JPS6351441U - - Google Patents

Info

Publication number
JPS6351441U
JPS6351441U JP1986144603U JP14460386U JPS6351441U JP S6351441 U JPS6351441 U JP S6351441U JP 1986144603 U JP1986144603 U JP 1986144603U JP 14460386 U JP14460386 U JP 14460386U JP S6351441 U JPS6351441 U JP S6351441U
Authority
JP
Japan
Prior art keywords
current flows
region
large current
semiconductor device
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986144603U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986144603U priority Critical patent/JPS6351441U/ja
Publication of JPS6351441U publication Critical patent/JPS6351441U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る半導体装置の一実施例を
示すオーデイオ用パワーアンプのＩＣの概略構成
図、第２図は第１図半導体装置の要部平面図、第
３図は従来の半導体装置の一具体例を示すオーデ
イオ用パワーアンプのＩＣの概略構成図、第４図
は第３図半導体装置の要部平面図である。 ９……ペレツト、１０……小電流が流れる領域
、１１……大電流が流れる領域、Ｖｃｃ１，Ｖｃ
ｃ２，Ｍ１，Ｍ２，Ｇ１，Ｇ２……電極パターン
、１３……ボンデイングワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 大電流が流れる領域と小電流が流れる領域とを
    有する半導体ペレツトの電極をボンデイングワイ
    ヤを介して外部に引き出した半導体装置において
    、上記大電流が流れる電極パターンを大電流が流
    れる領域毎に区別して形成し、かつ各電極パター
    ン毎に１本のボンデイングワイヤを接続したこと
    を特徴とする半導体装置。
JP1986144603U 1986-09-20 1986-09-20 Pending JPS6351441U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986144603U JPS6351441U (ja) 1986-09-20 1986-09-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986144603U JPS6351441U (ja) 1986-09-20 1986-09-20

Publications (1)

Publication Number Publication Date
JPS6351441U true JPS6351441U (ja) 1988-04-07

Family

ID=31055358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986144603U Pending JPS6351441U (ja) 1986-09-20 1986-09-20

Country Status (1)

Country Link
JP (1) JPS6351441U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100828A (ja) * 2009-11-05 2011-05-19 Renesas Electronics Corp 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100828A (ja) * 2009-11-05 2011-05-19 Renesas Electronics Corp 半導体装置及びその製造方法

Similar Documents

Publication Publication Date Title
JPS6351441U (ja)
JPS6318854U (ja)
JPS62122359U (ja)
JPS6355538U (ja)
JPS6289157U (ja)
JPS61121753U (ja)
JPS6192069U (ja)
JPS6244448U (ja)
JPH01140847U (ja)
JPS6190245U (ja)
JPS62152448U (ja)
JPH0244328U (ja)
JPH0252456U (ja)
JPS62172155U (ja)
JPS6343432U (ja)
JPS63195754U (ja)
JPH044767U (ja)
JPS6190256U (ja)
JPS63195757U (ja)
JPS61195054U (ja)
JPH0474463U (ja)
JPH01107155U (ja)
JPS6280345U (ja)
JPH0217843U (ja)
JPS63165846U (ja)