JPS6348124Y2 - - Google Patents

Info

Publication number
JPS6348124Y2
JPS6348124Y2 JP15083182U JP15083182U JPS6348124Y2 JP S6348124 Y2 JPS6348124 Y2 JP S6348124Y2 JP 15083182 U JP15083182 U JP 15083182U JP 15083182 U JP15083182 U JP 15083182U JP S6348124 Y2 JPS6348124 Y2 JP S6348124Y2
Authority
JP
Japan
Prior art keywords
wire
clamp
tension
roller
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15083182U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5956740U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15083182U priority Critical patent/JPS5956740U/ja
Publication of JPS5956740U publication Critical patent/JPS5956740U/ja
Application granted granted Critical
Publication of JPS6348124Y2 publication Critical patent/JPS6348124Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Guides For Winding Or Rewinding, Or Guides For Filamentary Materials (AREA)
  • Wire Bonding (AREA)
JP15083182U 1982-10-06 1982-10-06 カセツト式ワイヤ供給装置 Granted JPS5956740U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15083182U JPS5956740U (ja) 1982-10-06 1982-10-06 カセツト式ワイヤ供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15083182U JPS5956740U (ja) 1982-10-06 1982-10-06 カセツト式ワイヤ供給装置

Publications (2)

Publication Number Publication Date
JPS5956740U JPS5956740U (ja) 1984-04-13
JPS6348124Y2 true JPS6348124Y2 (enrdf_load_stackoverflow) 1988-12-12

Family

ID=30334419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15083182U Granted JPS5956740U (ja) 1982-10-06 1982-10-06 カセツト式ワイヤ供給装置

Country Status (1)

Country Link
JP (1) JPS5956740U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS5956740U (ja) 1984-04-13

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