JP2555390Y2 - Circuit board mounting structure - Google Patents

Circuit board mounting structure

Info

Publication number
JP2555390Y2
JP2555390Y2 JP8418991U JP8418991U JP2555390Y2 JP 2555390 Y2 JP2555390 Y2 JP 2555390Y2 JP 8418991 U JP8418991 U JP 8418991U JP 8418991 U JP8418991 U JP 8418991U JP 2555390 Y2 JP2555390 Y2 JP 2555390Y2
Authority
JP
Japan
Prior art keywords
circuit board
case
housing
cover
board mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP8418991U
Other languages
Japanese (ja)
Other versions
JPH0527619U (en
Inventor
俊弥 鷲尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Seiki Co Ltd
Original Assignee
Nippon Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Seiki Co Ltd filed Critical Nippon Seiki Co Ltd
Priority to JP8418991U priority Critical patent/JP2555390Y2/en
Publication of JPH0527619U publication Critical patent/JPH0527619U/en
Application granted granted Critical
Publication of JP2555390Y2 publication Critical patent/JP2555390Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案は、車両に装着される指示
計器、例えば速度計をはじめとする表示器をケース内部
に配設した装置に用いることのできる回路基板の取付け
構造に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a circuit board which can be used in a device in which an indicator mounted on a vehicle, for example, an indicator such as a speedometer is disposed inside a case. .

【0002】[0002]

【従来の技術】この種の装置は、例えば実開昭63−1
53589号,実開平1−97215号の各公報に示さ
れており、図5を参照して説明すると、ケース1の開口
側周面にはリブ状の第1の突出部2が外方へ突出形成さ
れているとともに、ケース1の内部には、表示器として
例えば速度計の計器本体3と、この計器本体3の底部に
電子部品4が実装された回路基板5とが収納配設されて
おり、この回路基板5は図示しない外部機器あるいは内
部機器である計器本体3と電気的接続されている。また
この場合、回路基板5はケース1の底部内壁面から所定
の高さ寸法をもって立設する略円柱状の基板取付け部6
に、ネジ7によりケース1内部に取付け固定されてお
り、基板取付け部6の高さ寸法により形成されたケース
1の底部と回路基板5との空間部8に電子部品4を位置
させるようにしている。
2. Description of the Related Art This type of apparatus is disclosed, for example, in
No. 53589 and Japanese Utility Model Laid-Open Publication No. 1-97215. Referring to FIG. 5, a rib-shaped first protrusion 2 protrudes outward from the peripheral surface of the case 1 on the opening side. In addition to being formed, an instrument body 3 of, for example, a speedometer as a display, and a circuit board 5 on which electronic components 4 are mounted on the bottom of the instrument body 3 are housed and arranged inside the case 1. The circuit board 5 is electrically connected to the instrument main body 3 which is an external device or an internal device (not shown). Further, in this case, the circuit board 5 has a substantially columnar board mounting portion 6 which stands up from the inner wall surface at the bottom of the case 1 with a predetermined height.
The electronic component 4 is attached and fixed to the inside of the case 1 by screws 7 so that the electronic component 4 is located in the space 8 between the bottom of the case 1 and the circuit board 5 formed by the height of the board mounting portion 6. I have.

【0003】また、ケース1の開口側には、この部分を
覆うカバー9が設けられており、このカバー9は前面側
に透過板等の透明材料からなる部材が装着されていると
ともに、カバー9のケース1との接合部分にはケース1
に形成された第1の突出部2に対応して、リブ状の第2
の突出部10が形成されており、この第2の突出部10とケ
ース1に形成された第1の突出部2とが図示しない所定
部分をネジなどの取付け部材により当接固定されて、ゴ
ミやホコリの侵入等を防止するようにして取付け部11が
設けられ、この取付け部11を介してハウジング12が構成
されている。
[0003] A cover 9 is provided on the opening side of the case 1 to cover this portion. The cover 9 has a transparent material such as a transmission plate mounted on the front side thereof. Case 1 is connected to the case 1
Corresponding to the first protruding portion 2 formed on the second
The second projecting portion 10 and the first projecting portion 2 formed on the case 1 are fixed to a predetermined portion (not shown) by an attachment member such as a screw, and the dust is formed. A mounting portion 11 is provided so as to prevent intrusion of dust and dust, and a housing 12 is formed via the mounting portion 11.

【0004】[0004]

【考案が解決しようとする課題】しかしながら、ケース
1の内部に回路基板5を取付ける構成だと、回路基板5
を取付けるために電子部品4を設ける高さ空間が必要と
なり、したがってこの空間部8の分、図5中、ハウジン
グ12の縦方向の厚さ寸法が大きくなってしまうという不
具合を有している。
However, if the circuit board 5 is mounted inside the case 1, the circuit board 5
In order to mount the electronic component 4, a space for providing the electronic component 4 is required. Therefore, there is a problem that the thickness of the housing 12 in the vertical direction in FIG.

【0005】本考案は、上記の問題を解決するもので、
その目的とするところは、ハウジングの余剰スペースを
利用して回路基板を取付けることにより、ハウジングの
薄型化が実現可能な回路基板の取付け構造にある。
[0005] The present invention solves the above problem.
An object of the present invention is to provide a circuit board mounting structure capable of realizing a thinner housing by mounting a circuit board using an extra space in the housing.

【0006】[0006]

【作用】ハウジングの余剰スペースを利用して回路基板
を取付けることにより、回路基板専用スペ−スを設けな
くとも良い。
The circuit board is mounted by utilizing the extra space of the housing, so that it is not necessary to provide a space dedicated to the circuit board.

【0007】[0007]

【実施例】以下、添付図面に基づいて本考案の実施例を
説明するが、上記従来例と同一もしくは相当部分には同
一符号を付してその詳しい説明は省略する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings.

【0008】図1と図2は本考案の第1の実施例を示し
ており、本実施例ではハウジング12を構成するケース1
およびカバー9との取付け部11に形成された各突出部
2,10と所定の間隔、この場合回路基板5の端部をケー
ス1およびカバー9に取付け固定可能で、なおかつ電子
部品4を収納可能な間隔をもって、ケース1およびカバ
ー9の外壁面に略円柱状の基板取付け部6a,6bとが
それぞれ立設形成されている。
FIGS. 1 and 2 show a first embodiment of the present invention. In this embodiment, a case 1 constituting a housing 12 is shown.
And a predetermined distance from each protruding portion 2, 10 formed on the mounting portion 11 with the cover 9. In this case, the end of the circuit board 5 can be mounted and fixed to the case 1 and the cover 9, and the electronic components 4 can be stored. Substantially columnar substrate mounting portions 6a and 6b are formed upright on the outer wall surfaces of the case 1 and the cover 9 at appropriate intervals.

【0009】回路基板5は、その中央部分を各突出部
2,10に当接支持され、回路基板5に外力が加わっても
各突出部2,10によって回路基板5を受けることが可能
としているとともに、両端部分を各基板取付け部6a,
6bとに取付け孔5a,5bを介してネジ7によって取
付け固定されており、基板取付け部6aと第1の突出部
2および、基板取付け部6bと第2の突出部10とによっ
て形成されたハウジング12外壁面の余剰スペースを空間
部8aとして設け、この空間部8aに回路基板5に実装
された電子部品4を収納している。
The circuit board 5 is supported at its center by the protruding portions 2 and 10 so that the protruding portions 2 and 10 can receive the circuit board 5 even when an external force is applied to the circuit board 5. At the same time, the both end portions are connected to the respective substrate mounting portions 6a,
And a housing 6 formed by the board mounting portion 6a and the first protruding portion 2 and the board mounting portion 6b and the second protruding portion 10 via the mounting holes 5a and 5b. An extra space on the outer wall 12 is provided as a space 8a, and the electronic component 4 mounted on the circuit board 5 is accommodated in the space 8a.

【0010】これにより、ケース1およびカバー9に突
出形成された各突出部2,10の高さ寸法分と各突出部
2,10と各基板取付け部6a,6bとの幅寸法ぶんを余
剰スペースとして空間部8aを形成し、この空間部8a
を電子部品4の収納に利用してハウジング12の薄型化を
実現している。
As a result, the extra space corresponding to the height of each of the projecting portions 2 and 10 formed on the case 1 and the cover 9 and the width of each of the projecting portions 2 and 10 and each of the board mounting portions 6a and 6b are provided. The space 8a is formed as
The housing 12 is made thinner by utilizing the electronic component 4 for storage.

【0011】なお、本実施例では図示しないが内部機器
である計器本体3と回路基板5との電気的接続はフラッ
トケーブルあるいは電気コード等を用いて行なえば良
い。
Although not shown in this embodiment, the electrical connection between the instrument body 3 as an internal device and the circuit board 5 may be made using a flat cable or an electric cord.

【0012】また、本実施例では図1と図2中、ハウジ
ング12の上部外壁面に回路基板5を取付けているが、回
路基板5を取付ける位置は、ハウジング12の各突出部
2,10の高さ寸法ぶんを電子部品4の収納に利用可能で
あれば適宜設定が可能であり、例えば同図中、ハウジン
グ12の下部外壁面あるいは側部外壁面に取付けても良い
とともに、各突出部2,10のいずれか一方に取付け孔5
aあるいは5bを形成して、この部分を基板取付け部6
と兼用して設けても良い。
In this embodiment, the circuit board 5 is attached to the upper outer wall surface of the housing 12 in FIGS. 1 and 2. The height can be appropriately set as long as it can be used for storing the electronic components 4. For example, in FIG. Mounting hole 5 in either one of
a or 5b, and this portion is
May also be provided.

【0013】さらに、本実施例では各突出部2,10を回
路基板5と当接させて、回路基板5に外力が加わった場
合、回路基板5を受けることが可能構成しているが、回
路基板5と各突出部2,10とに適宜間隔をもたせても良
い。
Further, in this embodiment, each of the projecting portions 2 and 10 is brought into contact with the circuit board 5 so that the circuit board 5 can receive the circuit board 5 when an external force is applied. The substrate 5 and the protruding portions 2 and 10 may be provided with an appropriate space.

【0014】図3は本考案の第2の実施例を示してお
り、本実施例ではハウジング12を構成するケース1とカ
バー9との取付け部11の変形例を示しているが、前記第
1の実施例と同一もしくは相当部分には同一の符号を付
してその説明は省略する。
FIG. 3 shows a second embodiment of the present invention. In this embodiment, a modified example of the mounting portion 11 between the case 1 and the cover 9 constituting the housing 12 is shown. The same reference numerals are given to the same or corresponding portions as those of the embodiment, and the description is omitted.

【0015】同図では、ケース1に設けられる第1の突
出部2の先端形状をその断面形状が略L字状になるよう
延設してL字状部2aを形成し、カバー9に設けられる
第2の突出部10の高さ寸法を第1の突出部2の高さ寸法
に比してやや低く形成し、この第2の突出部10の先端部
と見返し部材13の先端部とをL字状部2aに当接させる
とともに、第1の突出部2と第2の突出部10とによって
見返し部材13を狭みつけて図示しないネジ等により所定
部分を見返し部材13とともに固定しており、このような
場合であっても前記第1の実施例と同様に余剰スペース
を活用してハウジング11の薄型化が実現できる。
In FIG. 1, an L-shaped portion 2 a is formed by extending a tip end of a first protruding portion 2 provided on a case 1 so that a cross-sectional shape thereof is substantially L-shaped, and provided on a cover 9. The height of the second protrusion 10 to be formed is slightly lower than the height of the first protrusion 2, and the tip of the second protrusion 10 and the tip of the return member 13 are L The first protruding portion 2 and the second protruding portion 10 narrow the facing member 13 with the first protruding portion 2 and the second protruding portion 10 and fix the predetermined portion together with the facing member 13 with a screw (not shown). Even in such a case, the thickness of the housing 11 can be reduced by utilizing the extra space as in the first embodiment.

【0016】なお、第1の突出部2に形成したL字状部
2aは、第2の突出部10に形成してもよく、あるいはL
字状部2aを形成せず、第1の突出部2と第2の突出部
10と見返し部材13とのそれぞれの先端部端面を同一平面
に形成してもよく、ケース1とカバー9との取付け部11
において、ケース1とカバー9とのいずれか一方にハウ
ジング12から外方へ突出する部分、すなわち第1の突出
部2あるいは第2の突出部10のいずれかが形成され、こ
の突出する部分の高さ寸法を利用して電子部品4を収納
する余剰スペース、すなわち空間部8aを形成していれ
ば適宜適定が可能である。
The L-shaped portion 2a formed on the first protrusion 2 may be formed on the second protrusion 10,
The first protrusion 2 and the second protrusion are formed without forming the character-shaped portion 2a.
The end faces of the distal ends of the return member 10 and the return member 13 may be formed on the same plane.
In either case, a portion protruding outward from the housing 12, that is, either the first protruding portion 2 or the second protruding portion 10 is formed on one of the case 1 and the cover 9, and the height of the protruding portion is increased. If the extra space for accommodating the electronic component 4, that is, the space portion 8a is formed by using the size, it can be appropriately determined.

【0017】図4は本考案の第3の実施例を示してお
り、本実施例では回路基板5を外部から覆う保護カバー
14を設けた場合を示しており、前記第1,第2の実施例
と同一態様部分には同一の符号を付して重複する部分の
説明は省略する。
FIG. 4 shows a third embodiment of the present invention. In this embodiment, a protective cover for covering the circuit board 5 from the outside is provided.
In this case, the same reference numerals are given to the same parts as in the first and second embodiments, and the description of the overlapping parts will be omitted.

【0018】同図において、基板取付け部6a,6bに
は、回路基板5および保護カバー14の端部を位置決め可
能に凸形状の嵌合突部15が形成されており、この嵌合突
部15に回路基板5に形成した挿通孔16が挿通されている
とともに、嵌合突部15の先端部分が保護カバー14に形成
された位置決め用の嵌合凹部17に嵌入され、ネジ孔18を
介して基板取付け部6a,6bに回路基板5と保護カバ
ー14とが一体的にネジ7によって取付け固定されてい
る。
In FIG. 1, the board mounting portions 6a and 6b are formed with convex fitting projections 15 for positioning the ends of the circuit board 5 and the protective cover 14, and the fitting projections 15 are provided. The insertion hole 16 formed in the circuit board 5 is inserted through the hole, and the tip of the fitting projection 15 is fitted into a positioning fitting recess 17 formed in the protective cover 14, and is inserted through a screw hole 18. The circuit board 5 and the protective cover 14 are integrally fixed to the board attaching portions 6a and 6b by screws 7.

【0019】また、本実施例では保護カバー14を取付け
た際、保護カバー14の固定によって回路基板5のハンダ
付け部分を傷めることがないよう、嵌合凹部17の周囲に
肉厚部19を形成して保護カバー14と回路基板5との間に
クリアランスを設けるようにしている。
In this embodiment, when the protective cover 14 is attached, a thick portion 19 is formed around the fitting recess 17 so that the soldered portion of the circuit board 5 is not damaged by fixing the protective cover 14. Thus, a clearance is provided between the protective cover 14 and the circuit board 5.

【0020】これにより、前記第1,第2実施例と同様
の効果を得ることができるとともに、保護カバー14を設
けたことで、回路基板5を外部に露出することが避けら
れ、ケース12の薄型化に加え回路基板5を保護すること
ができる。
As a result, the same effects as those of the first and second embodiments can be obtained, and the provision of the protective cover 14 prevents the circuit board 5 from being exposed to the outside. In addition to reducing the thickness, the circuit board 5 can be protected.

【0021】なお、これまで述べてきた実施例において
は、ケース1とカバー9の取付け部11に本考案を適用す
る場合を示してきたが、本考案はカバー9と、このカバ
ー9に装着される透過板等の透明材料からなる部材との
取付け部分にも適用が可能である。
In the embodiments described so far, the case where the present invention is applied to the case 1 and the mounting portion 11 of the cover 9 has been described. In the present invention, the present invention is applied to the cover 9 and the cover 9. The present invention can also be applied to a mounting portion with a member made of a transparent material such as a transmission plate.

【0022】[0022]

【考案の効果】本考案は表示器が内部に設けられたケー
スと、このケースを覆うカバーとによってハウジングを
形成し、前記ケースと前記カバーとの取付け部の少なく
ともいずれか一方には外方へ突き出し形成する突出部を
形成し、この突出部を介して前記ケースに前記カバーを
装着し、前記ハウジングに電子部品が実装された回路基
板を取付けるようにした回路基板の取付け構造におい
て、前記ハウジングには前記突出部と所定の間隔をもっ
て基板取付け部を形成し、前記基板取付け部と前記突出
部とによって形成された前記ハウジングの外壁面と前記
回路基板との空間部に前記電子部品を収納可能に回路基
板を取付けたから、前記ハウジングの余剰スペースを利
用して回路基板を取付けることにより前記ハウジングの
薄型化を実現できる。
According to the present invention, a housing is formed by a case in which an indicator is provided inside and a cover which covers the case, and at least one of a mounting portion of the case and the cover is outwardly provided. In a circuit board mounting structure in which a projecting portion for projecting is formed, the cover is mounted on the case via the projecting portion, and a circuit board on which electronic components are mounted is mounted on the housing. Forms a board mounting portion at a predetermined distance from the projecting portion, and allows the electronic component to be stored in a space between the outer wall surface of the housing formed by the board mounting portion and the projecting portion and the circuit board. Since the circuit board is attached, the thickness of the housing can be reduced by attaching the circuit board using the excess space of the housing.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案の第1の実施例を示す断面図である。FIG. 1 is a sectional view showing a first embodiment of the present invention.

【図2】図1の分解斜視図である。FIG. 2 is an exploded perspective view of FIG.

【図3】本考案の第2の実施例を示す断面図である。FIG. 3 is a sectional view showing a second embodiment of the present invention.

【図4】本考案の第3の実施例を示す要部断面図であ
る。
FIG. 4 is a sectional view of a main part showing a third embodiment of the present invention.

【図5】従来例を示す断面図である。FIG. 5 is a sectional view showing a conventional example.

【符号の説明】[Explanation of symbols]

1 ケース 2 第1の突出部 2a L字状部 3 計器本体 4 電子部品 5 回路基板 5a,5b 取付け穴 6a,6b 基板取付け部 7 ネジ 8a 空間部 9 カバー 10 第2の突出部 11 取付け部 12 ハウジング 13 見返し部材 14 保護カバー 15 嵌合突部 16 挿通孔 17 嵌合凹部 18 ネジ孔 19 肉厚部 DESCRIPTION OF SYMBOLS 1 Case 2 1st projection part 2a L-shaped part 3 Instrument main body 4 Electronic component 5 Circuit board 5a, 5b Mounting hole 6a, 6b Board mounting part 7 Screw 8a Space part 9 Cover 10 Second protrusion 11 Mounting part 12 Housing 13 Returning member 14 Protective cover 15 Fitting protrusion 16 Insertion hole 17 Fitting recess 18 Screw hole 19 Thick part

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】 表示器が内部に設けられたケースと、こ
のケースを覆うカバーとによってハウジングを形成し、
前記ケースと前記カバーとの取付け部の少なくともいず
れか一方には外方へ突き出し形成する突出部を形成し、
この突出部を介して前記ケースに前記カバーを装着し、
前記ハウジングに電子部品が実装された回路基板を取付
けるようにした回路基板の取付け構造において、前記ハ
ウジングには前記突出部と所定の間隔をもって基板取付
け部を形成し、この基板取付け部と前記突出部とによっ
て形成された前記ハウジングの外壁面と前記回路基板と
の空間部に前記電子部品を収納可能に設けたことを特徴
とする回路基板の取付け構造。
A housing is formed by a case in which an indicator is provided and a cover that covers the case.
At least one of the mounting portion of the case and the cover is formed with a protrusion that protrudes outward,
Attach the cover to the case via this protrusion,
In a circuit board mounting structure in which a circuit board on which electronic components are mounted is mounted on the housing, a board mounting portion is formed on the housing at a predetermined distance from the projecting portion, and the board mounting portion and the projecting portion are formed. Wherein the electronic component is provided so as to be accommodated in a space between the outer wall surface of the housing formed by the method and the circuit board.
JP8418991U 1991-09-19 1991-09-19 Circuit board mounting structure Expired - Fee Related JP2555390Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8418991U JP2555390Y2 (en) 1991-09-19 1991-09-19 Circuit board mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8418991U JP2555390Y2 (en) 1991-09-19 1991-09-19 Circuit board mounting structure

Publications (2)

Publication Number Publication Date
JPH0527619U JPH0527619U (en) 1993-04-09
JP2555390Y2 true JP2555390Y2 (en) 1997-11-19

Family

ID=13823530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8418991U Expired - Fee Related JP2555390Y2 (en) 1991-09-19 1991-09-19 Circuit board mounting structure

Country Status (1)

Country Link
JP (1) JP2555390Y2 (en)

Also Published As

Publication number Publication date
JPH0527619U (en) 1993-04-09

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