JPS6347049A - Machining method for diamond member - Google Patents
Machining method for diamond memberInfo
- Publication number
- JPS6347049A JPS6347049A JP18520886A JP18520886A JPS6347049A JP S6347049 A JPS6347049 A JP S6347049A JP 18520886 A JP18520886 A JP 18520886A JP 18520886 A JP18520886 A JP 18520886A JP S6347049 A JPS6347049 A JP S6347049A
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- abrasive grains
- processing
- diamond member
- cbn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 50
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims description 14
- 238000003754 machining Methods 0.000 title abstract description 7
- 239000006061 abrasive grain Substances 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000003672 processing method Methods 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 abstract description 3
- 239000003082 abrasive agent Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 229910001018 Cast iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 102100023774 Cold-inducible RNA-binding protein Human genes 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101000906744 Homo sapiens Cold-inducible RNA-binding protein Proteins 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 239000004006 olive oil Substances 0.000 description 1
- 235000008390 olive oil Nutrition 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は切削加工に用いるダイヤモンドチップの加工な
どに好適なダイヤモンド部材の加工方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method of processing a diamond member suitable for processing a diamond tip used in cutting.
（従来の技術）
最近は各分野で高精度で、しかも極めて平滑な平面や曲
面が要求されているが、これらの面を切削加工により得
るためにはバイトとしてチップ状のダイヤモンド部材が
用いられる。加工に際しては当然バイトとしてのダイヤ
モンド部材を所定の形状に超精密に形成することが必要
であるが。(Prior Art) Recently, highly accurate and extremely smooth flat or curved surfaces are required in various fields, and in order to obtain these surfaces by cutting, a chip-shaped diamond member is used as a cutting tool. During processing, it is of course necessary to form the diamond member used as a cutting tool into a predetermined shape with ultra-precision.
ダイヤモンド自体が非常に硬く、これを研削、研磨する
にはダイヤモンドの小片とか粉末を遊離。Diamond itself is extremely hard, and grinding and polishing it requires releasing small pieces or powder of diamond.
あるいは固定砥粒の形で用いる以外に方法がなかった。Alternatively, there was no other option than to use it in the form of fixed abrasive grains.
従って非常に高価であり、また作業者の技能に負うとこ
ろが大きく、生産性が低く、さらにまた硬度の関係から
ダイヤモンドの（１，１１）面は加工できないなどの不
都合があった。Therefore, it is very expensive, and it is highly dependent on the skill of the operator, resulting in low productivity.Furthermore, the (1,11) plane of diamond cannot be machined due to its hardness.
一方、近時、 ＣＢＮ （Ｃｕｂｉｃ Ｂｏｒｏｎ Ｎ
１ｔｒｉｄｅ ：商品名ボラゾン）がほぼ８００’Ｏ以
上の高温度でダイヤモンドより高い硬度を示すことが分
って来た。例えばＳ、 Ｏｋａ ｄａ 、 Ａｎｎａｌ
ｓ ｏｆ ＣＩＲＰ ２５−１１２１９ （１９７６）
の文献にはダイヤモンド、 ＣＢＮ、 ＳｉＣ、コラン
ダムなどの高温硬さがグラフ表示されていて、はぼ８０
０℃の温度でダイヤモンドの硬度が３０５６に９／ｍｍ
２゜ＣＢＮのそれが３１３０に、ｇ／ｍｙｎ２と読みと
ることができる。On the other hand, recently, CBN (Cubic Boron N
It has been found that 1tride (trade name Borazon) exhibits higher hardness than diamond at high temperatures of approximately 800'O or higher. For example, S, Okada, Annal
s of CIRP 25-11219 (1976)
In the literature, the high-temperature hardness of diamond, CBN, SiC, corundum, etc. is displayed graphically, and
At a temperature of 0℃, the hardness of diamond is 3056/9/mm.
2° CBN is 3130, which can be read as g/myn2.
その他の文献においても、常温においてＣＢＮより硬度
が高いダイヤモンドも、温度がほぼ８００℃付近になる
とＣＢＮＯ方がダイヤモンドより硬度が高くなるのであ
る。すなわち温度−硬度曲線においてＣＢＨの曲線とダ
イヤモンドの曲線とが交差する硬度交差温度が存在する
ことが分って来た。Other documents also show that even though diamond is harder than CBN at room temperature, CBNO becomes harder than diamond when the temperature reaches around 800°C. That is, it has been found that there is a hardness cross temperature where the CBH curve intersects the diamond curve in the temperature-hardness curve.
このような記載からＣＢＮを用いてダイヤモンドを加工
することが考えられるが、砥石を高温に保ちながら加工
することは１例えば精度の低下など種々な不都合が生じ
、所望の精度、仕上げ面にダイヤモンド部材を加工する
ことは困難であった。Based on these descriptions, it is conceivable to process diamond using CBN, but machining while keeping the grindstone at a high temperature causes various problems such as a decrease in accuracy, and it is difficult to obtain the desired accuracy and finished surface of the diamond member. It was difficult to process.
（発明が解決しようとする問題点）
本発明は上述の事情にかんがみてなされたもので、高価
なダイヤモンドを使用せずに、また熟練を要するこさな
く、ダイヤモンドの（１１１）面も加工できるダイヤモ
ンド部材の加工方法を提供することを目的とする。(Problems to be Solved by the Invention) The present invention has been made in view of the above-mentioned circumstances. The purpose is to provide a method for processing parts.
（問題点を解決するための手段と作用）本発明は、 Ｃ
ＢＮ砥粒を付着ないし固着して形成した加工面に被加工
物としてのダイヤモンド部材を当接抑圧し、かつ相対的
に移動させて加工する際、加工面の当接加工位置の直前
をＣＢＮの硬度一温度白層とダイヤモンドの硬度一温度
曲線とが交差する硬度又差温度以上に加熱しながら加工
するダイヤモンド部材の加工方法である。すなわちＣＢ
Ｎ砥粒が加工直前に加熱されてダイヤモンド部材に接触
し１両者が８００℃以上に加熱された状態となり、この
温度で硬度の高いＣＢＮ砥粒でダイヤモンド部材を加工
する方法である付着ないし固着とは砥粒を単に付着させ
た状態から砥石に成形した状態までのことをいう。(Means and effects for solving the problems) The present invention has the following features: C
When processing by pressing a diamond member as a workpiece into contact with a machined surface formed by adhering or fixing BN abrasive grains and moving it relatively, the CBN is placed immediately before the contact processing position on the machined surface. This is a method of processing a diamond member in which the diamond member is heated to a temperature higher than the hardness or difference temperature where the hardness-one-temperature white layer and the diamond hardness-one-temperature curve intersect. That is, C.B.
Immediately before machining, the N abrasive grains are heated and come into contact with the diamond member, and both of them are heated to over 800°C, resulting in adhesion or adhesion, which is a method of processing the diamond member with highly hard CBN abrasive grains at this temperature. refers to the state in which abrasive grains are simply attached to the state in which they are formed into a whetstone.
（実施例）
以下１本発明の詳細を第１図ないし第４図を参照しなが
ら実施例により説明する。(Example) The details of the present invention will be explained below by way of an example with reference to FIGS. 1 to 4.
第１図および第２図を参照して第１の実施例を説明する
。これらの図は実施のための装置を示す。A first embodiment will be described with reference to FIGS. 1 and 2. These figures show the apparatus for implementation.
基台（１）上には回転駆動されるスケー７（２）が設け
られている。これは鋳鉄製円盤（３）からなっていて。A scale 7 (2) that is rotatably driven is provided on the base (1). It consists of cast iron discs (3).
その表面には外周に沿って適宜な幅に粒径が０〜２μｍ
のＣＢＮ砥粒（４）、・・・をオリーブ油に溶いて散布
し、鉄片でこれら砥粒（４）、・・・をスケー７（２）
上面に擦り込んで、加工面（５）が形成されている。こ
のスケー７（２）の側方には保持手段（８）が設けられ
ている。The surface has grains with a diameter of 0 to 2 μm in an appropriate width along the outer periphery.
Dissolve CBN abrasive grains (4), ... in olive oil and sprinkle them, and use a piece of iron to scale these abrasive grains (4), ...7 (2).
A processed surface (5) is formed by rubbing into the upper surface. A holding means (8) is provided on the side of this scale 7 (2).
これは一本の支持棒（９）の一端部を逆Ｖ字形の開脚０
０）で支持した。いわゆる馬圓と、これを上下方向に茶
内した案内棒（１２，Ｑ３と、支持棒（９）の他端部に
取付けられた支持板（１３）などから構成されていて。This is an inverted V-shaped open leg 0 at one end of one support rod (9).
0) was supported. It consists of a so-called horse ring, a guide rod (12, Q3) which is enclosed in the vertical direction, and a support plate (13) attached to the other end of the support rod (9).
この支持板α段の下端部に切削バイ） （１４）が取付
けられている。そしてバイトα優の先端にチップＣＩ５
からなるダイヤモンド部材（Ｌｅが固定されている。こ
の保持手段（８）の他端側近傍に加熱手段（２１１が設
けられている。これはレーザ照射装置Ｈからなっていて
。A cutting tool (14) is attached to the lower end of the support plate α stage. And chip CI5 at the tip of part-time job α Yu
A diamond member (Le) consisting of a diamond member (Le) is fixed. A heating means (211) is provided near the other end of this holding means (8). This consists of a laser irradiation device H.
レーザ光（瀾が加工面（５）を開封加熱するようになっ
ている。その照射位置はダイヤモンド部材（１６）が加
工面（５）に当接している加工位置Ｃ４）の直前である
。The laser beam is designed to unseal and heat the processed surface (5).The irradiation position is immediately in front of the processed position C4 where the diamond member (16) is in contact with the processed surface (5).
次に本発明方法の実施態様につき述べると、バイト（１
４）はダイヤモンド部材（１ｅであるチップｃＬ９のす
くい角が一１°になるように傾けて取付けてあり。Next, to describe an embodiment of the method of the present invention, bytes (1
4) is installed at an angle so that the rake angle of the tip cL9, which is the diamond member (1e), is 11°.
ウェイトσηにより加工面（５）に当接した際、適切な
押圧力１例えば２００に値２になるようになっている。When the weight ση makes contact with the machined surface (5), an appropriate pressing force of 1, for example 200, is set to a value of 2.
さて１図示しない駆動機構により、スケー７（２）が矢
印（ハ）の方向に回転すると、レーザ光（ハ）が照射し
ている部位を砥粒（４）、・・・が通過すると８５０℃
以上に瞬時にしてなり、直ちにダイヤモンド部材（１６
）（チップ）に浩り、これを加熱しながら通過して行く
。このときダイヤモンド部材住＠は加熱されてｓｏｏ’
ｏ以上になり、 ＣＢＮ砥粒（４）、・・・により研磨
されて良好なすくい面と前逃げ面（この場合半径１ｗＥ
の円柱面）との間に刃付けを行なうことができた。Now, when the scale 7 (2) is rotated in the direction of the arrow (C) by a drive mechanism (not shown), the abrasive grains (4), etc. pass through the area irradiated with the laser beam (C), and the temperature reaches 850°C.
The diamond member (16
) (chips) and pass through them while heating them. At this time, the diamond member is heated and
o or more, and polished by CBN abrasive grains (4), etc., to give a good rake face and front flank (in this case, a radius of 1 wE).
It was possible to create a blade between the cylindrical surface and the cylindrical surface.
すくい角−１°、前逃げ角４°のバイトに仕上げ、銅。Finished with a cutting tool with a rake angle of -1° and a front clearance angle of 4°, made of copper.
アルミニウムなどの軟質金属を旋削したところ平滑な表
面（几ｍａｘ １１００ｎ ）が得られた。When a soft metal such as aluminum was turned, a smooth surface (max. 1100n) was obtained.
次に第２の実施例につき第３図を参照して説明する。こ
れはスケーフ（２）上の加工面（５）を電極棒ＯＩ）。Next, a second embodiment will be explained with reference to FIG. This shows the processed surface (5) on the scale (2) as the electrode rod OI).
０巧からなる加熱手段（８）で加熱した場合で、加熱位
置は第１の実施例と同様な位置であって、電流が一方の
電極棒ＯＩ）から放電により鋳鉄製のスケ−７（２）に
流れ、放電により他方の電極棒０２に流れ、これら放電
の熱により加工面（５）を加熱するようになっている。The heating position is the same as in the first embodiment, and the current is discharged from one electrode rod OI) to the cast iron scale 7 (2). ) and flows to the other electrode rod 02 due to the discharge, and the heat of these discharges heats the machined surface (5).
すなわち、放電によりＣＢＮ砥粒（４）、・・−を加熱
してダイヤモンド部材（Ｌｅを研磨加工する方法である
。That is, this is a method of polishing a diamond member (Le) by heating CBN abrasive grains (4), . . . by electric discharge.
次に第３の実施例につき第４図を参照して説明する。こ
れはＣＢＮ砥粒（４）、・・・からなる加工面０ωをも
った砥石（至）を構成し、ダイヤモンド部材＜１６１
（チップ）を研磨する場合で、加工位置０７）直前をレ
ーザ光（ハ）で加熱して研磨加工した場合である。すな
わち従来のＣＢＮ砥石を用いて本発明方法を実施した場
合である。Next, a third embodiment will be explained with reference to FIG. 4. This constitutes a grindstone (to) with a machined surface of 0ω consisting of CBN abrasive grains (4), ..., and a diamond member <161
(Chip) is polished by heating the area just before the processing position 07) with a laser beam (C). That is, this is a case where the method of the present invention is carried out using a conventional CBN grindstone.
次に第４の実施例につき第５図を参照して説明する。こ
れはスケ−７（４１）を厚さ５關の溶融石英円盤で構成
し、 ＣＢＮ砥粒を擦り込んだもので、ダイヤモンド部
材α６）（チップ）の被研磨面近傍を裏面からレーザ光
（ハ）で照射して加工した場合である。Next, a fourth embodiment will be described with reference to FIG. This consists of a scale 7 (41) made of a fused silica disk with a thickness of 5 mm, into which CBN abrasive grains are rubbed, and the vicinity of the surface to be polished of the diamond member α6) (chip) is illuminated with a laser beam (halogen) from the back side. ) when processed by irradiation.
この場合は照射部位近傍に黒鉛などの光を吸収する部材
を介在させた方がよい。In this case, it is better to interpose a light-absorbing member such as graphite near the irradiation site.
上述の第２ないし第４の実施例はいずれも第１の実施例
の場合と同様に良好な結果が得られた。In the second to fourth embodiments described above, good results were obtained in the same manner as in the first embodiment.
またいずれも局部的加熱なので加工精度上の悪影響は全
くない。In addition, in both cases, since the heating is localized, there is no adverse effect on processing accuracy.
なお、スケ−７を鉄系以外の材料、例えばＷ。Note that the scale 7 is made of a material other than iron, such as W.
Ｔａ、 Ｔｉ、 Ｚｒ、 Ｃｏ、 ＪＭｎ、Ｎｉ、 Ｃ
ｒなどのような高温で炭化物を生じ易い部材を用いるこ
とにより上述の効果をさらに高めることができる。また
本実施例はいずれもバイトチップの研磨について記載し
たが、被加工物はダイヤモンド部材ならば他の被加工物
でもよい。Ta, Ti, Zr, Co, JMn, Ni, C
The above-mentioned effects can be further enhanced by using a member that easily forms carbides at high temperatures, such as R. In addition, although the present embodiments have all described polishing of a cutting tool tip, other workpieces may be used as long as the workpiece is a diamond member.
以上詳述したように、本発明のダイヤモンド部材の加工
方法は、 ＣＢＮ砥粒を加工直前の位置でイヤモンド部
材の（１１１）面の加工もでき、しかも作業者の熟練に
頼ることもないので、精度９表面As detailed above, the diamond member processing method of the present invention enables processing of the (111) plane of the diamond member at the position immediately before processing with CBN abrasive grains, and does not rely on the skill of the operator. precision 9 surface
第１図は本発明方法の第１の実施例を実施するための装
置の平面図、第２図は同じく正面図、第３図は本発明の
第２の実施例を実施するための装置の要部正面図、第４
図は同じく第３の実施例を実施するための装置の要部正
面図、第５図は同じく第４の実施例を実施するための装
置の要部正面図である。
（４）・・・ＣＢＮ砥粒、（５）・・・加工面。
ｔ１６ｊ・・・ダイヤモンド部材、０］）・・・加熱手
段。
（２〜・・・レーザ光、 （２４）・・・加工位
置。
（ハ）・・・加工面、 （４１）・・・石英
製円盤１１β材。
代理人 弁理士 則 近 憲 佑
同 竹 花 喜久男
第 １ 図
力ロ処今段
＼ ２，７３ １７ 保持手段
″砂（ダー、。
’−，／、、 、、Ｖ、。
３ 、、、 、ハ第
３ 囚
隼４図
第５図FIG. 1 is a plan view of an apparatus for implementing the first embodiment of the method of the present invention, FIG. 2 is a front view of the same, and FIG. 3 is a plan view of the apparatus for implementing the second embodiment of the present invention. Main part front view, 4th
This figure is a front view of the main part of the apparatus for carrying out the third embodiment, and FIG. 5 is a front view of the main part of the apparatus for carrying out the fourth embodiment. (4)... CBN abrasive grains, (5)... Processed surface. t16j...Diamond member, 0])...Heating means. (2~...Laser light, (24)...Processing position. (C)...Processing surface, (41)...Quartz disk 11β material. Agent Patent attorney Noriyuki Chika Ken Yudo Takehana Kikuo No. 1 Juryokuro Nowaday ＼ 2,73 17 Holding means "sand (Dah,. '-, /, , , V,. 3 ,,, , Ha No. 3 Prisoner Hayabusa 4 Fig. 5
Claims (5)
に被加工物としてのダイヤモンド部材を当接押圧しかつ
相対的に移動させるとともに上記当接する加工位置直前
の上記加工面をＣＢＮの硬度−温度曲線とダイヤモンド
の硬度−温度曲線とが交差する硬度交差温度以上の温度
に加熱することを特徴とするダイヤモンド部材の加工方
法。(1) A diamond member as a workpiece is brought into contact with and pressed against the machined surface formed by adhering or fixing CBN abrasive grains, and is moved relatively, and the machined surface immediately before the abutting processing position is adjusted to the hardness of CBN. - A method for processing a diamond member, characterized by heating to a temperature equal to or higher than the hardness intersection temperature where the temperature curve and the diamond hardness-temperature curve intersect.
る特許請求の範囲第１項記載のダイヤモンド部材の加工
方法。(2) The method for processing a diamond member according to claim 1, wherein the heating means is irradiation with laser light.
の範囲第１項記載のダイヤモンド部材の加工方法。(3) The method for processing a diamond member according to claim 1, wherein the heating means is electric discharge.
した加工面を用いて加工することを特徴とする特許請求
の範囲第１項ないし第３項のいずれか１項記載のダイヤ
モンド部材の加工方法。(4) The diamond member according to any one of claims 1 to 3, characterized in that the diamond member is processed using a processed surface formed by adhering CBN abrasive grains to the surface of an iron disc member. processing method.
成した加工面を用いて加工することを特徴とする特許請
求の範囲第１項ないし第３項のいずれか１項に記載のダ
イヤモンド部材の加工方法。(5) The method according to any one of claims 1 to 3, characterized in that processing is performed using a processing surface formed by adhering CBN abrasive grains to the surface of a quartz disk member. Processing method for diamond parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61185208A JPH0775818B2 (en) | 1986-08-08 | 1986-08-08 | Diamond member processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61185208A JPH0775818B2 (en) | 1986-08-08 | 1986-08-08 | Diamond member processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6347049A true JPS6347049A (en) | 1988-02-27 |
| JPH0775818B2 JPH0775818B2 (en) | 1995-08-16 |
Family
ID=16166762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61185208A Expired - Lifetime JPH0775818B2 (en) | 1986-08-08 | 1986-08-08 | Diamond member processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0775818B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61231898A (en) * | 1985-04-08 | 1986-10-16 | Nippon Parusumootaa Kk | Pentagon chopper driving method for 5-phase stepping motor |
| WO2009069509A1 (en) * | 2007-11-30 | 2009-06-04 | Hamamatsu Photonics K.K. | Working object grinding method |
| CN109015131A (en) * | 2018-04-25 | 2018-12-18 | 长春理工大学 | A kind of laser assisted natural diamond notching knife grinding method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5817116B2 (en) * | 2010-02-03 | 2015-11-18 | 東洋製罐株式会社 | Diamond surface polishing method |
| BR112013015008B1 (en) * | 2010-12-28 | 2021-04-13 | Toyo Seikan Group Holdings, Ltd | METHOD OF POLISHING A DIAMOND SURFACE |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5882661A (en) * | 1981-11-10 | 1983-05-18 | Toshiba Corp | Diamond polishing method |
-
1986
- 1986-08-08 JP JP61185208A patent/JPH0775818B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5882661A (en) * | 1981-11-10 | 1983-05-18 | Toshiba Corp | Diamond polishing method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61231898A (en) * | 1985-04-08 | 1986-10-16 | Nippon Parusumootaa Kk | Pentagon chopper driving method for 5-phase stepping motor |
| JPH0467439B2 (en) * | 1985-04-08 | 1992-10-28 | Nippon Pulsmotor Co Ltd | |
| WO2009069509A1 (en) * | 2007-11-30 | 2009-06-04 | Hamamatsu Photonics K.K. | Working object grinding method |
| US8523636B2 (en) | 2007-11-30 | 2013-09-03 | Hamamatsu Photonics K.K. | Working object grinding method |
| CN109015131A (en) * | 2018-04-25 | 2018-12-18 | 长春理工大学 | A kind of laser assisted natural diamond notching knife grinding method |
| CN109015131B (en) * | 2018-04-25 | 2020-10-20 | 长春理工大学 | Laser-assisted grinding method for natural diamond ruling knife |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0775818B2 (en) | 1995-08-16 |
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