JPS63468A - 対向タ−ゲツト式スパツタ装置 - Google Patents
対向タ−ゲツト式スパツタ装置Info
- Publication number
- JPS63468A JPS63468A JP14296286A JP14296286A JPS63468A JP S63468 A JPS63468 A JP S63468A JP 14296286 A JP14296286 A JP 14296286A JP 14296286 A JP14296286 A JP 14296286A JP S63468 A JPS63468 A JP S63468A
- Authority
- JP
- Japan
- Prior art keywords
- target
- magnetic field
- facing
- substrate
- sputtering apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000000696 magnetic material Substances 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims description 15
- 239000010408 film Substances 0.000 abstract description 9
- 239000010409 thin film Substances 0.000 abstract description 6
- 230000005389 magnetism Effects 0.000 abstract 1
- 238000009826 distribution Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14296286A JPS63468A (ja) | 1986-06-20 | 1986-06-20 | 対向タ−ゲツト式スパツタ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14296286A JPS63468A (ja) | 1986-06-20 | 1986-06-20 | 対向タ−ゲツト式スパツタ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63468A true JPS63468A (ja) | 1988-01-05 |
| JPH0411624B2 JPH0411624B2 (enrdf_load_stackoverflow) | 1992-03-02 |
Family
ID=15327707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14296286A Granted JPS63468A (ja) | 1986-06-20 | 1986-06-20 | 対向タ−ゲツト式スパツタ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63468A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006336029A (ja) * | 2005-05-31 | 2006-12-14 | Fts Corporation:Kk | 連続スパッタ装置および連続スパッタ方法 |
| EP1835047A4 (en) * | 2004-12-28 | 2009-11-04 | Fts Corp | SPRAY DEVICE WITH TARGETS FACING FACE |
| JP2016216767A (ja) * | 2015-05-18 | 2016-12-22 | 長州産業株式会社 | ミラートロンスパッタ装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5747870A (en) * | 1980-09-04 | 1982-03-18 | Fujitsu Ltd | Magnetron sputtering method for ferromagnetic material |
| JPS57126969A (en) * | 1981-01-30 | 1982-08-06 | Hitachi Ltd | Target structure of planer magnetron type sputtering apparatus and method for controlling magnetic flux thereof |
| JPS58164781A (ja) * | 1982-03-23 | 1983-09-29 | Teijin Ltd | 対向タ−ゲツト式スパツタ装置 |
-
1986
- 1986-06-20 JP JP14296286A patent/JPS63468A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5747870A (en) * | 1980-09-04 | 1982-03-18 | Fujitsu Ltd | Magnetron sputtering method for ferromagnetic material |
| JPS57126969A (en) * | 1981-01-30 | 1982-08-06 | Hitachi Ltd | Target structure of planer magnetron type sputtering apparatus and method for controlling magnetic flux thereof |
| JPS58164781A (ja) * | 1982-03-23 | 1983-09-29 | Teijin Ltd | 対向タ−ゲツト式スパツタ装置 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1835047A4 (en) * | 2004-12-28 | 2009-11-04 | Fts Corp | SPRAY DEVICE WITH TARGETS FACING FACE |
| JP2006336029A (ja) * | 2005-05-31 | 2006-12-14 | Fts Corporation:Kk | 連続スパッタ装置および連続スパッタ方法 |
| JP2016216767A (ja) * | 2015-05-18 | 2016-12-22 | 長州産業株式会社 | ミラートロンスパッタ装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0411624B2 (enrdf_load_stackoverflow) | 1992-03-02 |
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