JPS6350695Y2 - - Google Patents

Info

Publication number
JPS6350695Y2
JPS6350695Y2 JP10688882U JP10688882U JPS6350695Y2 JP S6350695 Y2 JPS6350695 Y2 JP S6350695Y2 JP 10688882 U JP10688882 U JP 10688882U JP 10688882 U JP10688882 U JP 10688882U JP S6350695 Y2 JPS6350695 Y2 JP S6350695Y2
Authority
JP
Japan
Prior art keywords
light
circuit board
printed circuit
emitting diode
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10688882U
Other languages
Japanese (ja)
Other versions
JPS5912182U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10688882U priority Critical patent/JPS5912182U/en
Publication of JPS5912182U publication Critical patent/JPS5912182U/en
Application granted granted Critical
Publication of JPS6350695Y2 publication Critical patent/JPS6350695Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【考案の詳細な説明】 本考案は微小で精密機器等に組込みやすい発光
ダイオード表示器に関する。[Detailed Description of the Invention] The present invention relates to a light emitting diode display device that is minute and easy to incorporate into precision equipment.

従来写真機のフアインダ内表示の如く、精密機
器等に利用する表示も小さく表示器収納体積も狭
い表示器においては、第１図に示すようにプリン
ト基板１１の上に発光ダイオード１４を載置し、
樹脂成型品から成る遮光枠１６でその発光ダイオ
ード１４を覆つていた。しかし発光ダイオード１
４が１辺0.25乃至0.35mmと、小さいため遮光枠16
も小さくなるが、この遮光枠１６は光を通さない
よう配慮しているので硬質となつてしまう。一方
プリント基板１１の表面には導電箔１２がある
が、この厚みが0.1乃至0.2mmであり上記部品に比
べ無視できない。従つて遮光枠１６の底面とプリ
ント基板１１との間にすきまが生じやすく、光洩
れを起こして隣接の発光ダイオードが光つている
ように見えたり機器のすきまから光がみえて好ま
しくない。また遮光枠１６が小さいため表示器を
機器に取付けた時他の部品がプリント基板１１に
接触しやすく、短絡事故を生じる。 Conventionally, in displays used in precision equipment, such as displays in the viewfinder of a camera, where the display is small and the display storage space is narrow, a light emitting diode 14 is mounted on a printed circuit board 11 as shown in FIG. ,
The light emitting diode 14 was covered with a light shielding frame 16 made of a resin molded product. However, light emitting diode 1
4 is small with a side of 0.25 to 0.35 mm, so the light-shielding frame 16
However, since the light-shielding frame 16 is designed to prevent light from passing through, it becomes hard. On the other hand, there is a conductive foil 12 on the surface of the printed circuit board 11, but this thickness is 0.1 to 0.2 mm and cannot be ignored compared to the above-mentioned parts. Therefore, a gap is likely to be formed between the bottom surface of the light-shielding frame 16 and the printed circuit board 11, which causes light leakage, causing adjacent light emitting diodes to appear to be glowing or light to be seen through the gap between devices, which is undesirable. Furthermore, since the light-shielding frame 16 is small, other parts are likely to come into contact with the printed circuit board 11 when the display is attached to a device, resulting in a short circuit accident.

本考案は上述の点を考慮してなされたもので、
以下本考案を実施例に基づいて詳細に説明する。 This invention was made in consideration of the above points,
The present invention will be described in detail below based on examples.

第２図は本考案実施例の発光ダイオード表示器
の分解斜視図で、１は、表面にプリントパターン
にメツキ処理を施こした導電箔２，２…を具備
し、遮光枠取付用の透孔３，３を有した、ガラス
エポキシ樹脂等を基材とするプリント基板であ
る。４，４…はガリウム燐等の発光ダイオード
で、導電箔２，２…上に導電性接着剤（図示せ
ず）等で載置固着され金属細線５，５…で配線が
施こされている。６は黒色樹脂成型品からなる遮
光枠で、発光ダイオード４，４…に対応する位置
に発光ダイオード４，４…を包囲するような透孔
７，７…を有し、またプリント基板１の透孔３，
３に対応する位置には突出ピン８，８を有してい
る。この突出ピン８，８を透孔３，３に挿入する
事で遮光枠６をプリント基板１に固着するので、
突出ピン８，８は透孔３，３と嵌合するように太
くしてあるか、又はプリント基板１の裏面から熱
溶着して固定するように充分長くしてあればよい
が、いずれも遮光枠６の周縁部分に設け、場所の
制約がある場合には突出部９を設けてその突出部
９に突出ピン８を設けてある。そしてこの突出ピ
ン８，８を設けた部分のうち、導電箔２，２…の
ある側にはプリント基板１に接する薄膜状の舌片
１０を端部に設けてある。尚ピン８′はこの表示
器を機器的に取付ける時の位置決めピンである。 Fig. 2 is an exploded perspective view of a light emitting diode display according to an embodiment of the present invention, in which 1 is provided with conductive foils 2, 2, etc. whose surfaces are plated with a printed pattern, and transparent holes for attaching a light-shielding frame. This is a printed circuit board made of glass epoxy resin or the like as a base material. 4, 4... are light emitting diodes made of gallium phosphorus or the like, which are placed and fixed on conductive foils 2, 2... with a conductive adhesive (not shown), etc., and wired with thin metal wires 5, 5... . Reference numeral 6 denotes a light shielding frame made of a black resin molded product, which has through holes 7, 7, . Hole 3,
It has protruding pins 8, 8 at positions corresponding to 3. By inserting these protruding pins 8, 8 into the through holes 3, 3, the light shielding frame 6 is fixed to the printed circuit board 1.
The protruding pins 8, 8 may be thick enough to fit into the through holes 3, 3, or long enough to be fixed by heat welding from the back side of the printed circuit board 1, but in both cases, It is provided on the peripheral edge of the frame 6, and if there is a space restriction, a protrusion 9 is provided, and the protrusion pin 8 is provided on the protrusion 9. A thin film-like tongue piece 10 that contacts the printed circuit board 1 is provided at the end of the portion where the protruding pins 8, 8 are provided, on the side where the conductive foils 2, 2, . . . are located. The pin 8' is a positioning pin when this display is installed mechanically.

上述の構成において舌片１０は薄膜状であるか
ら軟質となり、プリント基板１の表面によく密着
する。しかもこの舌片１０はわずかながらクツシ
ヨンともなるので遮光枠６の端にある突出ピン８
を透孔３に深く挿入する事ができ、導電箔２，２
…による凹凸を吸収するように働く。さらにこの
発光ダイオード表示器を機器等に取り付ける時に
はこの舌片１０が他部品とのスペーサとなるので
接触短絡等の事故は生じない。このような効果を
生ずるためには、舌片１０の厚みは、厚いとクツ
シヨン性が減少しうすいとスペーサとなりにくい
ので一般のABS樹脂やノリルやPBT樹脂では
0.05乃至0.25mmの厚みが好ましい。 In the above-mentioned structure, the tongue 10 is a thin film, so it is soft and adheres well to the surface of the printed circuit board 1. Moreover, the tongue 10 also acts as a slight cushion, so that it can be easily attached to the protruding pin 8 at the end of the light shielding frame 6.
The conductive foils 2, 2 can be inserted deeply into the through-hole 3.
...and acts to absorb unevenness caused by the above. Furthermore, when this LED display is attached to equipment, the tongue 10 acts as a spacer with other parts, so accidents such as short circuits do not occur. In order to achieve this effect, the thickness of the tongue 10 is required. If it is too thick, the cushioning effect decreases, and if it is too thin, it does not function as a spacer, so general ABS resin, Noryl, or PBT resin is used.
A thickness of 0.05 to 0.25 mm is preferred.

以上の如く本考案は透孔を有したプリント基板
と、そのプリント基板の導電箔上に載置固着され
た発光ダイオードと、その発光ダイオードを覆
い、突出ピンを前記透孔に挿入してプリント基板
に固着された樹脂製の遮光枠とを具備した発光ダ
イオード表示器に於て、前記突出ピンは遮光枠の
周縁部に設けてあると共に、その突出ピンのある
遮光枠の端縁にはプリント基板の表面に当接する
薄膜状の舌片が設けてあるので微小な表示器では
あるが光もれもなくまた精密機器に取りつけても
短絡事故等生じにくい。 As described above, the present invention includes a printed circuit board having a through hole, a light emitting diode placed and fixed on a conductive foil of the printed circuit board, and a printed circuit board that covers the light emitting diode and inserts a protruding pin into the through hole. In a light emitting diode display device equipped with a light-shielding frame made of resin fixed to Although it is a small display device, there is no light leakage, and short-circuit accidents are unlikely to occur even when attached to precision equipment.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の表示器の断面図、第２図は本考
案実施例の発光ダイオード表示器の分解斜視図で
ある。 １……プリント基板、２，２……導電箔、３，
３……透孔、４，４……発光ダイオード、６……
遮光枠、７，７……透孔、８，８……突出ピン、
１０……舌片。 FIG. 1 is a sectional view of a conventional display, and FIG. 2 is an exploded perspective view of a light emitting diode display according to an embodiment of the present invention. 1... Printed circuit board, 2, 2... Conductive foil, 3,
3...Through hole, 4,4...Light emitting diode, 6...
Shading frame, 7, 7... Through hole, 8, 8... Protruding pin,
10... Tongue piece.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 透孔を有したプリント基板と、そのプリント基
板の導電箔上に載置固着された発光ダイオード
と、その発光ダイオードを覆い、突出ピンを前記
透孔に挿入してプリント基板に固着された樹脂製
の遮光枠とを具備した発光ダイオード表示器に於
て、前記突出ピンは遮光枠の周縁部に設けてある
と共に、その突出ピンのある遮光枠の端縁にはプ
リント基板の表面に当接する薄膜状の舌片が設け
てある事を特徴とする発光ダイオード表示器。 A printed circuit board with a through hole, a light emitting diode placed and fixed on a conductive foil of the printed circuit board, and a resin-made circuit board that covers the light emitting diode and is fixed to the printed circuit board by inserting a protruding pin into the through hole. In the light emitting diode display device equipped with a light-shielding frame, the protruding pin is provided at the peripheral edge of the light-shielding frame, and the edge of the light-shielding frame where the protruding pin is located is provided with a thin film that contacts the surface of the printed circuit board. A light-emitting diode indicator characterized by having a tongue piece shaped like that.
JP10688882U 1982-07-13 1982-07-13 light emitting diode display Granted JPS5912182U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10688882U JPS5912182U (en) 1982-07-13 1982-07-13 light emitting diode display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10688882U JPS5912182U (en) 1982-07-13 1982-07-13 light emitting diode display

Publications (2)

Publication Number Publication Date
JPS5912182U JPS5912182U (en) 1984-01-25
JPS6350695Y2 true JPS6350695Y2 (en) 1988-12-27

Family

ID=30249953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10688882U Granted JPS5912182U (en) 1982-07-13 1982-07-13 light emitting diode display

Country Status (1)

Country Link
JP (1) JPS5912182U (en)

Also Published As

Publication number Publication date
JPS5912182U (en) 1984-01-25

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