JPS6347349B2 - - Google Patents
Info
- Publication number
- JPS6347349B2 JPS6347349B2 JP19444382A JP19444382A JPS6347349B2 JP S6347349 B2 JPS6347349 B2 JP S6347349B2 JP 19444382 A JP19444382 A JP 19444382A JP 19444382 A JP19444382 A JP 19444382A JP S6347349 B2 JPS6347349 B2 JP S6347349B2
- Authority
- JP
- Japan
- Prior art keywords
- jig
- package
- component
- integrated circuit
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 22
- 230000037431 insertion Effects 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 9
- 238000012966 insertion method Methods 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 description 17
- 239000010959 steel Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Container Filling Or Packaging Operations (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19444382A JPS5984500A (ja) | 1982-11-05 | 1982-11-05 | 部品挿入方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19444382A JPS5984500A (ja) | 1982-11-05 | 1982-11-05 | 部品挿入方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5984500A JPS5984500A (ja) | 1984-05-16 |
| JPS6347349B2 true JPS6347349B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-09-21 |
Family
ID=16324662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19444382A Granted JPS5984500A (ja) | 1982-11-05 | 1982-11-05 | 部品挿入方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5984500A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4657172A (en) * | 1985-10-31 | 1987-04-14 | American Microsystems, Inc. | Apparatus and method of solder coating integrated circuit leads |
-
1982
- 1982-11-05 JP JP19444382A patent/JPS5984500A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5984500A (ja) | 1984-05-16 |
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