JPH0242912B2 - - Google Patents
Info
- Publication number
- JPH0242912B2 JPH0242912B2 JP28426286A JP28426286A JPH0242912B2 JP H0242912 B2 JPH0242912 B2 JP H0242912B2 JP 28426286 A JP28426286 A JP 28426286A JP 28426286 A JP28426286 A JP 28426286A JP H0242912 B2 JPH0242912 B2 JP H0242912B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- package
- support plate
- ceramic package
- plating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 75
- 239000007788 liquid Substances 0.000 claims description 38
- 239000000919 ceramic Substances 0.000 claims description 32
- 238000005507 spraying Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 description 11
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28426286A JPS63140099A (ja) | 1986-12-01 | 1986-12-01 | めつき処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28426286A JPS63140099A (ja) | 1986-12-01 | 1986-12-01 | めつき処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63140099A JPS63140099A (ja) | 1988-06-11 |
| JPH0242912B2 true JPH0242912B2 (enrdf_load_stackoverflow) | 1990-09-26 |
Family
ID=17676248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28426286A Granted JPS63140099A (ja) | 1986-12-01 | 1986-12-01 | めつき処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63140099A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0005886D0 (en) * | 2000-03-13 | 2000-05-03 | Lowe John M | Elector-plating apparatus and method |
| CN102953100B (zh) * | 2012-11-19 | 2016-01-06 | 江苏高博智融科技有限公司 | 一种电镀压接模具 |
-
1986
- 1986-12-01 JP JP28426286A patent/JPS63140099A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63140099A (ja) | 1988-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6887113B1 (en) | Contact element for use in electroplating | |
| US5308645A (en) | Method and apparatus for through hole substrate printing | |
| JPS6023317Y2 (ja) | 部分メツキ用電極 | |
| CN201212065Y (zh) | 集成电路引线框架片式电镀夹具 | |
| KR20220043849A (ko) | 접점 구조, 기판 홀더, 도금 장치 및 기판에 급전하는 방법 | |
| EP0107931B1 (en) | Selective plating | |
| JPH0242912B2 (enrdf_load_stackoverflow) | ||
| JP2617848B2 (ja) | 半導体ウエハの鍍金治具 | |
| US6181057B1 (en) | Electrode assembly, cathode device and plating apparatus including an insulating member covering an internal circumferential edge of a cathode member | |
| CN219260245U (zh) | 半导体电子元件局部平面电镀治具 | |
| JPS6348690Y2 (enrdf_load_stackoverflow) | ||
| US5819410A (en) | Method for manufacturing a pin and pipe assembly for a bare chip testing socket | |
| CN100587124C (zh) | 电子零件用电镀夹具以及电解电镀装置 | |
| JPS6348691Y2 (enrdf_load_stackoverflow) | ||
| KR100687518B1 (ko) | 전기부품 접촉유니트 및 전기부품 접촉유니트를 사용한전기부품 검사용 유니트 | |
| US20080006526A1 (en) | Device for plating contacts in hermetic connector assemblies | |
| JP2022106144A (ja) | めっき治具 | |
| JPS6156299A (ja) | 鍍金装置の給電装置 | |
| US4545864A (en) | Selective plating | |
| JPH052603Y2 (enrdf_load_stackoverflow) | ||
| JPH0953198A (ja) | 電解メッキ装置および方法 | |
| JPH0730687Y2 (ja) | バンプめっき装置 | |
| JPH02243800A (ja) | リード端子の製造方法 | |
| JPH08264701A (ja) | 多ピン素子用めっき治具 | |
| KR100254276B1 (ko) | 반도체 제조용 도금장치의 커넥터 |