JPH0152808B2 - - Google Patents
Info
- Publication number
- JPH0152808B2 JPH0152808B2 JP56017247A JP1724781A JPH0152808B2 JP H0152808 B2 JPH0152808 B2 JP H0152808B2 JP 56017247 A JP56017247 A JP 56017247A JP 1724781 A JP1724781 A JP 1724781A JP H0152808 B2 JPH0152808 B2 JP H0152808B2
- Authority
- JP
- Japan
- Prior art keywords
- sio
- gap forming
- glass
- core
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 48
- 238000003466 welding Methods 0.000 claims description 24
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 17
- 238000002844 melting Methods 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000004544 sputter deposition Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910044991 metal oxide Inorganic materials 0.000 claims description 8
- 150000004706 metal oxides Chemical class 0.000 claims description 8
- 238000004804 winding Methods 0.000 claims description 8
- 238000005498 polishing Methods 0.000 claims description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 229910052593 corundum Inorganic materials 0.000 claims 1
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 1
- 239000002131 composite material Substances 0.000 description 13
- 229910000859 α-Fe Inorganic materials 0.000 description 13
- 239000010408 film Substances 0.000 description 9
- 230000003014 reinforcing effect Effects 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 229910052573 porcelain Inorganic materials 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000007496 glass forming Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/133—Structure or manufacture of heads, e.g. inductive with cores composed of particles, e.g. with dust cores, with ferrite cores with cores composed of isolated magnetic particles
- G11B5/1335—Assembling or shaping of elements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】
この発明はビデオテープレコーダ用画像ヘツド
に使用する狭トラツク幅の磁気ヘツドの製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION This invention relates to a method of manufacturing a narrow track width magnetic head for use in an image head for a video tape recorder.
一般にVTR用画像ヘツドはトラツク幅が20〜
30μmの狭トラツク幅であり、さらには記録密度
の向上に伴いギヤツプ長も狭ギヤツプ化の傾向に
ある、精密な加工と複雑な工程を経て作製されて
いる。 In general, VTR image heads have a track width of 20~
It has a narrow track width of 30 μm, and as recording density increases, the gap length tends to become narrower, and it is manufactured through precise machining and complicated processes.
かかる磁気ヘツドの製造工程を説明すると、
Mn−Zn単結晶フエライト等の磁性材料から一対
の平板を切り出し、平板の所定面に一方向の例え
ばＵ字形溝を穿設してこれを突合せてトラツク幅
に該当する部分を形成し、平板より適当なブロツ
クを切り出し、一方のブロツクに巻線用溝並びに
溶着横溝を加工しコ字形ブロツクとし、両ブロツ
クのＵ字形溝に補強用ガラスを充填し、突合せす
るギヤツプ形成面を鏡面研摩したのち、所定のギ
ヤツプを構成するためギヤツプ形成面に蒸着、ス
パツター法等でギヤツプ長に相当する薄膜を付着
させ、ギヤツプ形成膜を介して両ブロツクを圧力
をかけて付合せ、先の補強用ガラスより溶融温度
の低い接合ガラスを巻線用溝と溶着横溝に入れて
加熱溶着させて磁気ヘツドコアを作製している。 To explain the manufacturing process of such a magnetic head,
A pair of flat plates are cut out of a magnetic material such as Mn-Zn single crystal ferrite, a U-shaped groove is bored in one direction on a predetermined surface of the flat plate, and the grooves are butted to form a portion corresponding to the track width. A suitable block is cut out, a winding groove and a welding horizontal groove are cut into one block to form a U-shaped block, the U-shaped grooves of both blocks are filled with reinforcing glass, and the gap forming surfaces to be butted are polished to a mirror finish. In order to form a predetermined gap, a thin film corresponding to the gap length is deposited on the gap forming surface by vapor deposition or sputtering, and both blocks are brought together by applying pressure through the gap forming film, and then melted from the reinforcing glass. A magnetic head core is manufactured by placing low-temperature bonding glass into the winding groove and welding lateral groove and welding it by heating.
以上の如く、ガラスボンデイング工程が２回必
要なため、工程が繁雑となり、しかも補強用ガラ
ス及び接合ガラスの２種類の高、低融点ガラスを
使い分ける必要がある。従つて熱処理工程の長時
間化に伴いギヤツプ形成面がガラスによる熱浸蝕
にさらされる度合が高くなる。 As described above, since the glass bonding process is required twice, the process becomes complicated, and moreover, it is necessary to use two types of high and low melting point glasses, reinforcing glass and bonding glass. Therefore, as the heat treatment process becomes longer, the gap-forming surface is more exposed to thermal erosion by the glass.
そこでこの発明は、かかるガラス溶着を１回と
することができると共に、特定の複合ガラスター
ゲツトを用いてスパツター法によりギヤツプ形成
膜を被着することにより、フエライトコアの接合
強度並びにギヤツプ長寸法精度を向上させる狭ト
ラツク幅の磁気ヘツドを簡単に製造する方法を目
的としている。 Therefore, this invention can reduce the glass welding process to one time, and also improves the bonding strength of the ferrite core and the dimensional accuracy of the gap length by applying a gap forming film using a sputtering method using a specific composite glass target. The object of the present invention is to provide a method for easily manufacturing a magnetic head with a narrow track width.
すなわちこの発明は、磁気回路を構成するフエ
ライトコアの一方に、トラツク幅を構成する所定
深さの縦溝と巻線用並びにガラス溶着用横溝を加
工し、上記縦溝端が巻線用横溝に連通するよう構
成し、他方のコアにトラツク幅を構成する縦溝を
加工後、ギヤツプ突合せ面を研摩し、この研摩面
に所定ギヤツプ長の1/2の厚さとなるようギヤツ
プ形成膜を、特定の構成からなる複合ガラスター
ゲツトを用いてスパツターにより被着させ、１対
のフエライトコアをトラツク幅が一致するよう組
合せ、溶着用横溝を上にしてこの横溝と巻線用横
溝にギヤツプ形成膜とほぼ同一温度で溶着できる
ガラス棒を挿入し、加熱圧着することを要旨とす
る。 That is, in this invention, a vertical groove of a predetermined depth constituting a track width and a horizontal groove for winding and glass welding are formed on one side of a ferrite core constituting a magnetic circuit, and the end of the vertical groove communicates with the horizontal groove for winding. After machining a vertical groove forming the track width on the other core, the gap abutting surface is polished, and a gap forming film is applied to the polished surface to a thickness of 1/2 of the predetermined gap length. A pair of ferrite cores are combined so that the track widths match, and a gap-forming film almost identical to that of the gap-forming film is applied to this lateral groove and the winding lateral groove with the welding lateral groove facing upward. The gist is to insert a glass rod that can be welded at high temperatures and heat and press it.
この発明による製造方法では、ガラス溶着が１
回で完了し、しかもギヤツプ形成膜に用いるガラ
スとトラツク幅部分の補強用ガラスおよびコア溶
着用のガラスがほぼ同一溶融温度を有しているた
め、熱処理工程によるギヤツプ形成面の熱侵蝕は
減少する。いずれの部分においても強固な溶着力
が得られ、ギヤツプ寸法精度も向上する。 In the manufacturing method according to the present invention, glass welding is performed at 1
Moreover, since the glass used for the gap forming film, the reinforcing glass for the track width portion, and the glass for core welding have almost the same melting temperature, thermal corrosion of the gap forming surface due to the heat treatment process is reduced. . A strong welding force can be obtained in any part, and gap dimensional accuracy is also improved.
次に、研摩したコアのギヤツプ形成面に、スパ
ツターによりギヤツプ形成膜を被着する際に使用
する複合ターゲツトを説明する。 Next, a composite target used for applying a gap-forming film to the gap-forming surface of the polished core by sputtering will be explained.
複合ターゲツトは、B2O3、Na2O、K2O、
ZnO、MgO、PbO、Al2O3等の低融点化金属酸化
物を単独又は混合して、SiO2と合せた全体で2.5
〜10wt％となるように調整した低融点化金属酸
化物組成片、すなわち、SiO2からなるターゲツ
ト板の露出面のSiO2量に対して2.5〜10wt％の低
融点化金属酸化物のみを含有する組成片、あるい
は、上記SiO2ターゲツトの露出面のSiO2量およ
び当該組成片中に含有されるSiO2量との合計量
に対して2.5〜10wt％の低融点化金属酸化物と
SiO2を共に含む組成片を、SiO2からなるターゲ
ツト板上に例えば扇状に、あるいは点対称に貼着
したものである。 Complex targets include B 2 O 3 , Na 2 O, K 2 O,
Low melting point metal oxides such as ZnO, MgO, PbO, Al 2 O 3 , etc. alone or in combination with SiO 2 total 2.5
A low-melting metal oxide composition piece adjusted to ~10 wt%, that is, it contains only 2.5 to 10 wt% of low-melting metal oxide based on the amount of SiO2 on the exposed surface of the target plate made of SiO2 . or 2.5 to 10 wt% of a metal oxide with a lower melting point based on the total amount of SiO 2 on the exposed surface of the SiO 2 target and the amount of SiO 2 contained in the composition piece.
Composition pieces containing SiO 2 are adhered onto a target plate made of SiO 2 , for example, in a fan shape or point symmetrically.
この複合ターゲツトを使用して例えばスパツタ
リングを行なうと、一度のスパツター作業で安定
した複合ガラス層を上記のギヤツプ形成面に被着
させることができ、得られた複合ガラス層の組成
は複合ターゲツトに調整した組成とほぼ同等とな
る。従つてこの複合ガラス層を被着したコア同志
を加熱圧着すると強固な均一組成のギヤツプ形成
膜を得ることができ、磁気ヘツドの狭ギヤツプ形
成が容易になる効果を有する。 For example, when sputtering is performed using this composite target, a stable composite glass layer can be deposited on the above-mentioned gap forming surface with a single sputtering operation, and the composition of the resulting composite glass layer can be adjusted to match the composite target. The composition is almost the same as that of Therefore, by heat-pressing the cores covered with this composite glass layer, a strong gap-forming film of uniform composition can be obtained, which has the effect of facilitating the formation of a narrow gap in the magnetic head.
ここで、複合ターゲツトにおいて低融点化金属
酸化物の含有量を2.5〜10wt％とするのは、2.5wt
％未満であると圧接時の温度が900℃以上になり、
フエライト自身の磁気特性を損う欠点があり、ま
た10wt％を超えると圧接時の温度が650℃以下と
なり、フエライトとガラスとの反応を抑止する範
囲での圧接温度は650℃以下となり、溶着用ホウ
ケイ酸ガラスの溶融温度700℃より低下し、ギヤ
ツプはがれを生じる欠点があるため、低融点化金
属酸化物の含有量を2.5〜10wt％とする。 Here, the content of the low melting point metal oxide in the composite target is 2.5 to 10 wt%.
If it is less than %, the temperature during pressure welding will exceed 900℃,
Ferrite has the disadvantage of impairing its own magnetic properties, and if it exceeds 10wt%, the temperature during pressure welding will be below 650℃, and the pressure welding temperature will be below 650℃ within the range that suppresses the reaction between ferrite and glass, making it difficult for welding. Since the melting temperature of borosilicate glass is lower than 700°C, which causes gap peeling, the content of the metal oxide for lowering the melting point is set to 2.5 to 10 wt%.
以下に、この発明による磁気ヘツドコアの製造
方法を図面に基づいて説明する。 Hereinafter, a method for manufacturing a magnetic head core according to the present invention will be explained based on the drawings.
まず第１図のａ図に示す如く、フエライト素材
のブロツクを所定寸法に切出し、一対の磁気ヘツ
ドを構成するコア１，１ａを準備する。 First, as shown in FIG. 1A, a block of ferrite material is cut out to a predetermined size to prepare cores 1 and 1a constituting a pair of magnetic heads.
次に、コア１，１ａの所定表面に、トラツク幅
を規制する縦溝２を所定間隔で穿設し、一対のコ
ア１，１ａのち一方のコア１ａに縦溝２先端が連
通する如く断面コ字状に巻線を収容し、かつガラ
ス溶着にも使用する横溝３を設ける。さらにこの
コア１ａの縦溝２とは反対側の面を加工し、コア
１と突合せたとき溶着用横溝となるべき後方溝４
を設ける。 Next, vertical grooves 2 for regulating the track width are bored at predetermined intervals on the predetermined surfaces of the cores 1, 1a, and the cross-sectional shape is shaped so that the tip of the longitudinal grooves 2 communicates with one core 1a of the pair of cores 1, 1a. A horizontal groove 3 is provided to accommodate the winding wire in a character shape and also to be used for glass welding. Furthermore, the surface of this core 1a opposite to the vertical groove 2 is machined, and a rear groove 4 which becomes a welding horizontal groove when abutted against the core 1 is processed.
will be established.
以上の溝２〜４を加工した各コア１，１ａの接
合用面に生じるチツピングを除去するために、表
面をラツプあるいはポリツシユする。その後この
研摩した接合用面すなわちギヤツプ形成面に、所
定の溶融温度の組成となすべく調整作製された上
述の複合ターゲツトを用いて、スパツター法によ
つて所定厚のガラス層５，５ａを形成する。 In order to remove chipping that occurs on the joining surface of each core 1, 1a where the grooves 2 to 4 have been formed, the surface is lapped or polished. Thereafter, glass layers 5, 5a of a predetermined thickness are formed on this polished bonding surface, that is, the gap forming surface, by a sputtering method using the above-mentioned composite target adjusted to have a composition with a predetermined melting temperature. .
また、予め鏡面研摩した表面に所定厚のガラス
形成層を得るべく、複合ターゲツトによつてスパ
ツター膜を形成した上で、トラツク幅を規制する
縦溝２、巻線用横溝３、後方溝４を加工してもよ
い。この溝加工の際エツジにチツピングを生じな
いよう加工条件等を選定する必要があるが、スパ
ツター法により高い強度が得られる。 In addition, in order to obtain a glass forming layer of a predetermined thickness on the previously mirror-polished surface, a sputter film is formed using a composite target, and then vertical grooves 2 for regulating the track width, horizontal grooves 3 for winding, and rear grooves 4 are formed. May be processed. Although it is necessary to select processing conditions etc. so as not to cause chipping on the edges during this groove processing, high strength can be obtained by the sputtering method.
次に、ガラス層５，５ａを設けた各コア１，１
ａを、第２図のａ図に示すごとく、ガラス層５，
５ａを対向させ、さらにトラツク幅を規制する縦
溝２を相合致するように組合せて両側から加圧す
る。そして被着させたガラス層５，５ａとほぼ同
一の溶融温度を有する溶着用ガラス棒６，７を、
後方溝４側を上方にして、後方溝４と横溝３内に
挿入し、両コア１，１ａを接合中心へ加圧した状
態で、所定の温度まで加熱保持する。このとき横
溝３内に挿入したガラス棒７は溶融して連通する
縦溝２内へも流入してトラツク部の補強ガラスを
形成する。 Next, each core 1, 1 provided with a glass layer 5, 5a
As shown in FIG. 2, a is a glass layer 5,
5a are opposed to each other, and the vertical grooves 2 for regulating the track width are combined so as to match each other, and pressure is applied from both sides. Then, glass rods 6, 7 for welding having approximately the same melting temperature as the glass layers 5, 5a applied thereto,
It is inserted into the rear groove 4 and the lateral groove 3 with the rear groove 4 side facing upward, and heated and maintained to a predetermined temperature while pressing both cores 1 and 1a toward the joining center. At this time, the glass rod 7 inserted into the horizontal groove 3 is melted and flows into the communicating vertical groove 2 to form reinforcing glass for the track portion.
こうして溶着が完了したのち冷却し、第２図ｂ
図に示す如く、１点鎖線上すなわち縦溝２の中央
部でブロツクをスライスし、両面をラツプ仕上げ
する。 After welding is completed in this way, it is cooled and
As shown in the figure, the block is sliced on the dashed line, that is, at the center of the vertical groove 2, and both sides are lapped.
すると第３図に示すように、磁気ヘツド用のフ
エライトコアチツプ８が得られ、上記の一回のガ
ラスボンデイングによつて、トラツク面の補強ガ
ラス７′と横溝における補強ガラス７′が共有さ
れ、さらにバツクサイドの溶着用ガラス６′とが
同時に溶着され、熱侵蝕による性能の劣化が少な
く寸法精度のすぐれたフエライトコアチツプ８が
得られる。 Then, as shown in FIG. 3, a ferrite core chip 8 for a magnetic head is obtained, and the reinforcing glass 7' on the track surface and the reinforcing glass 7' on the lateral grooves are shared by the above-mentioned one-time glass bonding. Further, the backside welding glass 6' is welded at the same time, resulting in a ferrite core chip 8 with excellent dimensional accuracy and less deterioration in performance due to thermal corrosion.
以下にこの発明による実施例を示しその効果を
明らかにする。 Examples according to the present invention will be shown below to clarify its effects.
フエライトコアに10×５×1.6mmのブロツクを
使用し、縦溝は溝幅200μm、溝深400μmで切残し
幅20μmすなわちトラツク幅20μmとなるよう溝加
工し、さらに横溝、後方溝を加工した。 A block of 10 x 5 x 1.6 mm was used for the ferrite core, and the longitudinal grooves were machined so that the groove width was 200 μm, the groove depth was 400 μm, and the uncut width was 20 μm, that is, the track width was 20 μm. Lateral grooves and rear grooves were also machined.
ギヤツプ形成面を研摩後、ガラス層を被着させ
るが、複合ターゲツトには、SiO2ターゲツト板
上に低融点化金属酸化物組成片としてホウケイサ
ンガラスを貼着したものを使用した。その組成は
ホウケイサンガラスが組成比、SiO280wt％、
Al2O32wt％、B2O313wt％、Na2O5wt％であり、
前記組成片中のSiO2量とターゲツト板の露出面
のSiO2量の合計に対してAl2O3、B2O3、Na2Oの
合計が7.5wt％となるようSiO2ターゲツト板上の
ホウケイサンガラスとの表面積比を５：３とし
た。 After polishing the gap-forming surface, a glass layer was applied, and the composite target used was a SiO 2 target plate with borosilicate glass adhered as a piece of a low-melting metal oxide composition. Its composition is porcelain glass, SiO 2 80wt%,
Al 2 O 3 2wt%, B 2 O 3 13wt%, Na 2 O 5wt%,
On the SiO 2 target plate, the total amount of Al 2 O 3 , B 2 O 3 , and Na 2 O was 7.5 wt% with respect to the total amount of SiO 2 in the composition piece and the amount of SiO 2 on the exposed surface of the target plate. The surface area ratio of the glass to the porcelain glass was 5:3.
この複合ターゲツトを使用したスパツターによ
るガラス形成層厚を片側0.15μmとした。 The thickness of the glass layer formed by sputtering using this composite target was 0.15 μm on one side.
次に、加熱条件を800℃×1.5時間として、被着
した複合のガラス層を対向させてフエライトコア
を所定位置に組み、加熱圧着した。このときの溶
着用ガラスには0.5mmφのホウケイサンガラス棒
を使用した。 Next, under heating conditions of 800° C. for 1.5 hours, the ferrite core was assembled in a predetermined position with the adhered composite glass layers facing each other, and heat and pressure bonded. At this time, a 0.5 mm diameter porcelain glass rod was used as the welding glass.
さらに溶着完了後冷却し、スライス後ラツプ仕
上げを行ない0.2mmｔのフエライトコアチツプに
仕上げた。 Furthermore, after welding was completed, it was cooled, sliced, and lapped to produce a 0.2 mm thick ferrite core chip.
以上の如く、この発明方法により作製した
VTR画像ヘツド用フエライトコアチツプは、ギ
ヤツプ寸法精度も所定の0.3μmに対して±５％の
範囲内で、トラツク幅は所定どおりにおさまつて
おり、ギヤツプ形成面は完全に溶着され、補強ガ
ラスによる溶着強度も高くなつている。しかも上
記のすぐれた特性のコアチツプが所定の加工のほ
か、１回のスパツター作業と１回のガラスボンデ
イングの簡易な製造工程によつて得られた。 As described above, the product was produced by the method of this invention.
The ferrite core chip for VTR image heads has gap dimensional accuracy within ±5% of the specified 0.3 μm, the track width is within the specified range, and the gap forming surface is completely welded and reinforced with glass. The welding strength is also increasing. Moreover, the core chip with the above-mentioned excellent properties was obtained through a simple manufacturing process of one sputtering operation and one glass bonding operation in addition to the prescribed processing.
第１図から第３図はこの発明による製造方法の
工程を示すコアの説明図である。
図中、１，１ａ……コア、２……縦溝、３……
横溝、４……後方溝、５，５ａ……ガラス層、
６，７……溶着用ガラス棒、６′……溶着ガラス、
７′……補強ガラス、８……コアチツプ。
FIGS. 1 to 3 are explanatory diagrams of a core showing the steps of the manufacturing method according to the present invention. In the figure, 1, 1a... core, 2... vertical groove, 3...
Lateral groove, 4... Rear groove, 5, 5a... Glass layer,
6, 7...Glass rod for welding, 6'...Welding glass,
7'... Reinforced glass, 8... Core chip.
Claims (1)
形成面に、磁気ヘツドのトラツク幅を構成する縦
溝を形成してコアの一方に設けた巻線用横溝に前
記縦溝先端が連通するよう構成し、さらに前記の
コアにガラス溶着用後方溝を形成した後に、ギヤ
ツプ形成面を研摩して得られた研摩面に非磁性体
のギヤツプ形成膜を被着させるか、または各コア
のギヤツプ形成面を研摩してギヤツプ形成膜を被
着したのち上記の溝加工を施し、一対のコアをト
ラツク幅が一致するよう組合せた後、溶着用後方
溝を上にしてこの後方溝と巻線用横溝に上記ギヤ
ツプ形成膜とほぼ同一温度で溶着できるガラス棒
を挿入し、一対のコアを加熱圧着する磁気ヘツド
コアの製造方法において、低融点化金属酸化物、
B2O3、Na2O、K2O、ZnO、MgO、PbO、Al2O3
のうち少なくとも１種を、SiO2ターゲツト板の
露出面のSiO2量あるいはSiO2ターゲツト板の露
出面のSiO2量と低融点化金属酸化物組成片に含
有のSiO2量の合計に対し、2.5〜10wt％となるよ
う調整した低融点化金属酸化物組成片を、SiO2
ターゲツト板上に貼着した復合ターゲツトを使用
してスパツター法により、各コアのギヤツプ形成
面にギヤツプ形成膜を被着させることを特徴とす
る磁気ヘツドコアの製造方法。1. A vertical groove forming the track width of the magnetic head is formed on each gap forming surface of a pair of cores constituting the magnetic circuit, and the tip of the vertical groove communicates with a horizontal groove for winding provided on one of the cores. Then, after forming a rear groove for glass welding on the core, the gap forming surface is polished and a non-magnetic gap forming film is applied to the polished surface, or the gap forming surface of each core is After polishing and applying a gap forming film, perform the groove processing described above, and then assemble the pair of cores so that the track widths match. A method for producing a magnetic head core in which a glass rod that can be welded at approximately the same temperature as the gap forming film is inserted, and a pair of cores are bonded under heat and pressure.
B2O3 , Na2O , K2O , ZnO, MgO, PbO, Al2O3
At least one of the above is added to the amount of SiO 2 on the exposed surface of the SiO 2 target plate or the sum of the amount of SiO 2 on the exposed surface of the SiO 2 target plate and the amount of SiO 2 contained in the low melting point metal oxide composition piece, SiO 2
1. A method for manufacturing a magnetic head core, which comprises applying a gap forming film to the gap forming surface of each core by a sputtering method using a decoupled target stuck on a target plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1724781A JPS57133515A (en) | 1981-02-06 | 1981-02-06 | Production of magnetic head core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1724781A JPS57133515A (en) | 1981-02-06 | 1981-02-06 | Production of magnetic head core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57133515A JPS57133515A (en) | 1982-08-18 |
| JPH0152808B2 true JPH0152808B2 (en) | 1989-11-10 |
Family
ID=11938615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1724781A Granted JPS57133515A (en) | 1981-02-06 | 1981-02-06 | Production of magnetic head core |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57133515A (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8202059A (en) * | 1982-05-19 | 1983-12-16 | Philips Nv | GLASS-KITTED MAGNETIC HEAD AND METHOD FOR ITS MANUFACTURE. |
| JPS59193516A (en) * | 1983-04-19 | 1984-11-02 | Pioneer Electronic Corp | Magnetic head |
| JPS59231714A (en) * | 1983-06-13 | 1984-12-26 | Matsushita Electric Ind Co Ltd | Magnetic head |
| JPS6083205A (en) * | 1983-10-12 | 1985-05-11 | Matsushita Electric Ind Co Ltd | Magnetic head |
| JPS60231905A (en) * | 1984-04-30 | 1985-11-18 | Nec Kansai Ltd | Production of magnetic head |
| JPS61104309A (en) * | 1984-10-24 | 1986-05-22 | Canon Electronics Inc | Production of magnetic head |
| JPS61190704A (en) * | 1985-02-20 | 1986-08-25 | Mitsubishi Electric Corp | Production of magnetic head |
| JP2759271B2 (en) * | 1989-01-17 | 1998-05-28 | 日本ビクター株式会社 | Magnetic head and method of manufacturing the same |
| JPH04123302A (en) * | 1990-09-13 | 1992-04-23 | Minebea Co Ltd | Magnetic head |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53108409A (en) * | 1977-03-03 | 1978-09-21 | Matsushita Electric Ind Co Ltd | Magnetic head and preparation thereof |
-
1981
- 1981-02-06 JP JP1724781A patent/JPS57133515A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53108409A (en) * | 1977-03-03 | 1978-09-21 | Matsushita Electric Ind Co Ltd | Magnetic head and preparation thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57133515A (en) | 1982-08-18 |
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