JPS6355130B2 - - Google Patents
Info
- Publication number
- JPS6355130B2 JPS6355130B2 JP3180780A JP3180780A JPS6355130B2 JP S6355130 B2 JPS6355130 B2 JP S6355130B2 JP 3180780 A JP3180780 A JP 3180780A JP 3180780 A JP3180780 A JP 3180780A JP S6355130 B2 JPS6355130 B2 JP S6355130B2
- Authority
- JP
- Japan
- Prior art keywords
- gap
- blocks
- block
- magnetic head
- head core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 21
- 238000005219 brazing Methods 0.000 claims description 18
- 238000007740 vapor deposition Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 238000004544 sputter deposition Methods 0.000 claims description 11
- 125000006850 spacer group Chemical group 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000001771 vacuum deposition Methods 0.000 claims 1
- 229910000702 sendust Inorganic materials 0.000 description 15
- 239000011888 foil Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000011162 core material Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/187—Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features
- G11B5/23—Gap features
- G11B5/232—Manufacture of gap
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】
本発明は、合金磁性体特にセンダストに代表さ
れるFe−Al−Si系合金磁性体を用いた磁気ヘツ
ドコアの製造方法に関し、高精度、高品質のギヤ
ツプを容易に実現することのできる製造方法を提
供するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a magnetic head core using an alloy magnetic material, particularly a Fe-Al-Si alloy magnetic material represented by Sendust, and easily realizes a high-precision, high-quality gap. The present invention provides a manufacturing method that can perform the following steps.
センダストをコア材とした磁気ヘツドの製造方
法としては、日本放送協会総合技術研究所の阿部
氏らによつて開発された銀ろう箔を用いたビデオ
ヘツドのギヤツプ形成技術が知られているが、本
発明はその改良に関するものである。 As a method for manufacturing magnetic heads using sendust as the core material, a video head gap forming technique using silver solder foil developed by Mr. Abe et al. of the Japan Broadcasting Corporation Research Institute is known. The present invention relates to improvements thereon.
まず、センダストビデオヘツドの製造方法を例
に説明する。 First, a method for manufacturing a Sendust video head will be explained as an example.
まず、センダスト素材から、第１図に示すよう
な直方体のブロツク１，１′を切り出す。次に、
ブロツク１，１′に、巻線用の溝２を研削加工で
形成し、第２図に示す形状とする。この例ではブ
ロツク１，１′の両方に溝２を設けているが、い
ずれか一方にのみ溝を設けてもよい。溝２を設け
た面を鏡面に研摩してギヤツプ突合せ面とする。
ギヤツプ突合せ面は、溝２を境として記録再生用
ギヤツプを構成する前部ギヤツプ突合せ面３と後
部の磁気回路を接続する後部ギヤツプ突合せ面４
とに分けられる。 First, rectangular parallelepiped blocks 1 and 1' as shown in FIG. 1 are cut out of sendust material. next,
Grooves 2 for winding are formed in the blocks 1 and 1' by grinding, giving them the shape shown in FIG. In this example, the grooves 2 are provided in both blocks 1 and 1', but the grooves may be provided in only one of them. The surface provided with the grooves 2 is polished to a mirror surface to form a gap abutting surface.
The gap abutting surfaces include a front gap abutting surface 3 forming a recording/reproducing gap with the groove 2 as a boundary and a rear gap abutting surface 4 connecting the rear magnetic circuit.
It can be divided into
次に、前部ギヤツプ突合せ面３に、ギヤツプ長
とほぼ等しい厚さを有する非磁性スペーサ５を配
するが、スパツタリング蒸着等の手段で高融点ガ
ラス、SiO2等を付着させる方法を用いるのがよ
い。その場合にはブロツク１，１′の両方にギヤ
ツプ長の２分の１づつの厚みを付着させると、鋭
いギヤツプエツジを得ることができる。蒸着時に
は後部ギヤツプ突合せ面４はマスク等で遮蔽する
か、あるいはフオトレジスト等で保護し、蒸着後
にフオトレジストを除去してセンダストの清浄な
面を維持しておく。 Next, a non-magnetic spacer 5 having a thickness approximately equal to the gap length is arranged on the front gap abutting surface 3. However, it is preferable to use a method of attaching high melting point glass, SiO 2 , etc. by means such as sputtering vapor deposition. good. In that case, a sharp gap edge can be obtained by attaching a thickness equal to one half of the gap length to both blocks 1 and 1'. During vapor deposition, the abutting surface 4 of the rear gap is covered with a mask or the like or protected with photoresist or the like, and the photoresist is removed after vapor deposition to maintain a clean surface of the sendust.
次にブロツク１，１′を、第４図に示すように、
後部ギヤツプ突合せ面にろう箔６をはさんで組み
合わせる。ろう箔はなるべくギヤツプ長に近い薄
いものが望ましいが、取り扱いの点では3μｍ程
度が限界である。またセンダストのろう接につい
ては銀ろう箔を用いると強固な接着強度が得られ
る。 Next, blocks 1 and 1' are as shown in FIG.
Place the wax foil 6 on the mating surfaces of the rear gears and assemble. It is desirable that the wax foil be as thin as possible, as close to the gap length as possible, but in terms of handling, the limit is about 3 μm. In addition, when soldering Sendust, use of silver soldering foil provides strong adhesive strength.
従来のろう接法について、第５図を用いて説明
する。銀ろう箔６をはさんで組み合わされたブロ
ツク１，１′は、平行に対向する押え面を有する
押え棒７，７′に押圧され、真空容器９の中にお
さめられる。真空容器９の中には同時にタンタル
等のヒータ８がおさめられ、組み合わされたブロ
ツクを加熱する。この方法においては、フラツク
スを用いずにろう接するため、ろう接面（すなわ
ち後部ギヤツプ突合せ面）の酸化を防ぐ必要か
ら、10-4Torr以上の高真空にしておかなければ
ならない。また、銀ろう接の作業温度は800℃以
上となるため、ほとんどの金属はバネ性を失なう
ため、押圧力はヒータ８による加熱の影響のない
外部より印加しなければならない。なお、１０は
ヒータの電源である。800℃以上の加熱を急激に
行うと真空容器９の内部の温度勾配が大きくな
り、押え棒７の押え面の平行度が狂つてくるた
め、温度上昇はゆるやかにしなければならない。 The conventional brazing method will be explained using FIG. 5. The blocks 1 and 1' combined with the silver soldering foil 6 sandwiched therebetween are pressed by presser bars 7 and 7' having parallel opposing presser surfaces and placed in a vacuum container 9. A heater 8 made of tantalum or the like is also placed in the vacuum container 9 to heat the assembled blocks. In this method, since soldering is performed without using flux, a high vacuum of 10 -4 Torr or higher must be maintained in order to prevent oxidation of the soldering surface (that is, the abutting surface of the rear gap). Further, since the working temperature of silver soldering is 800° C. or higher, most metals lose their springiness, so the pressing force must be applied from outside without the influence of heating by the heater 8. Note that 10 is a power source for the heater. If heating to 800° C. or more is carried out rapidly, the temperature gradient inside the vacuum container 9 will become large, and the parallelism of the pressing surface of the presser bar 7 will be disturbed, so the temperature must be increased gradually.
すなわち、従来法では、真空容器に収容し、加
熱してろう接し、冷却させてブロツクを取り出す
のに極めて長い時間を要し、また、同時に多数の
ブロツクをろう接することも困難であつた。これ
はセンダストビデオヘツドの量産をさまたげる主
要因となつている。 That is, in the conventional method, it takes an extremely long time to house blocks in a vacuum container, heat and solder them, cool them, and take them out, and it is also difficult to solder a large number of blocks at the same time. This is the main factor hindering the mass production of Sendust video heads.
本発明は、上述の問題点を解決したものであ
り、第６図を用いて、その一実施について説明す
る。 The present invention solves the above-mentioned problems, and one implementation thereof will be explained using FIG. 6.
銀ろう箔６および非磁性スペーサ５をはさんで
組み合わされたブロツク１，１′はホルダ１５の
中に収められ、押え板１６、バネ１７を介して押
えネジ１８で押圧されている。ホルダ１５は移動
可能なテーブル１４の上に置かれている。レーザ
発振器１１から出たレーザビームは、反射鏡１２
でブロツク１，１′側へ反射され、集光ンズ１３
で絞られて、ブロツク１，１′の突合せ面に照射
される。レーザ発振器１１としてはYAGレーザ、
CO2レーザ等の汎用のものが使用できる。レーザ
ビームはなるべく細く絞り、焦点をブロツク１，
１′の表面よりも内部の後部ギヤツプ突合せ面に
設定することにより、銀ろう箔６およびその近辺
の後部ギヤツプ突合せ面は急速に加熱される。レ
ーザビームによる加熱は局所的なものであり、レ
ーザ光の照射を停止すると、加熱部の熱はすみや
かに伝熱され、急速に冷却される。すなわち、レ
ーザ光の照射される部分とそのごく近傍のみが極
めて短時間に高い温度に加熱され、その他の部分
は室温程度に保たれる。したがつて、雰囲気を高
度の真空に保たなくても、ろう接面が酸化するこ
とはない。 The blocks 1 and 1' combined with the silver soldering foil 6 and the non-magnetic spacer 5 in between are housed in a holder 15 and are pressed by a holding screw 18 via a holding plate 16 and a spring 17. The holder 15 is placed on a movable table 14. The laser beam emitted from the laser oscillator 11 passes through the reflecting mirror 12.
The light is reflected toward the blocks 1 and 1', and the condensing lens 13
The beam is narrowed down and irradiated onto the abutting surfaces of blocks 1 and 1'. As the laser oscillator 11, a YAG laser,
A general-purpose device such as a CO 2 laser can be used. Aperture the laser beam as narrowly as possible and set the focus to block 1.
By setting the abutting surface of the rear gap inside the surface of 1', the silver solder foil 6 and the abutting surface of the rear gap in the vicinity thereof are rapidly heated. The heating by the laser beam is local, and when the laser beam irradiation is stopped, the heat in the heated part is quickly transferred and cooled rapidly. That is, only the portion irradiated with the laser beam and its immediate vicinity are heated to a high temperature in an extremely short period of time, and the other portions are kept at about room temperature. Therefore, even if the atmosphere is not kept in a high vacuum, the soldered surfaces will not oxidize.
レーザビームのパワーを選ぶことにより、レー
ザビームの照射部は、ろう材の溶融温度以上で、
センダストの溶融温度より低い温度に加熱され
る。そして、テーブル１４を移動させることによ
つて、レーザビームをブロツク１，１′の突合せ
部にそつて走査させると、ブロツク１，１′は強
固にろう接される。 By selecting the power of the laser beam, the irradiated area of the laser beam can be heated to a temperature higher than the melting temperature of the brazing material.
It is heated to a temperature below the melting temperature of sendust. Then, by moving the table 14, the laser beam is scanned along the abutting portion of the blocks 1 and 1', and the blocks 1 and 1' are firmly soldered together.
なお、レーザビーム照射面の酸化による変色を
防ぐために、アルゴン、窒素等の不活性ガスをレ
ーザビーム照射部に吹きつけてもよい。 Note that in order to prevent discoloration due to oxidation of the laser beam irradiated surface, an inert gas such as argon or nitrogen may be blown onto the laser beam irradiated part.
ブロツク１，１′はろう接されて、第７図に示
す全体ブロツク１９が得られる。ろう接部は破線
で示している。 The blocks 1, 1' are soldered together to obtain the overall block 19 shown in FIG. The soldered joints are indicated by dashed lines.
センダストは磁歪定数がほぼゼロの材料であ
り、ろう接で生じた内部の残留応力はビデオヘツ
ドの特性にはほとんど影響しないが、合体ブロツ
ク１９をろう材の溶融温度より低い温度で熱処理
して焼鈍することが望ましい。 Sendust is a material with a magnetostriction constant of almost zero, and the internal residual stress generated during soldering has little effect on the characteristics of the video head. It is desirable to do so.
合体ブロツク１９は切断砥石で切断され、第８
図に示すようなビデオヘツドコア２０に仕上げら
れる。 The combined block 19 is cut with a cutting wheel and the eighth
The finished product is a video head core 20 as shown in the figure.
以上の説明ではろう材として銀ろう箔６を用い
たが、次に他の実施例について説明する。 In the above explanation, silver brazing foil 6 was used as the brazing material, but next, other embodiments will be explained.
前述のように銀ろう箔の厚みは、取り扱い上の
問題で3μｍより薄くすることは困難であり、近
年の記録密度の向上に伴なう狭ギヤツプ化には対
応することがきわめて困難になつている。すなわ
ち、一例としてギヤツプ長0.3μｍの場合を考える
と、後部ギヤツプ突合せ面に0.3μｍの箔をはさん
でいたのでは、前部ギヤツプ突合せ面が0.3μｍの
平行な対向面を構成するのが困難なことは容易に
理解される。 As mentioned above, it is difficult to reduce the thickness of silver solder foil to less than 3 μm due to handling issues, and it has become extremely difficult to accommodate the narrower gaps that have accompanied the recent increase in recording density. There is. In other words, if we consider the case where the gap length is 0.3 μm as an example, if we sandwich a 0.3 μm foil on the rear gap abutting surface, it would be difficult to construct a parallel opposing surface of 0.3 μm on the front gap abutting surface. That is easily understood.
そこで、この実施例では、ろう材をスパツタリ
ング蒸着で後部ギヤツプ突合せ面に付着させる。 Therefore, in this embodiment, a brazing material is attached to the abutting surface of the rear gap by sputtering vapor deposition.
蒸着時には、前部ギヤツプ突合せ面（非磁性ス
ペーサが既に蒸着されていてもよい）はマスクで
遮蔽するか、フオトレジストで保護しておいて、
後にフオトレジストを除去する。 During deposition, the front gap abutment surface (on which a non-magnetic spacer may already be deposited) is shielded with a mask or protected with photoresist.
The photoresist is then removed.
スパツタリング蒸着では一般にターゲツトの組
成と蒸着膜の組成が異なるため、ターゲツトとす
るろう材の組成は、蒸着膜となつてからの組成を
考慮して決定しなければならない。あるいは、ろ
う材組成の個々の金属をターゲツトとし、それら
を積層して蒸着することにより、加熱時に個々の
金属が溶融してろう合金としてもよく、これによ
り、最初からろう材組成を蒸着したのと同様の効
果が得られる。 In sputtering vapor deposition, the composition of the target and the composition of the deposited film are generally different, so the composition of the target brazing filler metal must be determined by taking into account the composition of the deposited film. Alternatively, by targeting individual metals in the brazing filler metal composition and depositing them in a layered manner, the individual metals may melt during heating to form a braze alloy. The same effect can be obtained.
その具体的な例としてAgとCuを用いるのが有
効である。これらはターゲツト材料として入手が
容易であり、また公害等の発生の危険もない。
AgとCuは成分比71〜73％対27〜29％で銀ろうと
なる。 As a specific example, it is effective to use Ag and Cu. These materials are easily available as target materials, and there is no risk of causing pollution.
Ag and Cu become silver solder at a component ratio of 71 to 73% to 27 to 29%.
ろう材もしくはその成分金属をスパツタリング
蒸着する他の長所として、センダスト面の保護が
あげられる。ろう接にあたつてはセンダスト面が
清浄で、酸化がほとんど無視できる状態でなけれ
ばならないが、箔を用いる方法では不十分であつ
た。スパツタリング蒸着ではセンダスト面に膜が
付着しはじめる初期に付着面の清浄化作用を生
じ、清浄なセンダストの上に蒸着膜が形成され
る。 Another advantage of sputtering the brazing filler metal or its component metals is the protection of the sendust surface. When soldering, the sendust surface must be clean and oxidation must be almost negligible, but methods using foil were insufficient. In sputtering vapor deposition, a cleaning effect occurs on the adhering surface at the initial stage when the film starts to adhere to the sendust surface, and a vapor-deposited film is formed on the clean sendust.
したがつて、この実施例のように大気中でろう
接する場合には特にセンダスト面が保護されてい
るために、良好なろう接を行うことが可能とな
る。 Therefore, when soldering is performed in the atmosphere as in this embodiment, since the sendust surface is particularly protected, it is possible to perform good soldering.
このことからして、ろう材もしくはその成分金
属をブロツク１，１′の両方の後部ギヤツプ突合
せ面に蒸着しておくことが望ましい。 In view of this, it is desirable to deposit the brazing filler metal or its constituent metals on the rear gap abutting surfaces of both blocks 1 and 1'.
前術のAgとCuを用いる場合にはそれぞれをブ
ロツク１と１′に単独に蒸着することで工程が簡
略化される。またその方が蒸着膜の厚みを正確に
制御することができる。 In the case of using Ag and Cu as in the previous method, the process is simplified by individually depositing each on blocks 1 and 1'. Moreover, in this case, the thickness of the deposited film can be controlled more accurately.
以上の説明ではスパツタリング蒸着による方法
について述べたが、Ag、Cu等の金属の場合には
真空蒸着にても蒸着できることはもちろんであ
る。 In the above explanation, a sputtering vapor deposition method has been described, but it goes without saying that metals such as Ag and Cu can also be vapor-deposited by vacuum vapor deposition.
第９図は具体例を示している。すなわち、ブロ
ツク１，１′の前部ギヤツプ突合せ面にはSiO2膜
２１が付着されており、その厚みはそれぞれt1で
ある（t1はギヤツプ長の２分の１）。ブロツク１
の後部ギヤツプ突合せ面にはCu膜２２が付着さ
れており、その厚みはt2である。ブロツク１′の
後部ギヤツプ突合せ面にはAg膜２３が付着され
ており、その厚みはt3である。 FIG. 9 shows a concrete example. That is, a SiO 2 film 21 is attached to the front gap abutting surfaces of blocks 1 and 1', and the thickness thereof is t 1 (t 1 is one half of the gap length). Block 1
A Cu film 22 is attached to the abutting surface of the rear gap, and its thickness is t2 . An Ag film 23 is attached to the abutting surface of the rear gap of the block 1', and its thickness is t3 .
実験によれば、t3がほぼt2の２倍となつたとき
に良好なろう接が実現された。また、t3とt2の和
はt1のほぼ２倍、すなわちほぼギヤツプ長に等し
い大きさにしておくことが望ましい。そうすると
ブロツク１，１′がほぼ平行に保つてろう接され
るため、高精度のギヤツプを形成することができ
る。たとえば、ギヤツプ長が0.3μｍの場合には、
t1＝0.15μｍ、t2＝0.1μｍ、t3＝0.2μｍとなり、ス
パツタリング蒸着、真空蒸着等で付着させるのに
適した厚みである。 According to experiments, good soldering was achieved when t 3 was approximately twice t 2 . Further, it is desirable that the sum of t 3 and t 2 be approximately twice as large as t 1 , that is, approximately equal to the gap length. In this case, since the blocks 1 and 1' are brazed while keeping them substantially parallel, a highly accurate gap can be formed. For example, if the gap length is 0.3μm,
t 1 =0.15 μm, t 2 =0.1 μm, and t 3 =0.2 μm, which are suitable thicknesses for deposition by sputtering vapor deposition, vacuum vapor deposition, or the like.
以上、本発明によればセンダストビデオヘツド
の狭ギヤツプ化においても、高精度がギヤツプを
強固に形成することができた。 As described above, according to the present invention, even when narrowing the gap of the Sendust video head, the gap can be formed firmly with high precision.
以上の説明したように、本発明の方法によれ
ば、二つのブロツクの後部ギヤツプ突合せ面に挾
持させたろう材を、後部ギヤツプ突合せ面側から
レーザ光を照射して、溶融させているので、従来
のようにブロツク全体を高温度下において突合せ
面を平行に保持して加圧する場合に比べて、きわ
めて容易にその突合せ面を精度よく平行に保持す
ることができる。そして、ろう材やスペーサを蒸
着によつて突合せ面に付着させると、狭ギヤツプ
化が容易に達成できる。 As explained above, according to the method of the present invention, the brazing material held between the abutting surfaces of the rear gap of two blocks is melted by irradiating the laser beam from the abutting surfaces of the rear gap. Compared to the case where the entire block is held under high temperature with the abutting surfaces parallel and pressurized, the abutting surfaces can be held parallel with high accuracy much more easily. If a brazing material or a spacer is attached to the abutting surfaces by vapor deposition, a narrow gap can be easily achieved.
第１図、第２図、第３図および第４図は磁気ヘ
ツドコアの製造方法について説明するための工程
図である。第５図は従来のろう接法を説明するた
めの装置の構成を示す図である。第６図は本発明
にかかる方法の一実施例を説明するための図、第
７図はろう接された合体ブロツクの斜視図、第８
図は完成したヘツドコアの一例を示す斜視図、第
９図は本発明の方法の具体例を説明するための図
である。
１，１′……ブロツク、５……非磁性スペーサ、
６……銀ろう箔、１１……レーザ発振器、１２…
…反射鏡、１３……集光レンズ、１４……テーブ
ル、１５……ホルダ、１６……押え板、１７……
バネ、２１……SiO2膜、２２……Cu膜、２３…
…Ag膜。
FIGS. 1, 2, 3, and 4 are process diagrams for explaining a method of manufacturing a magnetic head core. FIG. 5 is a diagram showing the configuration of an apparatus for explaining the conventional brazing method. FIG. 6 is a diagram for explaining one embodiment of the method according to the present invention, FIG. 7 is a perspective view of a soldered combined block, and FIG.
The figure is a perspective view showing an example of a completed head core, and FIG. 9 is a diagram for explaining a specific example of the method of the present invention. 1, 1'...Block, 5...Nonmagnetic spacer,
6...Silver solder foil, 11...Laser oscillator, 12...
...Reflector, 13... Condensing lens, 14... Table, 15... Holder, 16... Holding plate, 17...
Spring, 21...SiO 2 film, 22...Cu film, 23...
...Ag film.
Claims (1)
少なくとも一方のブロツクの長手方向に巻線用の
溝を形成し、前記第１、第２のブロツクのギヤツ
プ突合せ面を鏡面に研摩し、前記巻線用の溝を境
として、前部ギヤツプ突合せ面にはギヤツプ長と
ほぼ等しい厚みの非磁性スペーサを配し、後部ギ
ヤツプ突合せ面にはろう材をはさんで、前記第
１、第２のブロツクのギヤツプ突合せ面を突合
せ、これを押圧した状態にて、前記後部ギヤツプ
突合せ面側より前記第１、第２のブロツクの突合
せ部にそつてレーザ光を照射して、前記ろう材お
よび前記第１、第２のブロツクの後部ギヤツプ突
合せ面近傍を加熱し、前記ろう材を溶融させて、
前記第１、第２のブロツクの後部ギヤツプ突合せ
面をろう接して一体化し、合体されたブロツクを
切断して磁気ヘツドコアとすることを特徴とする
磁気ヘツドコアの製造方法。 ２ 非磁性スペーサとして、SiO2をスパツタリ
ング蒸着にてブロツクの前部ギヤツプ突合せ面に
付着させることを特徴とする特許請求の範囲第１
項記載の磁気ヘツドコアの製造方法。 ３ ろう材をスパツタリング蒸着にてブロツクの
後部ギヤツプ突合せ面に付着させることを特徴と
する特許請求の範囲第１項記載の磁気ヘツドコア
の製造方法。 ４ ろう材として、AgおよびCuをスパツタリン
グ蒸着もしくは真空蒸着によりブロツクの後部ギ
ヤツプ突合せ面に付着させることを特徴とする特
許請求の範囲第１項記載の磁気ヘツドコアの製造
方法。 ５ 第１のブロツクの後部ギヤツプ突合せ面に
Agを付着させ、第２のブロツクの後部ギヤツプ
突合せ面にCuを付着させ、AgとCuの膜厚比をほ
ぼ２：１とすることを特徴とする特許請求の範囲
第４項記載の磁気ヘツドコアの製造方法。 ６ 非磁性スペーサおよびろう材をスパツタリン
グ蒸着または真空蒸着により、それぞれブロツク
の前部ギヤツプ突合せ面および後部ギヤツプ突合
せ面に付着させ、それぞれの膜厚をほぼ等しくす
ることを特徴とする特許請求の範囲第１項記載の
磁気ヘツドコアの製造方法。[Scope of Claims] 1. A winding groove is formed in the longitudinal direction of at least one of the first and second blocks made of an alloy magnetic material, and the gap abutting surfaces of the first and second blocks are formed. A non-magnetic spacer with a thickness approximately equal to the gap length is placed on the front gap abutting surface, with the groove for the winding as a boundary, and a brazing material is placed on the rear gap abutting surface. The gap abutment surfaces of the first and second blocks are abutted and pressed, and a laser beam is irradiated from the rear gap abutment surface side along the abutment portions of the first and second blocks, heating the brazing material and the vicinity of the rear gap abutting surfaces of the first and second blocks to melt the brazing material;
A method for manufacturing a magnetic head core, comprising: integrating the rear gap abutting surfaces of the first and second blocks by soldering, and cutting the combined block to obtain a magnetic head core. 2. Claim 1, characterized in that SiO 2 is deposited as a non-magnetic spacer on the abutting surface of the front gap of the block by sputtering vapor deposition.
A method for manufacturing a magnetic head core as described in . 3. A method for manufacturing a magnetic head core according to claim 1, characterized in that the brazing material is attached to the abutting surface of the rear gap of the block by sputtering vapor deposition. 4. The method for manufacturing a magnetic head core according to claim 1, wherein Ag and Cu are deposited as brazing materials on the abutting surfaces of the rear gap of the block by sputtering deposition or vacuum deposition. 5 At the rear gear butting surface of the first block.
The magnetic head core according to claim 4, characterized in that Ag is deposited and Cu is deposited on the abutting surface of the rear gap of the second block, so that the film thickness ratio of Ag and Cu is approximately 2:1. manufacturing method. 6. The non-magnetic spacer and the brazing material are respectively attached to the front gap abutting surface and the rear gap abutting surface of the block by sputtering vapor deposition or vacuum vapor deposition, and the respective film thicknesses are made approximately equal. A method for manufacturing a magnetic head core according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3180780A JPS56127912A (en) | 1980-03-12 | 1980-03-12 | Production of magnetic head core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3180780A JPS56127912A (en) | 1980-03-12 | 1980-03-12 | Production of magnetic head core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56127912A JPS56127912A (en) | 1981-10-07 |
| JPS6355130B2 true JPS6355130B2 (en) | 1988-11-01 |
Family
ID=12341356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3180780A Granted JPS56127912A (en) | 1980-03-12 | 1980-03-12 | Production of magnetic head core |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56127912A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59231729A (en) * | 1983-06-14 | 1984-12-26 | Pioneer Electronic Corp | Production of magnetic head |
-
1980
- 1980-03-12 JP JP3180780A patent/JPS56127912A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56127912A (en) | 1981-10-07 |
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