JPS6355446U - - Google Patents

Info

Publication number
JPS6355446U
JPS6355446U JP14760386U JP14760386U JPS6355446U JP S6355446 U JPS6355446 U JP S6355446U JP 14760386 U JP14760386 U JP 14760386U JP 14760386 U JP14760386 U JP 14760386U JP S6355446 U JPS6355446 U JP S6355446U
Authority
JP
Japan
Prior art keywords
tip portion
circuit board
tip
main surface
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14760386U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14760386U priority Critical patent/JPS6355446U/ja
Publication of JPS6355446U publication Critical patent/JPS6355446U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP14760386U 1986-09-26 1986-09-26 Pending JPS6355446U (US20090163788A1-20090625-C00002.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14760386U JPS6355446U (US20090163788A1-20090625-C00002.png) 1986-09-26 1986-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14760386U JPS6355446U (US20090163788A1-20090625-C00002.png) 1986-09-26 1986-09-26

Publications (1)

Publication Number Publication Date
JPS6355446U true JPS6355446U (US20090163788A1-20090625-C00002.png) 1988-04-13

Family

ID=31061114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14760386U Pending JPS6355446U (US20090163788A1-20090625-C00002.png) 1986-09-26 1986-09-26

Country Status (1)

Country Link
JP (1) JPS6355446U (US20090163788A1-20090625-C00002.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02265266A (ja) * 1989-04-05 1990-10-30 Hitachi Ltd 半導体デバイスおよびメモリモジュールデバイス
JPH06275766A (ja) * 1993-03-17 1994-09-30 Internatl Business Mach Corp <Ibm> 半導体装置の電気的接続構造及び方法
KR20030025166A (ko) * 2001-09-19 2003-03-28 미쓰비시덴키 가부시키가이샤 표면실장용 커넥터 및 이것을 사용한 반도체 모듈
JP2016025298A (ja) * 2014-07-24 2016-02-08 セイコーエプソン株式会社 電子部品、電子部品の製造方法、電子機器、および移動体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219946A (ja) * 1983-05-30 1984-12-11 Hitachi Ltd フラツトパツク部品の半田流れ防止方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219946A (ja) * 1983-05-30 1984-12-11 Hitachi Ltd フラツトパツク部品の半田流れ防止方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02265266A (ja) * 1989-04-05 1990-10-30 Hitachi Ltd 半導体デバイスおよびメモリモジュールデバイス
JPH06275766A (ja) * 1993-03-17 1994-09-30 Internatl Business Mach Corp <Ibm> 半導体装置の電気的接続構造及び方法
KR20030025166A (ko) * 2001-09-19 2003-03-28 미쓰비시덴키 가부시키가이샤 표면실장용 커넥터 및 이것을 사용한 반도체 모듈
JP2016025298A (ja) * 2014-07-24 2016-02-08 セイコーエプソン株式会社 電子部品、電子部品の製造方法、電子機器、および移動体

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