JPS6347134A - Manufacture of multilayer printed wiring board - Google Patents
Manufacture of multilayer printed wiring boardInfo
- Publication number
- JPS6347134A JPS6347134A JP19187286A JP19187286A JPS6347134A JP S6347134 A JPS6347134 A JP S6347134A JP 19187286 A JP19187286 A JP 19187286A JP 19187286 A JP19187286 A JP 19187286A JP S6347134 A JPS6347134 A JP S6347134A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- multilayer printed
- wiring board
- resin
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000010410 layer Substances 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 48
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 description 15
- 229920000647 polyepoxide Polymers 0.000 description 15
- 229920001721 polyimide Polymers 0.000 description 14
- 239000009719 polyimide resin Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 10
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000011888 foil Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical group FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 description 1
- WFLOTYSKFUPZQB-UHFFFAOYSA-N 1,2-difluoroethene Chemical group FC=CF WFLOTYSKFUPZQB-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔技術分野〕 この発明は、多層プリント配線板の製法に関する。[Detailed description of the invention] 〔Technical field〕 The present invention relates to a method for manufacturing a multilayer printed wiring board.
従来の多層プリント配線板は、基材にエポキシ樹脂また
はポリイミド樹脂が含浸されたプリプレグ所定枚を必要
に応じてエポキシ樹脂フィルム等とともに積層成形する
とともに少なくとも片面に内層回路を形成するようにし
てつくられた内層材と、外層回路となる銅箔等の外層材
と、基材にエポキシ樹脂またはポリイミド樹脂が含浸さ
れたプリプレグとが所定枚ずつ必要に応じてエポキシ樹
脂フィルム等とともに積層成形されてつくられていた。Conventional multilayer printed wiring boards are made by laminating and molding predetermined sheets of prepreg, the base material of which is impregnated with epoxy resin or polyimide resin, along with epoxy resin films, etc., as necessary, and forming an inner layer circuit on at least one side. The inner layer material, the outer layer material such as copper foil that will become the outer layer circuit, and the pre-preg base material impregnated with epoxy resin or polyimide resin are laminated and molded in predetermined sheets together with an epoxy resin film, etc. as necessary. was.
ところが、このようにしてつくられた多層プリント配線
板は、エポキシ樹脂が含浸されてつくられたものでは誘
電率ε＃５、ポリイミド樹脂が含浸されてつくられたも
のでは誘電率ε＃４というように、誘電率が極めて高く
、高周波用または高速演算用としては不適であった。そ
のため、多層プリント配線板の誘電率を低下させる方法
の開発が望まれていた。However, the multilayer printed wiring boards produced in this way have a dielectric constant of ε#5 for those impregnated with epoxy resin, and ε#4 for those impregnated with polyimide resin. Moreover, it has an extremely high dielectric constant, making it unsuitable for high-frequency applications or high-speed calculations. Therefore, it has been desired to develop a method for lowering the dielectric constant of multilayer printed wiring boards.
以上の事情に鑑みて、この発明は、多層プリント配線板
の誘電率を低下させることができる多層プリント配線板
の製法を提供することを目的とする。In view of the above circumstances, an object of the present invention is to provide a method for manufacturing a multilayer printed wiring board that can reduce the dielectric constant of the multilayer printed wiring board.
前記目的を達成するため、この発明は、樹脂と基材とで
構成されているとともに少なくとも片面に内層回路が形
成されている内層材と、外層回路となる外層材とを所定
枚ずつ、接着材層を介して積層成形して多層プリント配
線板を得るにあたり、前記内層材を構成する樹脂にフッ
素樹脂を用いることを特徴とする多層プリント配線板の
製法をその要旨としている。In order to achieve the above object, the present invention provides predetermined sheets of an inner layer material, which is composed of a resin and a base material, and has an inner layer circuit formed on at least one side, and an outer layer material, which will become the outer layer circuit, using an adhesive. The gist of the present invention is a method for manufacturing a multilayer printed wiring board characterized in that a fluororesin is used as the resin constituting the inner layer material in obtaining the multilayer printed wiring board by laminating layers.
以下に、この発明を、その一実施例をあられす図面を参
照しながら詳しく説明する。Hereinafter, one embodiment of the present invention will be described in detail with reference to the accompanying drawings.
第１図はこの発明にかかる多層プリント配線板の製法の
一実施例において、多層プリント配線板を得る際の構成
を模式的にあられしている。図にみるように、内層材１
とプリプレグ２と外層材３とをつくっておく。内層材ｌ
は、フッ素樹脂積層板の両面に内層回路となる回路が形
成されたものを用いる。この内層材ｌは、たとえば、フ
ッ素樹脂を基材に含浸させたのち乾燥してプリプレグを
つくり、このプリプレグと銅箔等の金属箔とを所定枚ず
つ、必要に応じて、フン素樹脂フィルムを介在させるよ
うにして、積層成形してフッ素樹脂金属箔張り積層板を
得た後、このフン素樹脂金属箔張り積層板の金属箔をエ
ツチングすることにより、フッ素樹脂金属箔張り積層板
の両面に回路形成を行うようにしてつくられている。プ
リプレグ２は、エポキシ樹脂またはポリイミド樹脂を基
材に含浸させたのち乾燥してつくられたものを用いる。FIG. 1 schematically shows the structure for obtaining a multilayer printed wiring board in an embodiment of the method for manufacturing a multilayer printed wiring board according to the present invention. As shown in the figure, inner layer material 1
Pre-preg 2 and outer layer material 3 are prepared. Inner layer material
uses a fluororesin laminate in which circuits serving as inner layer circuits are formed on both sides. This inner layer material l is made by, for example, impregnating a base material with a fluororesin and then drying it to make a prepreg, and then adding a fluororesin film to a predetermined number of sheets of this prepreg and a metal foil such as copper foil, if necessary. After laminating and forming a fluororesin metal foil laminate to obtain a fluororesin metal foil laminate, the metal foil of the fluororesin metal foil laminate is etched to form a laminate on both sides of the fluororesin metal foil laminate. It is made to form a circuit. The prepreg 2 is made by impregnating a base material with epoxy resin or polyimide resin and then drying it.
外層回路となる外層材３は、銅箔等の金属箔からなるも
のを用いる。この多層プリント配線板の製法は、これら
内層材１と外層材３とを所定枚ずつ、接着材層となるプ
リプレグ２を介して重ね合わせ、エポキシ樹脂またはポ
リイミド樹脂の溶融温度で成形して、多層プリント配線
板を得るようにするのである。The outer layer material 3 serving as the outer layer circuit is made of metal foil such as copper foil. The manufacturing method of this multilayer printed wiring board is to stack a predetermined number of inner layer material 1 and outer layer material 3 through prepreg 2, which serves as an adhesive layer, and to form the multilayer printed wiring board at the melting temperature of epoxy resin or polyimide resin. The purpose is to obtain printed wiring boards.
以上のように、この多層プリント配線板の製法は、内層
材１を構成する樹脂にフン素樹脂を用いるため、多層プ
リント配線板の誘電率を低下させることができる。この
実施例では、内層材１を構成する樹脂にのみフッ素樹脂
を用いたが、プリプレグ２の樹脂にもフッ素樹脂を用い
るようにすれば、さらに誘電率を低下させることができ
る。As described above, in this method for manufacturing a multilayer printed wiring board, since a fluorine resin is used as the resin constituting the inner layer material 1, the dielectric constant of the multilayer printed wiring board can be lowered. In this example, a fluororesin was used only as the resin constituting the inner layer material 1, but if a fluororesin is also used for the resin of the prepreg 2, the dielectric constant can be further reduced.
この実施例のように、内層材１を構成する樹脂にのみフ
ン素樹脂を用いるようにすれば、すべてフン素樹脂を用
いるようにする方法と比べて、つぎのような効果がある
。フッ素樹脂がエポキシ樹脂およびポリイミド樹脂に比
べて高価であるため、フッ素樹脂の量が少なくてすむ実
施例は、安価に多層プリント配線板を得ることができる
。また、フン素樹脂の溶融温度が４００℃程度であるの
に対し、エポキシ樹脂の溶融温度が１７０℃程度、ポリ
イミド樹脂の溶融温度が２００℃程度であるため、１７
０〜２００℃程度の低い温度で成形することができる。If fluorine resin is used only for the resin constituting the inner layer material 1 as in this embodiment, the following effects can be obtained compared to a method in which fluorine resin is used entirely. Since fluororesin is more expensive than epoxy resins and polyimide resins, embodiments that require less amount of fluororesin can provide a multilayer printed wiring board at low cost. Furthermore, while the melting temperature of fluorine resin is about 400°C, the melting temperature of epoxy resin is about 170°C, and the melting temperature of polyimide resin is about 200°C.
It can be molded at a low temperature of about 0 to 200°C.
以上がすべてフッ素樹脂を用いるようにする方法と比べ
ての効果であるが、この実施例のようにすれば、エポキ
シ樹脂の溶融温度またはポリイミド樹脂の溶融温度で成
形することによって、この温度では内層材を構成するフ
ッ素樹脂が溶融しないため、内層材が補強材として働き
、得られる多層プリント配線板の寸法安定性が向上する
（寸法変化率が小さくなる）と言う効果もある。All of the above are effects compared to the method of using fluororesin, but if it is done as in this example, by molding at the melting temperature of epoxy resin or polyimide resin, the inner layer will not be formed at this temperature. Since the fluororesin that makes up the material does not melt, the inner layer material acts as a reinforcing material, which has the effect of improving the dimensional stability of the resulting multilayer printed wiring board (reducing the rate of dimensional change).
なお、外層材としては、片面金属箔張り積層板を用いて
もよい。この片面金属箔張り積層板を構成する樹脂は、
フッ素樹脂であっても、エポキシ樹脂またはポリイミド
樹脂であってもよい。接着材層は、プリプレグのみで構
成してもよいし、フッ素樹脂、エポキシ樹脂、ポリイミ
ド樹脂等からなる樹脂フィルムとプリプレグとで構成し
てもよい。Note that a single-sided metal foil-clad laminate may be used as the outer layer material. The resin that makes up this single-sided metal foil laminate is
It may be a fluororesin, an epoxy resin, or a polyimide resin. The adhesive layer may be composed of only prepreg, or may be composed of prepreg and a resin film made of fluororesin, epoxy resin, polyimide resin, or the like.
この発明に用いられるフッ素樹脂としては、４フツ化エ
チレン樹脂（ＰＴＦＥ）、４フフ化エチレン−６フソ化
プロピレン共重合樹脂（Ｆ Ｅ Ｐ）、４フッ化エチレ
ン−パーフルオロアルキルビニルエーテル共重合樹脂（
ＰＦＡ）、３フッ化エチレン樹脂、２フツ化エチレン樹
脂等があげられるつぎに、実施例と比較例とを示す。Examples of the fluororesin used in this invention include tetrafluoroethylene resin (PTFE), tetrafluoroethylene-6-fluoropropylene copolymer resin (FEP), and tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer resin (PTFE).
PFA), trifluoroethylene resin, difluoroethylene resin, etc. Next, examples and comparative examples are shown.
（実施例１）
エポキシ樹脂をガラス基材（日東紡績■ＷＥ０５Ｅ）に
含浸させたのち乾燥して、樹脂分６０％、厚み０．１龍
のプリプレグ２をつくった。内層材１は、フッ素樹脂（
ＦＥＰ）を樹脂分とし、両面に内層回路が形成されたも
の（厚み０．８ｍｍ）を用いた。外層材３は、銅箔（厚
み１８μｍ）を用いた。これら内層材１とプリプレグ２
と外層材３とを第１図にみるように重ね合わせ、温度１
７０℃、圧力３０に＋ｒ／ｃＪ、時間９０分の条件で成
形して、多層プリント配線板を得た。(Example 1) A glass base material (Nitto Boseki WE05E) was impregnated with an epoxy resin and then dried to produce prepreg 2 with a resin content of 60% and a thickness of 0.1 mm. The inner layer material 1 is made of fluororesin (
FEP) was used as the resin component, and inner layer circuits were formed on both sides (thickness: 0.8 mm). As the outer layer material 3, copper foil (thickness: 18 μm) was used. These inner layer materials 1 and prepreg 2
and outer layer material 3 are stacked together as shown in Figure 1, and the temperature is 1.
A multilayer printed wiring board was obtained by molding at 70° C., a pressure of 30 +r/cJ, and a time of 90 minutes.
（実施例２）
ポリイミド樹脂をガラス基材（日東紡績例ＷＥ０５Ｅ）
に含浸させたのち乾燥して、樹脂分６０％、厚み０．１
ｆｌのプリプレグ２をつくった。内層材１は、フン素樹
脂（ＦＥＰ）を樹脂分とし、両面に内層回路が形成され
たちのく厚み０．８ｍｍ）を用いた。また、外層材３は
、ポリイミド樹脂を樹脂分とし、片面に銅箔（厚み１８
μｍ）が張られた片面銅張り積層板（厚み０．２０）を
用いた。これら内層材１とプリプレグ２と外層材３とを
第２図にみるように重ね合わせ、温度２００℃、圧力３
０ｋｇ／ｃｎ＋、時間９０分の条件で成形して、多層プ
リント配線板を得た。(Example 2) Using polyimide resin as a glass base material (Nittobo Co., Ltd. WE05E)
After impregnating with
I made fl prepreg 2. The inner layer material 1 was made of fluorocarbon resin (FEP), had inner layer circuits formed on both sides, and had a thickness of 0.8 mm. In addition, the outer layer material 3 is made of polyimide resin as the resin component, and one side is made of copper foil (thickness 18
A single-sided copper-clad laminate (thickness: 0.20 μm) was used. These inner layer material 1, prepreg 2, and outer layer material 3 are stacked together as shown in Figure 2, and the temperature is 200°C and the pressure is 3
A multilayer printed wiring board was obtained by molding under the conditions of 0 kg/cn+ and 90 minutes.
（比較例１）
内層材として、エポキシ樹脂を樹脂分とする内層材を用
いた他は、実施例１と同様にして、多層プリント配線板
を得た。(Comparative Example 1) A multilayer printed wiring board was obtained in the same manner as in Example 1, except that an inner layer material containing an epoxy resin as the resin component was used as the inner layer material.
（比較例２）
内層材として、ポリイミド樹脂を樹脂分とする内層材を
用いた他は、実施例１と同様にして、多層プリント配線
板を得た。(Comparative Example 2) A multilayer printed wiring board was obtained in the same manner as in Example 1, except that an inner layer material containing polyimide resin as the resin component was used as the inner layer material.
以上、得られた多層プリント配線板について、誘電率（
ε）を測定したところ、誘電率は、実施例１がε−３，
８、実施例２がε−３，６、比較例１がε−５、比較例
２がε−４であった。また、寸法変化率を測定したとこ
ろ、寸法変化率は、実施例１が比較例１と比べて２％、
実施例２が比較例２と比べて３％向上していた。なお、
寸法変化率は、２５０ｍ四方の試料を１２０°Ｃで２分
→１５分冷却−１２０°Ｃで１５分−３０分冷却して、
その寸法変化を測定した。As described above, the dielectric constant (
When ε) was measured, the dielectric constant of Example 1 was ε-3,
8, Example 2 had ε-3, 6, Comparative Example 1 had ε-5, and Comparative Example 2 had ε-4. In addition, when the dimensional change rate was measured, the dimensional change rate was 2% in Example 1 compared to Comparative Example 1.
Example 2 was improved by 3% compared to Comparative Example 2. In addition,
The dimensional change rate was determined by cooling a 250 m square sample at 120°C for 2 minutes → 15 minutes, then cooling at -120°C for 15 minutes and 30 minutes.
The dimensional change was measured.
この結果かられかるように、実施例１ば、比較例１に比
べて誘電率が低下している。また、実施例２も、比較例
２と比べて誘電率が低下している。しかも、実施例は、
比較例と比べて寸法安定性も向上している。As can be seen from the results, the dielectric constant of Example 1 is lower than that of Comparative Example 1. Further, the dielectric constant of Example 2 is also lower than that of Comparative Example 2. Moreover, the example is
Dimensional stability is also improved compared to the comparative example.
この発明にかかる多層プリント配線板の製法は、前記実
施例に限定されない。内層材の内層回路は、片面にのみ
形成されていてもよい。エポキシ樹脂、ポリイミド樹脂
の代わりに、他の熱硬化性樹脂、熱可塑性樹脂を用いる
ようにしてもよい。The method for manufacturing a multilayer printed wiring board according to the present invention is not limited to the above embodiments. The inner layer circuit of the inner layer material may be formed only on one side. Other thermosetting resins and thermoplastic resins may be used instead of epoxy resins and polyimide resins.
フッ素樹脂は、複数種のものを用いるようにしてもよい
。A plurality of types of fluororesin may be used.
以上に説明してきたように、この発明にかかる多層プリ
ント配線板の製法は、樹脂と基材とで構成されていると
ともに少なくとも片面に内層回路が形成されている内層
材と、外層回路となる外層材とを所定枚ずつ、接着材層
を介して積層成形して多層プリント配線板を得るにあた
り、前記内層材を構成する樹脂にフッ素樹脂を用いるこ
とを特徴としているので、多層プリント配線板の誘電率
を低下させることができる。As explained above, the method for manufacturing a multilayer printed wiring board according to the present invention includes an inner layer material that is composed of a resin and a base material, and has an inner layer circuit formed on at least one side, and an outer layer that becomes the outer layer circuit. In order to obtain a multilayer printed wiring board by laminating and molding a predetermined number of inner layer materials one by one through an adhesive layer, a fluororesin is used as the resin constituting the inner layer material, so that the dielectric of the multilayer printed wiring board is rate can be reduced.
第１図はこの発明にかかる多層プリント配線板の製法の
一実施例において、多層プリント配線板を得る際の構成
を模式的にあられす側面図である１・・・内層材 ２・
・・プリプレグ（接着材層） ３・・・外層材FIG. 1 is a side view schematically showing the structure when a multilayer printed wiring board is obtained in an embodiment of the method for manufacturing a multilayer printed wiring board according to the present invention. 1. Inner layer material 2.
...Prepreg (adhesive layer) 3...Outer layer material
Claims (1)
も片面に内層回路が形成されている内層材と、外層回路
となる外層材とを所定枚ずつ、接着材層を介して積層成
形して多層プリント配線板を得るにあたり、前記内層材
を構成する樹脂にフッ素樹脂を用いることを特徴とする
多層プリント配線板の製法。(1) A predetermined number of sheets of an inner layer material, which is composed of a resin and a base material and has an inner layer circuit formed on at least one side, and an outer layer material that will become the outer layer circuit are laminated through an adhesive layer. A method for manufacturing a multilayer printed wiring board, characterized in that, in obtaining the multilayer printed wiring board, a fluororesin is used as the resin constituting the inner layer material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19187286A JPS6347134A (en) | 1986-08-15 | 1986-08-15 | Manufacture of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19187286A JPS6347134A (en) | 1986-08-15 | 1986-08-15 | Manufacture of multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6347134A true JPS6347134A (en) | 1988-02-27 |
Family
ID=16281878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19187286A Pending JPS6347134A (en) | 1986-08-15 | 1986-08-15 | Manufacture of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6347134A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002036492A (en) * | 2000-05-17 | 2002-02-05 | Komori Corp | Printing machine |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60214941A (en) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | Printed substrate |
| JPS6153131B2 (en) * | 1978-02-06 | 1986-11-17 | Kabelmetal Electro Gmbh |
-
1986
- 1986-08-15 JP JP19187286A patent/JPS6347134A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6153131B2 (en) * | 1978-02-06 | 1986-11-17 | Kabelmetal Electro Gmbh | |
| JPS60214941A (en) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | Printed substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002036492A (en) * | 2000-05-17 | 2002-02-05 | Komori Corp | Printing machine |
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