JPS6355539U - - Google Patents
Info
- Publication number
- JPS6355539U JPS6355539U JP15002186U JP15002186U JPS6355539U JP S6355539 U JPS6355539 U JP S6355539U JP 15002186 U JP15002186 U JP 15002186U JP 15002186 U JP15002186 U JP 15002186U JP S6355539 U JPS6355539 U JP S6355539U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- semiconductor device
- wiring
- lead frame
- die pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15002186U JPS6355539U (enExample) | 1986-09-30 | 1986-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15002186U JPS6355539U (enExample) | 1986-09-30 | 1986-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355539U true JPS6355539U (enExample) | 1988-04-14 |
Family
ID=31065772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15002186U Pending JPS6355539U (enExample) | 1986-09-30 | 1986-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355539U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6077436A (ja) * | 1983-10-04 | 1985-05-02 | Nec Corp | 半導体集積回路 |
-
1986
- 1986-09-30 JP JP15002186U patent/JPS6355539U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6077436A (ja) * | 1983-10-04 | 1985-05-02 | Nec Corp | 半導体集積回路 |