JPS6346851U - - Google Patents

Info

Publication number
JPS6346851U
JPS6346851U JP13884386U JP13884386U JPS6346851U JP S6346851 U JPS6346851 U JP S6346851U JP 13884386 U JP13884386 U JP 13884386U JP 13884386 U JP13884386 U JP 13884386U JP S6346851 U JPS6346851 U JP S6346851U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
sealed
protrusion
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13884386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13884386U priority Critical patent/JPS6346851U/ja
Publication of JPS6346851U publication Critical patent/JPS6346851U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図Aは本考案の一実施例における樹脂封止
型半導体装置の斜視図、同図Bはその断面図であ
る。第2図Aは従来の樹脂封止型半導体装置の斜
視図、同図Bはその断面図である。 1……パワートランジスタ素子、2……リード
フレーム、6……樹脂封止成形体、7……リード
フレーム2の突起部、10……樹脂封止成形体6
の肩部。
FIG. 1A is a perspective view of a resin-sealed semiconductor device according to an embodiment of the present invention, and FIG. 1B is a sectional view thereof. FIG. 2A is a perspective view of a conventional resin-sealed semiconductor device, and FIG. 2B is a sectional view thereof. DESCRIPTION OF SYMBOLS 1... Power transistor element, 2... Lead frame, 6... Resin-sealed molded body, 7... Projection of lead frame 2, 10... Resin-sealed molded body 6
shoulder area.

Claims (1)

【実用新案登録請求の範囲】 リードフレームの切断によつて生じた突出部
が樹脂封止成形体の肩部内に配置されていること
を特徴とする樹脂封止型半導体装置。 突起部が樹脂封止成形体の表面から0.6mm
以上内部に配置されていることを特徴とする実用
新案登録請求の範囲第1項に記載の樹脂封止型半
導体装置。
[Claims for Utility Model Registration] A resin-sealed semiconductor device characterized in that a protrusion produced by cutting a lead frame is disposed within a shoulder of a resin-sealed molded body. The protrusion is 0.6 mm from the surface of the resin-sealed molded product.
The resin-sealed semiconductor device according to claim 1, wherein the semiconductor device is disposed inside.
JP13884386U 1986-09-10 1986-09-10 Pending JPS6346851U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13884386U JPS6346851U (en) 1986-09-10 1986-09-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13884386U JPS6346851U (en) 1986-09-10 1986-09-10

Publications (1)

Publication Number Publication Date
JPS6346851U true JPS6346851U (en) 1988-03-30

Family

ID=31044190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13884386U Pending JPS6346851U (en) 1986-09-10 1986-09-10

Country Status (1)

Country Link
JP (1) JPS6346851U (en)

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