JPS6344475A - Pallet for pin - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (Industrial Application Field) Ending 1! ! relates to a pin pallet used when manufacturing electronic component W5 mounting boards having conductor pins called a pin grid array, in particular a pin pallet that can transport a large number of conductor pins while supporting them in a predetermined arrangement. It is related to.

(Prior art) A board for mounting electronic components having conductor pins called a pin grid array has a conductor circuit formed on the board,
! ! 1. The circuit board is electrically connected to a conductor circuit formed on the side of another oversized board on which the board is mounted using a plurality of conductor pins. Therefore, on this type of electronic component mounting board, a plurality (many number) of conductor pins must be fixed or implanted while being electrically connected to the conductor circuit.

These conductor pins are extremely small (about 0.51 mm in diameter and several tens of meters long in length), partly because the substrate on which they are fixed or implanted is small. However, different shapes as shown in FIGS. 3 and 6 may be used for one electronic component mounting board. When attempting to fix or implant a large number of such small conductor pins with different shapes on a board that makes up an electronic component mounting board, they must be supported in a predetermined arrangement by some method. The pin pallet to which the present invention is directed is used in such cases.

Conventional pallets of this type include, for example, when using two types of conductor pins, a first pallet into which both types can be inserted, and a second pallet into which only the different types of conductor pins can be inserted. and a third pallet were used. In other words, first insert the corresponding conductor pins into the second and third pallets, and then reinsert the necessary number of different types of conductor pins inserted into the second and third pallets into the first pallet. It was not until the first pallet was used again that preparations for forming a predetermined electronic component mounting board were completed. Alternatively, the necessary number of conductor pins inserted into the second and third pallets are taken out and directly fixed or implanted on the board.

However, there are many different types of electronic component mounting boards, and this can be a major inconvenience, especially in recent years when the life cycle of products on which these types of electronic component mounting boards are used (mounted) is short. It has become. That is, it is physically impossible and not easy to prepare pallets corresponding to individual boards for electronic component WRA, which have various types of IIA and short life cycles.

(Problems to be Solved by the Invention) The present invention has been made in view of the above-mentioned circumstances, and the problem to be solved is that the conventional pin pallet of this type is It is inconvenient and wasteful to have to prepare according to the type of equipment.

The purpose of the present invention is to
An object of the present invention is to provide a pallet with excellent versatility that can be easily adapted to any RJ11 board without changing its basic configuration even if the board has various configurations.

(Means for Solving the Problems) In order to solve the above problems, the means taken by the first invention will be explained with reference to FIGS. 1 to 3 corresponding to the embodiments. "Many holes (11) for inserting conductor pins (72) (73) attached to the electronic component mounting board (70) (
12) with a main pallet (10) and this main pallet)
(10) Consists of a sub-pallet (20) positioned above.

When this sub-pallet (20) is placed on the main pallet (10), only some of the holes of the main pallet (lO) pass through the selection holes (22) formed in the sub-pallet (20) and connect the conductor pins (72). ``Palette for pins'' characterized by being able to insert pins.

That is, in the pallet according to the first invention, a sub-pallet (20) integrally configured with a selection plate (21) corresponding to the product is arranged on the main pallet (lO), and the sub-pallet (20) Insert the conductor pin (72) into the selection hole (22) formed in the selection plate (21) of will be brought in in the next process. By following this order and method, different types of conductor pins (
72) and (73) can be selectively and reliably inserted into the required position.

Further, the pin pallet according to the second invention will be explained with reference to FIGS. 2 and 4 to 6, which correspond to embodiments.

"Many holes (4 holes) for inserting conductor pins (72) (7:l) attached to the electronic component mounting board (70)
(50a) a main pallet (40) having (Sla);
A sub-pallet (20) positioned on this main pallet (40), and an inner cylinder (5G) having center holes (50a) and (51a) inserted into some holes of the main pallet (40).
It consists of (51).

When this sub-pallet (20) is placed on the main pallet (40) Jlm, the holes (43) (50) of the main pallet (40)
a) Only a part of (51a) is connected to the sub-pallet (20)
The conductor pin (72) can be inserted through the selection hole (22) formed in the inner cylinder (50) (51).
is inserted into the hole (44) so that it can be attached and removed freely, and the center hole shape of the inner cylinder (50) (51) is inserted into the main pallet (4).
0) A pin pallet characterized by having a large hole shape that is the same as or different from the hole shape of 0).

That is, the pin pallet according to the second invention has a selection plate (21) corresponding to the product on the main pallet (40).
by arranging a sub-pallet (20) that is integrally configured with
Insert the conductor pin (72) into the selection hole (22) formed in the selection plate (21) of this sub-pallet (20), then remove the sub-pallet (20) from above the main pallet (40), By carrying in the other conductor pins (73) in the next process in this order and method, the conductor pins (72) (73) of different Sa can be selectively and reliably inserted into the required positions. That is.

(Actions of the Invention) By adopting the above-described measures, the first and second inventions have the following effects.

First, regarding the pallet according to the first invention, FIGS.
As shown in FIGS. 3 and 7, the conductor pin (72) (
When inserting the main pallet (10) into the main pallet (10), the sub pallet (20) is placed on top of the main pallet (10). This sub-palette (20
) has a selection hole (22) formed in the selection plate (21) for the conductor pin (72) required in the electronic component mounting board (70). 2
2), the position of the conductor pin (72) to be inserted first is determined mechanically. In addition, the 6 holes of the main pallet (10) corresponding to the conductor pins (7) are connected to the selection plate (2) of this sub pallet (20).
If the sub pallet (20) is placed on top of the main pallet (10) as shown in 0 or more hidden by I), only the conductor pins (72) can be inserted securely into the required locations on the main pallet (lO). Therefore, by transporting the pallet into the standard pin insertion device shown in Fig. 8,
Only the conductor pin (72) is inserted into the required position of the main valve (10). In addition.

A standard pin insertion device, for example, inserts a large number of conductor pins (
72), thereby inserting only the conductor pins (72) into the required locations of the main pallet (1G). Therefore, in this pallet, the selection hole (22) of the selection plate (21) in the sub-pallet (20) is simply
By changing the arrangement, it is possible to make it compatible with various types of large substrates 70) for electronic components GA.

Next, when the sub pallet (20) is removed from the main pallet (10), a hole in the main pallet (10) in which the conductor pin (72) is not inserted will be opened, so the conductor pin (72) will be inserted only into this hole. ) is a different type of conductor pin (73).

For example, the standoff pin insertion device shown in FIG. 8 is used to insert the standoff pin. In this case, since the number of conductor pins (73) is usually small (four in this example), the conductor pins (73) can be easily inserted into the corresponding holes of the main pallet (]0). Conductor pins (72) (73) are inserted into each hole of the main pallet (10) of the pallet according to the present invention in an arrangement corresponding to the electronic component mounting board (70). ) is inserted.

Further, in the pallet according to the second invention shown in FIG. 4, the six holes formed in the main pallet (40) are in a grid pattern, so that the pallet according to the first invention described above has Not only does it have the same effect as the main pallet (lG), but it is even more versatile and can fully function as a so-called universal type.

That is, for this palette, its main palette (
Inner cylinders (50) and (51) shown in FIG. 5 are inserted into selected holes among the holes of lO) according to the aspect of the electronic component mounting board (70). In other words, these inner cylinders (
5G) (51) can be moved in and out of the hole in the main pallet (10), and the insertion position of this inner cylinder (so) (51) can be changed depending on the form of the electronic component mounting board (70). By doing so, it becomes possible to deal with any type of electronic component mounting board (70). The function of the sub-pallet (20) in this case is the same as that of the first invention.

Below, each invention will be described in detail based on embodiments shown in the drawings.

(Example) First, before describing the examples according to each invention, the conductor pins (72) and (73) to be fixed or implanted on the electronic component mounting board (70) will be described. The conductor pins targeted by each invention are No. 3115i1. As shown in FIGS. 6 and 7, there are two types of conductor pins (72) and conductor pins (7 pieces). That is, the conductor pin (72) has a head that is inserted into a through hole formed in the board (71) of the electronic component mounting board (70), and a conductor pin (72) that is
2) with respect to the board (71), and a support part that protrudes long when the conductor pin (72) is attached to the board (71) at its 111 part. These are integrally formed by processing a metal wire that allows electrical conduction. on the other hand,
The conductor pin (73) is similar to the conductor pin (72) described above except that it has two crocodile parts. In the following description, the conductor pin (72) may be referred to as a standard pin, and the conductor pin (73) may be referred to as a standoff pin.

FIG. 1 shows a perspective view of a main pallet (1G) constituting the pallet according to the first invention. This main pallet (lO) is formed with standard pin holes (11), standoff pin holes (12), and positioning pins (13,) for relative positioning with the sub pallet (zO). There is. As shown in FIG. 3, the standard pin hole (11) is simply a straight hole into which only the support portion of the conductor pin (72) can be inserted.

The conductor pin (72) is inserted into this standard pin hole (11) at its support portion, and is supported at the upper part of the standard pin hole (11) at its flange portion. On the other hand, the standoff pin hole (12) has a step formed at its upper part, and the lower flange of the conductor pin (73) is supported by this step.

J, when the conductor pins (72) and conductor pins (7) are inserted into these standard pin holes (11) and standoff pin holes (12), each conductor pin (7)
2) and the heads of the conductor pins (7 pieces) are arranged to be in the same position.

The sub-pallet (20) positioned on the main pallet (10) has selection holes (22) corresponding to the standard pin holes (11) of the main pallet (lO), as shown in FIGS. ) is formed on the selection plate (21), and the main pallet (10) has a standoff pin hole (
No hole corresponding to 12) is formed. In other words, this sub-palette (20) is replaced by the main pallet (l
O) When positioned on the main pallet (10), the standard pin holes (11) of the main pallet (10) open upward, but the standoff pin holes (12) of the main pallet (10) It is covered by the selection plate (21). The selection board (2) of this sub-palette (20)
1) is a board for mounting electronic components (7) as shown in Figure 7.
0), each selection hole (22) is formed in advance.

The relationship between the main pallet (10) and the sub-palette (20) configured as described above will be explained in detail with reference to FIG. 3. This figure 3 shows the secondary palette (1O) on the main palette (1O).
20) is positioned, the main pallet (10) and the sub pallet (20) are combined in this way to produce, for example, an automatic manufacturing apparatus for electronic component mounting boards as shown in FIG. A plurality of sets are successively conveyed through the pin insertion device.

Insert this pin! While the pallet is being transported through the storage facility, vibrations are applied to the pallet and air is sucked in from below, which causes the pallet to move inside the standard pin holes (11) that open upward. Only when the conductor pin (72), ie, the standard pin, is attracted and inserted. The standoff pin hole (12) of the main pallet (lO) is connected to the selection plate (2) of the sub-pallet (20).
This is because it is covered by 1).

As mentioned above, after the conductor pin (72) (standard pin) is inserted into the standard pin hole (11),
The secondary pallet (20) is removed from the main pallet (lO),
Each standoff pin hole (12) of the main pallet (lO) is open. Each open standoff pin hole (1
2), a conductor pin (73) is inserted therein by, for example, a standoff pin insertion device shown in FIG. In this way, the main pallet (lO) in which the conductor pin (72) and the conductor pin (73) are inserted into the standard pin hole (11) and standoff pin hole (12), respectively, is processed in a separate process. The board (71) constituting the electronic component mounting board (70) is pressed from above, and each conductor pin (72) and conductor pins (7 pieces) are attached to this board (71).
is inserted into the head.

Next, a pallet according to the second invention will be explained with reference to FIGS. 2 and 4 to 6. In the pallet according to the second invention, the sub-pallet (20
) is used, and the structure of the main pallet (40) on which this sub-pallet (20) is placed is different from the main pallet (10) according to the first invention.

That is, as shown in FIG. 4, this main pallet (40) is constructed by attaching a support plate (41) to a frame (42), and the support plate (41) of this main pallet (40) 41) has standard pin holes (43) provided in a grid pattern into which conductor pins (72) (standard pins) are inserted, and larger inner cylinders for standard pins (50) or standoff pins. An inner cylinder hole (44) into which the inner cylinder (5) is inserted is formed.

In other words, each inner cylinder hole (44) can be selectively inserted into either the standard pin inner cylinder (50) or the standoff pin inner cylinder (51).
As shown in FIG. 6, the present invention can be applied to any type of electronic component mounting board (70).

The inner cylinder for standard pins (50) and the inner cylinder for standoff pins (51) are shown enlarged in FIG.
In the center of each is an inner cylinder hole for a standard pin (50a
) and a standoff pin inner cylinder hole (51a) are formed, so that the standard pin inner cylinder (50) or the standoff pin inner cylinder (51) is connected to the inner cylinder hole (44).
By inserting the conductor pin (7
2) or the conductor pin (73) is determined.

The main pallet (40) and sub-pallet (20
) The method of inserting the conductor pins (72) and (73) into the pallet according to the first invention described above is the same as the method for inserting the conductor pins (72) and (73) into the pallet according to the first invention, but the pallet according to the second invention has a method in which each standard pin hole ( A large number of standard pin inner cylinders (50) are formed in each inner cylinder hole (44).
) or by selectively inserting the standoff pin inner cylinder (51), it is possible to sufficiently cope with the case where the type of electronic component mounting board (70) is changed. That is, the inner cylinder hole (4) of the main pallet (40)
4) A selection board for selecting the standard pin inner cylinder (50) or standoff pin inner cylinder (51) to be inserted into the main pallet (40), and the selection board for the sub pallet (20) to be placed on the main pallet (40). By appropriately selecting (21), it is possible to support any type of electronic component mounting board (70).

(Effects of the Invention) As detailed above, the pallet according to the first invention has [a large number of conductor pins (72) and (73) for inserting the conductor pins (72) and (73) attached to the electronic component mounting board (70). Hole (11) (
12), and a sub-pallet (20) positioned on this main pallet (lO).

When this sub-pallet (20) is placed on the main pallet (lO), only some of the holes of the main pallet (10) pass through the selection holes (22) formed in the sub-pallet (20) and connect the conductor pins (72). The feature of the structure lies in the fact that it is possible to insert the pin pallet, which can accommodate different types of electronic component mounting boards (70) with a simple structure. It can be done. Further, in the pin pallet according to the second invention, "a large number of holes (43) (for inserting conductor pins (72) (73) attached to the electronic component mounting board (70)) (
50a) (51a) and a secondary pallet (40) positioned on this main pallet (40).
20) and an inner cylinder (5G) (
51).

When this sub-pallet (20) is placed on the main pallet (40), the hole (43) (SOa) of the main pallet (40)
(51a) so that the conductor pin (72) can be inserted through the selection hole (22) formed in the sub-pallet (20), and the inner cylinder (50) (51) is inserted into the hole (44). ) into the main pallet (4o
) is characterized by the hole shape being the same as or different from the hole shape of the first invention. Of course, it is possible to provide an even more versatile pin pallet.

Moreover, each pallet according to the first and second inventions.

Select electronic component #? on the selection board (21) of the sub-palette (20). i
The pallet only needs to be prepared for each service board (70), making it an extremely economical and versatile pallet.

[Brief explanation of the drawing]

Figure 1 is a perspective view of the main pallet in the pin pallet according to the first invention, Figure 2 is a perspective view of the same pallet, and Figure 3 is a perspective view of the main pallet.
The figure is a partially enlarged longitudinal cross-sectional view showing the state in which the main pallet and the sub-pallet are combined and the relationship with the conductor pins inserted into the pin pallet constructed in this manner. 4 to 6 are views showing a pin pallet according to the second invention, FIG. 4 is a perspective view of the main pallet having holes for the inner cylinder, and FIG. 5 is a perspective view of the main pallet shown in FIG. 4. An enlarged perspective view of the two types of inner cylinders inserted into the inner cylinder holes of the main pallet, and Figure 6 shows the relationship with the conductor pins to be inserted into the pin pallet for mounting electronic components formed by the pin pallet. FIG. 1 is a perspective view of an automatic substrate manufacturing apparatus. Explanation of code 1O...Main pallet, 11--Standard pin hole,
12-...Standoff pin hole, l...Positioning pin. 20...Sub-palette, 21-...Selection board, 22...
Selection hole, 40...Main pallet, 41...Support plate,
42--Frame body, 4 pieces...Standard pin hole, 44
-... Hole for inner cylinder, 50... Inner cylinder for standard pin,
50a - Inner cylinder hole for standard pin, St - - Inner cylinder for standoff pin, 51a - Inner cylinder hole for standoff pin, 7◎ - Board for mounting electronic components, 71 - -...
Board, 72--conductor pin, 73--conductor pin.

Claims (1)

[Claims] 1) Consisting of a main pallet having a number of holes for inserting conductor pins attached to an electronic component mounting board, and a sub-pallet positioned on the main pallet; A pin pallet characterized in that, when placed on the main pallet, only some of the holes in the main pallet allow the conductor pins to be inserted through selective holes formed in the sub pallet. 2) The pin pallet according to claim 1, wherein the holes of the main pallet are formed in a grid pattern. 3) Among the holes of the main pallet, the diameter of the hole into which the conductor pin is not inserted by the sub pallet is made larger than the diameter of the hole of the other main pallet. The pin pallet described in paragraph 2. 4) A main pallet having a number of holes for inserting conductor pins attached to an electronic component mounting board, a sub pallet positioned on the main pallet, and a sub pallet inserted into some of the holes of the main pallet. and an inner cylinder having a center hole, and when this sub-pallet is placed on the main pallet, only some of the holes in the main pallet allow the conductor pins to be inserted through selective holes formed in the sub-pallet. In addition, the inner cylinder is inserted into the hole of the main pallet so as to be attachable and detachable, and the center hole shape of the inner cylinder is the same as or different from the hole shape of the main pallet. Features a pin pallet. 5) The pin pallet according to claim 4, wherein the inner cylinder is arranged diagonally of the main pallet.