JPS6348690Y2 - - Google Patents
Info
- Publication number
- JPS6348690Y2 JPS6348690Y2 JP505185U JP505185U JPS6348690Y2 JP S6348690 Y2 JPS6348690 Y2 JP S6348690Y2 JP 505185 U JP505185 U JP 505185U JP 505185 U JP505185 U JP 505185U JP S6348690 Y2 JPS6348690 Y2 JP S6348690Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- package
- jig
- pin
- liquid injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 66
- 239000007788 liquid Substances 0.000 claims description 23
- 238000002347 injection Methods 0.000 claims description 16
- 239000007924 injection Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP505185U JPS6348690Y2 (enExample) | 1985-01-18 | 1985-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP505185U JPS6348690Y2 (enExample) | 1985-01-18 | 1985-01-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61120765U JPS61120765U (enExample) | 1986-07-30 |
| JPS6348690Y2 true JPS6348690Y2 (enExample) | 1988-12-14 |
Family
ID=30481210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP505185U Expired JPS6348690Y2 (enExample) | 1985-01-18 | 1985-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6348690Y2 (enExample) |
-
1985
- 1985-01-18 JP JP505185U patent/JPS6348690Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61120765U (enExample) | 1986-07-30 |
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