JPS634947B2 - - Google Patents
Info
- Publication number
- JPS634947B2 JPS634947B2 JP57059084A JP5908482A JPS634947B2 JP S634947 B2 JPS634947 B2 JP S634947B2 JP 57059084 A JP57059084 A JP 57059084A JP 5908482 A JP5908482 A JP 5908482A JP S634947 B2 JPS634947 B2 JP S634947B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- brazing
- container
- leads
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5908482A JPS58176960A (ja) | 1982-04-09 | 1982-04-09 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5908482A JPS58176960A (ja) | 1982-04-09 | 1982-04-09 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58176960A JPS58176960A (ja) | 1983-10-17 |
| JPS634947B2 true JPS634947B2 (cg-RX-API-DMAC7.html) | 1988-02-01 |
Family
ID=13103118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5908482A Granted JPS58176960A (ja) | 1982-04-09 | 1982-04-09 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58176960A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63305541A (ja) * | 1987-06-05 | 1988-12-13 | Olympus Optical Co Ltd | 半導体パッケ−ジのリ−ド取付方法 |
| JP2608287B2 (ja) * | 1987-06-12 | 1997-05-07 | イビデン 株式会社 | 黒鉛製治具 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4945109B2 (cg-RX-API-DMAC7.html) * | 1971-11-18 | 1974-12-02 |
-
1982
- 1982-04-09 JP JP5908482A patent/JPS58176960A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58176960A (ja) | 1983-10-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5016084A (en) | Semiconductor device | |
| JPS61125062A (ja) | ピン取付け方法およびピン取付け装置 | |
| JPS634947B2 (cg-RX-API-DMAC7.html) | ||
| JP2581592B2 (ja) | フレキシブルピンキャリア及びそれを使用した半導体装置 | |
| JP2002033418A (ja) | 半導体装置およびその製造方法 | |
| JP3261987B2 (ja) | Loc用リードフレームおよびそれを利用した半導体装置 | |
| JP4686893B2 (ja) | ワイヤボンダ及びボンディング方法 | |
| JPH0878599A (ja) | 集積回路パッケージ及びその製造方法 | |
| JPS602777B2 (ja) | 電子装置用リ−ドフレ−ム | |
| JPH0822469B2 (ja) | アルミニウム−鉄・ニツケル合金−半田クラツド材およびこれを用いたic装置の製造方法 | |
| JPH0344414B2 (cg-RX-API-DMAC7.html) | ||
| JPS5854499B2 (ja) | 半導体装置の製造方法 | |
| JPH0747868Y2 (ja) | チップボンディングまたはワイヤボンディング工程におけるリードフレーム押さえ | |
| JPH02858B2 (cg-RX-API-DMAC7.html) | ||
| KR800000215B1 (ko) | 부분 도금법 | |
| JPS58142719A (ja) | ガバナ接片の製造方法 | |
| JP2567104Y2 (ja) | 半導体素子収納用パッケージ | |
| JPH11329893A (ja) | 金属端子付き積層セラミックコンデンサ及びその製造方法 | |
| JPH083018Y2 (ja) | 半導体パッケージ用連結型リードフレーム | |
| JPS5919397A (ja) | アルミニウム製ヒ−トシンク | |
| KR100294912B1 (ko) | 유에프피엘패키지및그제조방법 | |
| JPH01305550A (ja) | 配列リードピン用支持体 | |
| JPH0888250A (ja) | Tabテープおよびtabインナーリードの接合方法 | |
| JPH0766248A (ja) | 電子部品の熱圧着装置 | |
| JPH06232218A (ja) | フィルムキャリアおよびそのフィルムキャリアを用いた半導体装置の製造方法 |