JP 20244286A JP S6356948 A JPS6356948 A JP S6356948A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- tape
- leads
- piece
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 7
- 230000001105 regulatory effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20244286A JPS6356948A (ja) | 1986-08-27 | 1986-08-27 | リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20244286A JPS6356948A (ja) | 1986-08-27 | 1986-08-27 | リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6356948A true JPS6356948A (ja) | 1988-03-11 |
| JPH0579174B2 JPH0579174B2 (enrdf_load_stackoverflow) | 1993-11-01 |
Family
ID=16457591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20244286A Granted JPS6356948A (ja) | 1986-08-27 | 1986-08-27 | リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6356948A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5021864A (en) * | 1989-09-05 | 1991-06-04 | Micron Technology, Inc. | Die-mounting paddle for mechanical stress reduction in plastic IC packages |
| EP0747942A3 (en) * | 1995-05-02 | 1998-07-29 | Texas Instruments Incorporated | Improvements in or relating to integrated circuits |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6236547U (enrdf_load_stackoverflow) * | 1985-08-20 | 1987-03-04 |
-
1986
- 1986-08-27 JP JP20244286A patent/JPS6356948A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6236547U (enrdf_load_stackoverflow) * | 1985-08-20 | 1987-03-04 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5021864A (en) * | 1989-09-05 | 1991-06-04 | Micron Technology, Inc. | Die-mounting paddle for mechanical stress reduction in plastic IC packages |
| EP0747942A3 (en) * | 1995-05-02 | 1998-07-29 | Texas Instruments Incorporated | Improvements in or relating to integrated circuits |
| US5891377A (en) * | 1995-05-02 | 1999-04-06 | Texas Instruments Incorporated | Dambarless leadframe for molded component encapsulation |
| US5949132A (en) * | 1995-05-02 | 1999-09-07 | Texas Instruments Incorporated | Dambarless leadframe for molded component encapsulation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0579174B2 (enrdf_load_stackoverflow) | 1993-11-01 |
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