JPS6352463B2 - - Google Patents

Info

Publication number
JPS6352463B2
JPS6352463B2 JP53137498A JP13749878A JPS6352463B2 JP S6352463 B2 JPS6352463 B2 JP S6352463B2 JP 53137498 A JP53137498 A JP 53137498A JP 13749878 A JP13749878 A JP 13749878A JP S6352463 B2 JPS6352463 B2 JP S6352463B2
Authority
JP
Japan
Prior art keywords
leads
semiconductor device
lead
outer frame
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53137498A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5563854A (en
Inventor
Ryuichi Imazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP13749878A priority Critical patent/JPS5563854A/ja
Publication of JPS5563854A publication Critical patent/JPS5563854A/ja
Publication of JPS6352463B2 publication Critical patent/JPS6352463B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP13749878A 1978-11-08 1978-11-08 Method of manufacturing semiconductor device Granted JPS5563854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13749878A JPS5563854A (en) 1978-11-08 1978-11-08 Method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13749878A JPS5563854A (en) 1978-11-08 1978-11-08 Method of manufacturing semiconductor device

Publications (2)

Publication Number Publication Date
JPS5563854A JPS5563854A (en) 1980-05-14
JPS6352463B2 true JPS6352463B2 (enrdf_load_html_response) 1988-10-19

Family

ID=15200056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13749878A Granted JPS5563854A (en) 1978-11-08 1978-11-08 Method of manufacturing semiconductor device

Country Status (1)

Country Link
JP (1) JPS5563854A (enrdf_load_html_response)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6841813B2 (en) 2001-08-13 2005-01-11 Matrix Semiconductor, Inc. TFT mask ROM and method for making same
US6853049B2 (en) 2002-03-13 2005-02-08 Matrix Semiconductor, Inc. Silicide-silicon oxide-semiconductor antifuse device and method of making
US6881994B2 (en) 2000-08-14 2005-04-19 Matrix Semiconductor, Inc. Monolithic three dimensional array of charge storage devices containing a planarized surface
US6888750B2 (en) 2000-04-28 2005-05-03 Matrix Semiconductor, Inc. Nonvolatile memory on SOI and compound semiconductor substrates and method of fabrication
US6897514B2 (en) 2001-03-28 2005-05-24 Matrix Semiconductor, Inc. Two mask floating gate EEPROM and method of making
US6940109B2 (en) 2002-06-27 2005-09-06 Matrix Semiconductor, Inc. High density 3d rail stack arrays and method of making
US7005730B2 (en) 2002-02-19 2006-02-28 Matrix Semiconductor, Inc. Memory module having interconnected and stacked integrated circuits
US8897056B2 (en) 1998-11-16 2014-11-25 Sandisk 3D Llc Pillar-shaped nonvolatile memory and method of fabrication
WO2020085125A1 (ja) 2018-10-25 2020-04-30 マツダ株式会社 仮想通貨管理装置及び仮想通貨管理方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
JPH0529427A (ja) * 1991-07-24 1993-02-05 Nec Corp 半導体装置の製造方法
JPH0582617A (ja) * 1991-09-18 1993-04-02 Sharp Corp 半導体素子の製造装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5259573A (en) * 1975-11-11 1977-05-17 Mitsubishi Electric Corp Production of semiconductor device

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8897056B2 (en) 1998-11-16 2014-11-25 Sandisk 3D Llc Pillar-shaped nonvolatile memory and method of fabrication
US6888750B2 (en) 2000-04-28 2005-05-03 Matrix Semiconductor, Inc. Nonvolatile memory on SOI and compound semiconductor substrates and method of fabrication
US7129538B2 (en) 2000-08-14 2006-10-31 Sandisk 3D Llc Dense arrays and charge storage devices
US8981457B2 (en) 2000-08-14 2015-03-17 Sandisk 3D Llc Dense arrays and charge storage devices
US6881994B2 (en) 2000-08-14 2005-04-19 Matrix Semiconductor, Inc. Monolithic three dimensional array of charge storage devices containing a planarized surface
US8853765B2 (en) 2000-08-14 2014-10-07 Sandisk 3D Llc Dense arrays and charge storage devices
US6992349B2 (en) 2000-08-14 2006-01-31 Matrix Semiconductor, Inc. Rail stack array of charge storage devices and method of making same
US6897514B2 (en) 2001-03-28 2005-05-24 Matrix Semiconductor, Inc. Two mask floating gate EEPROM and method of making
US7615436B2 (en) 2001-03-28 2009-11-10 Sandisk 3D Llc Two mask floating gate EEPROM and method of making
US7250646B2 (en) 2001-08-13 2007-07-31 Sandisk 3D, Llc. TFT mask ROM and method for making same
US7525137B2 (en) 2001-08-13 2009-04-28 Sandisk Corporation TFT mask ROM and method for making same
US6841813B2 (en) 2001-08-13 2005-01-11 Matrix Semiconductor, Inc. TFT mask ROM and method for making same
US7005730B2 (en) 2002-02-19 2006-02-28 Matrix Semiconductor, Inc. Memory module having interconnected and stacked integrated circuits
US7432599B2 (en) 2002-02-19 2008-10-07 Sandisk 3D Llc Memory module having interconnected and stacked integrated circuits
US7329565B2 (en) 2002-03-13 2008-02-12 Sanddisk 3D Llc Silicide-silicon oxide-semiconductor antifuse device and method of making
US6853049B2 (en) 2002-03-13 2005-02-08 Matrix Semiconductor, Inc. Silicide-silicon oxide-semiconductor antifuse device and method of making
US6940109B2 (en) 2002-06-27 2005-09-06 Matrix Semiconductor, Inc. High density 3d rail stack arrays and method of making
WO2020085125A1 (ja) 2018-10-25 2020-04-30 マツダ株式会社 仮想通貨管理装置及び仮想通貨管理方法

Also Published As

Publication number Publication date
JPS5563854A (en) 1980-05-14

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