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JPS6350066A - Power semiconductor device and manufacture thereof - Google Patents

Power semiconductor device and manufacture thereof

Info

Publication number
JPS6350066A
JPS6350066A JP19426786A JP19426786A JPS6350066A JP S6350066 A JPS6350066 A JP S6350066A JP 19426786 A JP19426786 A JP 19426786A JP 19426786 A JP19426786 A JP 19426786A JP S6350066 A JPS6350066 A JP S6350066A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
groove
circular
semiconductor
chip
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19426786A
Inventor
Masaaki Sadamori
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE:To prevent damage along a mesa groove of a large-diameter semiconductor wafer by forming a device by a circular thermal compensating plate with a ring-shaped groove and a circular chip with the mesa groove oppositely faced to the ring-shaped groove. CONSTITUTION:A cylindrical diamond blade 18 is brought into contact with the outer circumference of a circular glass passiviation region 13 in a large- diameter semiconductor wafer 1 and turned at high speed, a circular chip 14 is punched, aluminum 10 is evaporated onto the main surface of a molybdenum plate 17 to which a circumferential groove 17a is cut previously. and the circular chip 14 is alloy-fixed. Aluminum is each evaporated thickly in an NE region 12 and a P<+> region 3 in the chip 14, and a cathode 15 and a gate electrode 16 are shaped respectively, thus acquiring a power semiconductor device. Accordingly, a solder material 10 flows into the circular groove 17a formed to the thermal compensating plate 17, and the region 13 with a mesa groove is not broken.
JP19426786A 1986-08-19 1986-08-19 Power semiconductor device and manufacture thereof Pending JPS6350066A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19426786A JPS6350066A (en) 1986-08-19 1986-08-19 Power semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19426786A JPS6350066A (en) 1986-08-19 1986-08-19 Power semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6350066A true true JPS6350066A (en) 1988-03-02

Family

ID=16321782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19426786A Pending JPS6350066A (en) 1986-08-19 1986-08-19 Power semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6350066A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7776423B2 (en) 2003-09-29 2010-08-17 Dai Nippon Printing Co., Ltd. Decorating sheet, decorated molded product, and in-injection-mold decorating method
US7968174B2 (en) 2004-09-30 2011-06-28 Dai Nippon Printing Co., Ltd. Decorative material having low-gloss pattern ink layer formed on part of a substrate and a surface protective layer on the pattern in K layer, and decorative plate including such material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7776423B2 (en) 2003-09-29 2010-08-17 Dai Nippon Printing Co., Ltd. Decorating sheet, decorated molded product, and in-injection-mold decorating method
US7968174B2 (en) 2004-09-30 2011-06-28 Dai Nippon Printing Co., Ltd. Decorative material having low-gloss pattern ink layer formed on part of a substrate and a surface protective layer on the pattern in K layer, and decorative plate including such material
KR101165111B1 (en) 2004-09-30 2012-07-12 다이니폰 인사츠 가부시키가이샤 Dressed lumber

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