JPS6349298U - - Google Patents

Info

Publication number
JPS6349298U
JPS6349298U JP14300586U JP14300586U JPS6349298U JP S6349298 U JPS6349298 U JP S6349298U JP 14300586 U JP14300586 U JP 14300586U JP 14300586 U JP14300586 U JP 14300586U JP S6349298 U JPS6349298 U JP S6349298U
Authority
JP
Japan
Prior art keywords
circuit width
wiring board
flexible wiring
less
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14300586U
Other languages
Japanese (ja)
Other versions
JPH0648953Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986143005U priority Critical patent/JPH0648953Y2/en
Publication of JPS6349298U publication Critical patent/JPS6349298U/ja
Application granted granted Critical
Publication of JPH0648953Y2 publication Critical patent/JPH0648953Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案実施例を断面で示す。第２図
は、実施例の外観を示す。第３図は、従来のフレ
キシブル配線板の断面を示す。 １…ベース絶縁フイルム、２…ベース接着剤、
３…信号回路、４…アース回路、５…シールド層
、６…カバーレイフイルム、７…カバーレイ接着
剤、８…接着剤層、９…開孔。 FIG. 1 shows an embodiment of the invention in cross section. FIG. 2 shows the appearance of the embodiment. FIG. 3 shows a cross section of a conventional flexible wiring board. 1...Base insulation film, 2...Base adhesive,
3... Signal circuit, 4... Earth circuit, 5... Shield layer, 6... Coverlay film, 7... Coverlay adhesive, 8... Adhesive layer, 9... Opening.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] シールド付フレキシブル配線板において、信号
回路巾が０．３mm以下で、回路とシールド層まで
の距離を回路巾の１２以上離して一定距離で設け
、シールド層の開孔面積が３０〜６０％で且つ開
孔部の間隔が回路巾の３倍以下の密度で形成した
ことを特徴とするシールド付フレキシブル配線板
。 In a shielded flexible wiring board, the signal circuit width is 0.3 mm or less, the distance between the circuit and the shield layer is set at a constant distance of 12 or more of the circuit width, and the opening area of the shield layer is 30 to 60%, and A flexible wiring board with a shield, characterized in that the spacing between the openings is formed at a density of three times or less the circuit width.
JP1986143005U 1986-09-18 1986-09-18 Flexible wiring board with shield Expired - Lifetime JPH0648953Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986143005U JPH0648953Y2 (en) 1986-09-18 1986-09-18 Flexible wiring board with shield

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986143005U JPH0648953Y2 (en) 1986-09-18 1986-09-18 Flexible wiring board with shield

Publications (2)

Publication Number Publication Date
JPS6349298U true JPS6349298U (en) 1988-04-04
JPH0648953Y2 JPH0648953Y2 (en) 1994-12-12

Family

ID=31052281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986143005U Expired - Lifetime JPH0648953Y2 (en) 1986-09-18 1986-09-18 Flexible wiring board with shield

Country Status (1)

Country Link
JP (1) JPH0648953Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02272398A (en) * 1989-04-14 1990-11-07 Toshiba Corp Waste liquid storage device
JP2008193090A (en) * 2007-02-02 2008-08-21 Samsung Electronics Co Ltd Flexible circuit film and indicating device having the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53127167U (en) * 1977-03-17 1978-10-09
JPS59121855U (en) * 1983-02-02 1984-08-16 松下電器産業株式会社 flexible printed wiring board
JPS60121698U (en) * 1984-01-26 1985-08-16 昭和アルミニウム株式会社 electromagnetic shielding material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53127167U (en) * 1977-03-17 1978-10-09
JPS59121855U (en) * 1983-02-02 1984-08-16 松下電器産業株式会社 flexible printed wiring board
JPS60121698U (en) * 1984-01-26 1985-08-16 昭和アルミニウム株式会社 electromagnetic shielding material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02272398A (en) * 1989-04-14 1990-11-07 Toshiba Corp Waste liquid storage device
JP2008193090A (en) * 2007-02-02 2008-08-21 Samsung Electronics Co Ltd Flexible circuit film and indicating device having the same

Also Published As

Publication number Publication date
JPH0648953Y2 (en) 1994-12-12

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