JP2515546Y2 - LED array - Google Patents

LED array

Info

Publication number
JP2515546Y2
JP2515546Y2 JP7840592U JP7840592U JP2515546Y2 JP 2515546 Y2 JP2515546 Y2 JP 2515546Y2 JP 7840592 U JP7840592 U JP 7840592U JP 7840592 U JP7840592 U JP 7840592U JP 2515546 Y2 JP2515546 Y2 JP 2515546Y2
Authority
JP
Japan
Prior art keywords
lens case
circuit board
printed circuit
led
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP7840592U
Other languages
Japanese (ja)
Other versions
JPH0638268U (en
Inventor
正勝 飯沼
宏一 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP7840592U priority Critical patent/JP2515546Y2/en
Publication of JPH0638268U publication Critical patent/JPH0638268U/en
Application granted granted Critical
Publication of JP2515546Y2 publication Critical patent/JP2515546Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】この考案は原稿読み取り用光源及
び除電ランプ、ライン状表示器等に利用されるLEDア
レイに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED array used for a light source for reading a document, a charge eliminating lamp, a line-shaped display and the like.

【0002】[0002]

【従来の技術】従来のこの種LEDアレイは、図2のよ
うにプリント板1上にチップ抵抗4及び複数個のLED
2を搭載し、これにレンズケース3のボスピンをプリン
ト板1のボスピン挿入穴1aに挿入し、プリント板1の
裏側1bで熱カシメ6を行って固定した構造のものと、
図3のようにプリント板1上にチップ抵抗4及び複数個
のLED2を搭載し、これにランプハウス5のボスピン
をプリント板1に挿入し、プリント板1の裏側で熱カシ
メ6を行い、更にレンズカバー3aをランプハウス5へ
フック等により固定した構造のものがある。
2. Description of the Related Art A conventional LED array of this type includes a chip resistor 4 and a plurality of LEDs on a printed board 1 as shown in FIG.
2 is mounted, the boss pin of the lens case 3 is inserted into the boss pin insertion hole 1a of the printed board 1, and the back side 1b of the printed board 1 is heat-crimped 6 to be fixed.
As shown in FIG. 3, a chip resistor 4 and a plurality of LEDs 2 are mounted on a printed board 1, a boss pin of a lamp house 5 is inserted into the printed board 1, thermal caulking 6 is performed on the back side of the printed board 1, and further, There is a structure in which the lens cover 3a is fixed to the lamp house 5 by a hook or the like.

【0003】[0003]

【考案が解決しようとする課題】しかし、前記従来の技
術では、A.図2、3の構造の場合は共に、レンズケー
ス3及びランプハウス5のプリント板1への固定は、熱
カシメ6のため、工数がかかるという問題点がある。
However, in the above-mentioned conventional technique, the A. In both cases of the structures shown in FIGS. 2 and 3, fixing the lens case 3 and the lamp house 5 to the printed board 1 requires a lot of man-hours because of heat caulking 6.

【0004】B.同様に、プリント板1の板端のゴミ及
び半田付部、特にチップ抵抗4部分等のフラックス、半
田ボール等の発生による光学性能及び電気的不具合で問
題点がある。
B. Similarly, there is a problem in optical performance and electrical failure due to the generation of dust and soldering portions on the plate edge of the printed board 1, particularly flux such as the chip resistor 4 portion, solder balls and the like.

【0005】C.図2の構造の場合は、レンズケース3
の膨張・収縮を考慮してプリント板1のボスピン挿入穴
1aを長穴にする必要があり、更にレンズケース3は一
体成形のため、側面への光が逃げてしまい、LED2の
光を効率よく取り出せないという問題点がある。
C. In the case of the structure of FIG. 2, the lens case 3
It is necessary to make the boss pin insertion hole 1a of the printed board 1 an elongated hole in consideration of the expansion and contraction of the LED board. Further, since the lens case 3 is integrally molded, the light to the side surface escapes and the light of the LED 2 is efficiently emitted. There is a problem that it cannot be taken out.

【0006】D.図3の構造の場合は、ランプハウス5
とレンズカバー3aとは別部材で構成されているため、
金型に要する費用もかかり、従って部材のコストも高く
なるという問題点がある。
D. In the case of the structure of FIG. 3, the lamp house 5
Since the lens cover 3a and the lens cover 3a are separate members,
There is a problem that the cost required for the mold is high, and the cost of the member is also high.

【0007】そこで、本考案は上記従来の技術の問題点
に鑑み案出されたもので、LEDからの光を効率よく取
り出し、ゴミ、フラックス、半田ボールの落下を防ぎ、
また、コストを下げることが可能なLEDアレイの提供
を目的としている。
Therefore, the present invention has been devised in view of the above-mentioned problems of the prior art, and efficiently takes out light from the LED to prevent dust, flux, and solder balls from falling.
Moreover, it aims at providing the LED array which can reduce cost.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
に、本考案におけるLEDアレイにおいては、複数のL
EDチップ及び抵抗を並設したプリント基板と、一定角
度の不透光性反射枠、透明なレンズ及び、前記プリント
基板の短手方向の端部を裏側まで覆うフック式保持部と
よりなる一体成形レンズケースとで構成するものであ
る。
To achieve the above object, in the LED array of the present invention, a plurality of L's are provided.
Integrated molding consisting of a printed board on which an ED chip and a resistor are juxtaposed, a non-transmissive reflective frame at a certain angle, a transparent lens, and a hook-type holding portion that covers the short-side end of the printed board to the back side. It is composed of a lens case.

【0009】[0009]

【作用】レンズケースは、透明と白色の二色押し出し成
型としたため、長手方向寸法に制限がなく、いかなる寸
法にも対応でき、更に、取付けの際は、プリント基板の
上からレンズケースを押しつけ固定する。
[Function] Since the lens case is made of transparent and white two-color extrusion molding, there is no limitation in the longitudinal dimension and any size can be accommodated. Furthermore, when mounting, the lens case is pressed and fixed from above the printed circuit board. To do.

【0010】反射枠は白色とし、かつ角度を付けたた
め、LEDからの側方への光の逃げを防止し、効率よく
LEDの光を取出すことが可能となる。
Since the reflecting frame is white and has an angle, it is possible to prevent light from escaping to the side from the LED and to efficiently extract the light of the LED.

【0011】レンズケースの保持部は、プリント基板の
基板端裏側まで覆い被せる構造のため、プリント基板の
基板端のゴミの侵入、半田付部フラックス、半田ボール
の落下等が防止可能である。
Since the holding portion of the lens case covers the back side of the printed circuit board edge, it is possible to prevent dust from entering the printed circuit board edge, solder flux flux, and solder ball drop.

【0012】レンズケースは、反射枠を除いて全て透明
に形成したため、抵抗の半田状態、プリント基板上ヘ記
入した品名、ULマーク及びそのNO.等がプリント基
板取付け後に確認可能となる。
Since the lens case is made entirely transparent except for the reflection frame, the soldering state of the resistor, the product name written on the printed board, the UL mark and its NO. Etc. can be confirmed after mounting the printed circuit board.

【0013】また、レンズケースは、散乱剤を入れた材
料で作製したため、傷が目立たず、更に、散乱剤の効果
でLEDからの光が多少散乱されて光のバラツキを低減
可能である。
Further, since the lens case is made of a material containing a scattering agent, scratches are not conspicuous, and the light from the LED is scattered to some extent by the effect of the scattering agent, so that the variation of the light can be reduced.

【0014】[0014]

【実施例】実施例について図1を参照して説明すると、
(a)は本考案のLEDアレイ構造の正面図、(b)は
(a)のA−A線に沿う断面図で、プリント基板12上
には複数個のチップ状のLED11と、同様にチップ状
の電流制限抵抗14が搭載されている。
EXAMPLES Examples will be described with reference to FIG.
(A) is a front view of the LED array structure of the present invention, (b) is a sectional view taken along the line AA of (a), in which a plurality of chip-like LEDs 11 and chips are formed on a printed circuit board 12. The current limiting resistor 14 is mounted.

【0015】レンズケース13は図1(a)に示す長手
方向に同一形状であり、すなわち、断面形状が長手方向
全体に渡って同一で、必要な長さに応じて切断して使用
されるものである。また、レンズケース13はプリント
基板12を挟み込む構造のもので、該レンズケース13
にはレンズ16を設けると共に、一定角度の反射枠15
が設けられている。
The lens case 13 has the same shape in the longitudinal direction shown in FIG. 1A, that is, the cross-sectional shape is the same throughout the longitudinal direction, and the lens case 13 is cut and used according to the required length. Is. The lens case 13 has a structure in which the printed circuit board 12 is sandwiched between the lens case 13 and the lens case 13.
The lens 16 is provided on the reflection frame 15 at a constant angle.
Is provided.

【0016】この反射枠15は、LED11を囲むよう
に配置され、LED11からの光を逃げることなく効率
よくレンズ16を通して集光させるため、反射の良い白
色とされている。
The reflecting frame 15 is arranged so as to surround the LED 11 and is of a white color with good reflection so that the light from the LED 11 is efficiently condensed through the lens 16 without escaping.

【0017】また、前記反射枠15の下端はプリント基
板12を取付けたとき、該プリント基板12の上面と当
接可能な長さに形成されている。
Further, the lower end of the reflection frame 15 is formed to have a length capable of contacting the upper surface of the printed board 12 when the printed board 12 is attached.

【0018】レンズケース13の短手方向(図1(a)
参照)両端部には、プリント基板12の両端部を裏側ま
で被うフック式保持部17を一体に設け、かつ前記白色
の反射枠15以外は透明のポリカーポネイトを材料とす
る二色押し出し成型にされている。
The lateral direction of the lens case 13 (FIG. 1A)
Two-sided extrusion molding in which both ends of the printed circuit board 12 are integrally provided with hook-type holding portions 17 covering the both ends to the back side, and transparent polycarbonate except the white reflection frame 15 is used as a material. Has been

【0019】前記反射枠15以外のレンズ16及び保持
部17を透明としたのは、プリント基板12上の電流制
限抵抗14の半田状態及びプリント基板12上に表示さ
れた品名、ULマーク等のマーク、NO.等の表示がプ
リント基板12取付け後に容易に見えるようにするため
である。
The lens 16 and the holding portion 17 other than the reflection frame 15 are made transparent by the soldering state of the current limiting resistor 14 on the printed circuit board 12, the product name displayed on the printed circuit board 12, the mark such as UL mark, etc. , NO. This is to make it easy to see the indication such as "after the printed circuit board 12 is attached."

【0020】成型の際は、傷が目立たないように形成す
ると共に、散乱剤の効果でLED11からの光を多少散
乱させて光のバラツキを低減可能にするため、レンズケ
ース13の透明部分には、少量例えば、約5%程度の散
乱剤を入れた材料で作製するのがよい。
At the time of molding, the transparent part of the lens case 13 is formed on the transparent portion of the lens case 13 in order to form the scratches inconspicuously and to scatter the light from the LED 11 to some extent by the effect of the scattering agent to reduce the dispersion of the light. However, it is preferable to use a material containing a small amount, for example, about 5% of a scattering agent.

【0021】[0021]

【考案の効果】本考案は上述の通り構成されているの
で、次に記載する効果を奏する。A.レンズケースは、
透明と白色のポリカーポネイトの二色押し出し成型とし
て部材の一体化を図った押し出し材としたため、長手方
向寸法に制限がなく、いかなる寸法に対しても対応可能
である。
Since the present invention is constructed as described above, it has the following effects. A. The lens case is
Since it is an extruded material in which the members are integrated by two-color extrusion molding of transparent and white polycarbonate, there is no limitation in the longitudinal dimension and it is possible to cope with any dimension.

【0022】B.反射枠を白色とし、かつ角度を付けた
ため、LEDからの側方への光の逃げを防止し、効率よ
くLEDの光を取出すことができる。
B. Since the reflecting frame is white and has an angle, it is possible to prevent light from escaping to the side from the LED and efficiently extract the light of the LED.

【0023】C.レンズケースの保持部は、プリント基
板の基板端裏側まで覆い被せる構造としたため、プリン
ト基板の基板端のゴミの侵入、半田付部フラックス、半
田ボールの落下等を防止することができる。
C. Since the holding portion of the lens case is structured to cover the back side of the board end of the printed board, it is possible to prevent dust from entering the board end of the printed board, soldering part flux, and dropping of solder balls.

【0024】D.レンズケースは、反射枠を除いて全て
透明に形成したため、抵抗の半田状態、プリント基板上
ヘ記入した品名、ULマーク及びそのNO.等がプリン
ト基板取付け後に容易に確認できる。
D. Since the lens case was made transparent except for the reflection frame, the soldering state of the resistor, the product name written on the printed board, the UL mark and its NO. Etc. can be easily confirmed after mounting on the printed circuit board.

【0025】E.レンズケースは、従来のようにプリン
ト基板の基板端から挿入せず、プリント基板の上からレ
ンズケースを押しつけ固定するフック式に形成したた
め、組み立て作業が容易にできる。
E. Unlike the conventional case, the lens case is formed in a hook type in which the lens case is pressed and fixed from above the printed circuit board without being inserted from the substrate end of the printed circuit board, so that the assembling work can be facilitated.

【0026】F.押し出し成型のため、レンズケースの
透明部分には線状の傷が入るが、散乱剤を入れた材料で
作製されているため、傷が目立たず、製品の見栄えが向
上し、更に、散乱剤の効果でLEDからの光が多少散乱
されて光のバラツキを低減することができる。
F. Due to the extrusion molding, linear scratches are formed on the transparent part of the lens case, but since it is made of a material containing a scattering agent, the scratches are inconspicuous and the appearance of the product is improved. Due to the effect, the light from the LED is scattered to some extent and the variation in the light can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】 (a)は本考案のLEDアレイ構造の正面図
であり、(b)は(a)のA−A線に沿う断面図であ
る。
1A is a front view of an LED array structure of the present invention, and FIG. 1B is a sectional view taken along line AA of FIG.

【図2】 従来のLEDアレイの構造の断面図である。FIG. 2 is a cross-sectional view of the structure of a conventional LED array.

【図3】 従来の別構造のLEDアレイの構造の断面図
である。
FIG. 3 is a cross-sectional view of a structure of a conventional LED array having another structure.

【符号の説明】[Explanation of symbols]

11 LEDチップ 12 プリント基板 13 レンズケース 14 電流制限抵抗 15 反射枠 16 レンズ 17 保持部 11 LED Chip 12 Printed Circuit Board 13 Lens Case 14 Current Limiting Resistor 15 Reflective Frame 16 Lens 17 Holding Section

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of utility model registration request] 【請求項1】複数のLEDチップ及び抵抗を並設したプ
リント基板と、一定角度の不透光性反射枠、透明なレン
ズ及び、前記プリント基板の短手方向の端部を裏側まで
覆うフック式保持部とよりなる一体成形レンズケースと
で構成することを特徴とするLEDアレイ。
1. A printed circuit board having a plurality of LED chips and resistors arranged side by side, an opaque reflective frame at a constant angle, a transparent lens, and a hook type that covers the lateral end of the printed circuit board to the back side. An LED array comprising an integrally molded lens case including a holding portion.
JP7840592U 1992-10-19 1992-10-19 LED array Expired - Fee Related JP2515546Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7840592U JP2515546Y2 (en) 1992-10-19 1992-10-19 LED array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7840592U JP2515546Y2 (en) 1992-10-19 1992-10-19 LED array

Publications (2)

Publication Number Publication Date
JPH0638268U JPH0638268U (en) 1994-05-20
JP2515546Y2 true JP2515546Y2 (en) 1996-10-30

Family

ID=13661119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7840592U Expired - Fee Related JP2515546Y2 (en) 1992-10-19 1992-10-19 LED array

Country Status (1)

Country Link
JP (1) JP2515546Y2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005175188A (en) * 2003-12-11 2005-06-30 Toshiba Lighting & Technology Corp Light emitting device
JP2006245336A (en) * 2005-03-03 2006-09-14 Koito Mfg Co Ltd Light-emitting device
JP5513704B2 (en) * 2005-08-22 2014-06-04 株式会社朝日ラバー Lens body
JP5372399B2 (en) * 2008-04-01 2013-12-18 株式会社東日製作所 Torque tool and protective cover
JP2009253040A (en) * 2008-04-07 2009-10-29 Yazaki Corp Led illumination unit
JP5139915B2 (en) * 2008-08-06 2013-02-06 シチズン電子株式会社 Light emitting device
JP5536021B2 (en) * 2011-12-12 2014-07-02 株式会社朝日ラバー Lens body
CN103187504A (en) 2011-12-27 2013-07-03 展晶科技(深圳)有限公司 Package structure of light emitting diode
JP5964132B2 (en) 2012-05-23 2016-08-03 船井電機株式会社 Display device
JP2018022766A (en) * 2016-08-03 2018-02-08 ウシオ電機株式会社 Light emitting unit

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Publication number Publication date
JPH0638268U (en) 1994-05-20

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