JPS6348690Y2 - - Google Patents
Info
- Publication number
- JPS6348690Y2 JPS6348690Y2 JP505185U JP505185U JPS6348690Y2 JP S6348690 Y2 JPS6348690 Y2 JP S6348690Y2 JP 505185 U JP505185 U JP 505185U JP 505185 U JP505185 U JP 505185U JP S6348690 Y2 JPS6348690 Y2 JP S6348690Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- package
- jig
- pin
- liquid injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 66
- 239000007788 liquid Substances 0.000 claims description 23
- 238000002347 injection Methods 0.000 claims description 16
- 239000007924 injection Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP505185U JPS6348690Y2 (enrdf_load_stackoverflow) | 1985-01-18 | 1985-01-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP505185U JPS6348690Y2 (enrdf_load_stackoverflow) | 1985-01-18 | 1985-01-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61120765U JPS61120765U (enrdf_load_stackoverflow) | 1986-07-30 |
JPS6348690Y2 true JPS6348690Y2 (enrdf_load_stackoverflow) | 1988-12-14 |
Family
ID=30481210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP505185U Expired JPS6348690Y2 (enrdf_load_stackoverflow) | 1985-01-18 | 1985-01-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6348690Y2 (enrdf_load_stackoverflow) |
-
1985
- 1985-01-18 JP JP505185U patent/JPS6348690Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS61120765U (enrdf_load_stackoverflow) | 1986-07-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69523860T2 (de) | Prüfkarte für Hochtemperaturverwendung | |
EP0667962B1 (en) | Printed circuit board testing device with foil adapter | |
JPS6370174A (ja) | 回路基板の試験装置 | |
DE19960112A1 (de) | Testvorrichtung zum Testen von Rückwandplatinen bzw. bestückten Leiterplatten | |
EP0012319A1 (de) | Verfahren und Schablone zum Befestigen von Bauelementen mit flächigen Anschlusskontakten auf Leiterplatten | |
EP0335291A3 (de) | Verfahren und Vorrichtung zum Plattieren von Pin-Grid-Arrays | |
US4870356A (en) | Multi-component test fixture | |
US5580432A (en) | Jig for electroplating lead pins of an integrated circuit package | |
JPS6348690Y2 (enrdf_load_stackoverflow) | ||
DE10002639A1 (de) | Bandträger für einen BGA und eine Halbleitervorrichtung, die diesen benutzt | |
JP4209696B2 (ja) | 電気的接続装置 | |
US5819410A (en) | Method for manufacturing a pin and pipe assembly for a bare chip testing socket | |
JP2019214765A (ja) | 配線基板の製造方法およびこれに用いるメッキ用治具 | |
US3701726A (en) | Support assembly for electrolytic deposition on contact element | |
JP2790074B2 (ja) | プローブ装置 | |
JPH0242912B2 (enrdf_load_stackoverflow) | ||
JPS6348691Y2 (enrdf_load_stackoverflow) | ||
EP0202291A1 (en) | PROTECTIVE COVER OF AN ELECTRICAL DEVICE. | |
US6527935B2 (en) | Process for electroplating pins of an integrated circuit package | |
JP3000084B2 (ja) | メッキ用導通治具とこれを用いた配線基板の製造方法 | |
ATE39805T1 (de) | Vorrichtung zum loeten eines elements an eine leiterplatte. | |
JP3501934B2 (ja) | メッキ用導通治具 | |
JPS58155374A (ja) | プリント基板のテスト装置 | |
JPS6021395A (ja) | 小径の筒状内面を有するメツキ物のメツキ方法 | |
DE3824314A1 (de) | Verbindungselement oder fassung nach dem ssc-prinzip |